The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- ECCN Code:
3A001.A.2.C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Weight | Shape | Package Cooled | Material Finish | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | RAM Size | Propagation Delay | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Thermal Resistance @ Natural | Power Dissipation @ Temperature Rise | Diameter | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No A54SX32A-1FGG256M | Microchip Technology | Datasheet | 717 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX32 | 278 MHz | 90 | MICROSEMI CORP | A54SX32A-1FGG256M | 278 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 203 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | -55°C ~ 125°C (TC) | Tray | A54SX32A | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,2.5/5 V | MILITARY | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX72A-1FGG484M | Microchip Technology | Datasheet | 583 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (27X27) | 484 | A54SX72 | 250 MHz | 40 | MICROSEMI CORP | A54SX72A-1FGG484M | 250 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 360 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | -55°C ~ 125°C (TC) | Tray | A54SX72A | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 360 | Not Qualified | 2.5 V | 2.5,3.3/5 V | MILITARY | 360 | 6036 CLBS, 108000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010T-1FG484M | Microchip Technology | Datasheet | 2039 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL010 | 60 | MICROSEMI CORP | M2GL010T-1FG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 233 I/O | 12084 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.761080 oz | -55°C ~ 125°C (TJ) | Tray | M2GL010T | 3A001.A.2.C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | MILITARY | 667 Mb/s | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 4 Transceiver | 12084 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025TS-1FGG484M | Microchip Technology | Datasheet | 1970 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL025 | 60 | MICROSEMI CORP | M2GL025TS-1FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 267 I/O | 27696 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -55°C ~ 125°C (TJ) | Tray | M2GL025TS | 3A001.A.2.C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | MILITARY | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | 4 Transceiver | 27696 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX16P-1TQG144M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 280 MHz | MICROSEMI CORP | A54SX16P-1TQG144M | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 40 | 5.81 | Yes | 3.6 V | 3 V | 3.3 V | e3 | 3A001.A.2.C | MATTE TIN | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G144 | Not Qualified | MILITARY | 1452 CLBS, 16000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.8 ns | 1452 | 16000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32-1TQG144M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 144-TQFP (20x20) | 144 | A54SX32 | 280 MHz | MICROSEMI CORP | A54SX32-1TQG144M | Microchip Technology | 3 | 113 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Yes | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | SX | e3 | 3A001.A.2.C | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | Not Qualified | 3.3,5 V | MILITARY | 113 | 2880 CLBS, 32000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 0.8 ns | 2880 | 2880 | 32000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX16-1CQ256B | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 240 MHz | MICROSEMI CORP | A54SX16-1CQ256B | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK256,3SQ,20 | TPAK256,3SQ,20 | SQUARE | FLATPACK | Obsolete | 20 | 5.27 | No | 3.63 V | 2.97 V | 3.3 V | Military grade | e0 | 3A001.A.2.C | TIN LEAD | 24000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | QUAD | FLAT | 225 | 0.5 mm | compliant | S-CQFP-F256 | 172 | Not Qualified | 3.3,5 V | MILITARY | 172 | 1452 CLBS, 16000 GATES | 3.06 mm | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | 0.9 ns | 1452 | 1452 | 16000 | 36 mm | 36 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX16-CQ208B | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 205 MHz | MICROSEMI CORP | A54SX16-CQ208B | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QFF | CERAMIC, QFP-208 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Obsolete | 20 | 7.84 | No | 3.63 V | 2.97 V | 3.3 V | Military grade | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 24000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | QUAD | FLAT | 225 | 0.5 mm | compliant | S-CQFP-F208 | 172 | Not Qualified | 3.3,5 V | MILITARY | 172 | 1452 CLBS, 16000 GATES | 3.06 mm | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | 1 ns | 1452 | 1452 | 16000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-PQ240M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 240 | 240 | 73 MHz | MICROSEMI CORP | A42MX36-PQ240M | 3 | 202 | 125 °C | -55 °C | PLASTIC/EPOXY | FQFP | PLASTIC, QFP-240 | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | 30 | 5.79 | Compliant | No | 3.6 V | 3 V | 3.3 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | QUAD | GULL WING | 225 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 202 | Not Qualified | 5 V | 3.3,3.3/5,5 V | MILITARY | 5.5 V | 3 V | 320 B | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 54000 | 131 MHz | 1184 | 1822 | 2.7 ns | 2438 | 2414 | 54000 | 3.4 mm | 32.1 mm | 32.1 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX2000-CQ256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-BFCQFP with Tie Bar | YES | 256 | 256-CQFP (75x75) | 10.567001 g | 256 | AX2000 | 649 MHz | MICROSEMI CORP | AX2000-CQ256M | Microchip Technology | 136 | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK256,3SQ,20 | TPAK256,3SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.575 V | 1.425 V | 1.5 V | Military grade | -55°C ~ 125°C (TA) | Axcelerator | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F256 | 136 | Not Qualified | 1.5 V | 1.5,1.5/3.3,3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 990 ps | 136 | 21504 CLBS, 2000000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 2.8 mm | 36 mm | 36 mm | No | |||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-PL44M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | A40MX04 | 80 MHz | MICROSEMI CORP | A40MX04-PL44M | Microchip Technology | 3 | 34 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.23 | No | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 44 | S-PQCC-J44 | Not Qualified | MILITARY | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2.7 ns | 547 | 6000 | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150T-1FC1152M | Microchip | Datasheet | 192 | - | Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | Microsemi Corporation | M2GL150T-1FC1152M | Microchip Technology | 574 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | IGLOO2 | 3A001.A.2.C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | MILITARY | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX09-PQ100M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-BQFP | YES | 100-PQFP (20x14) | 100 | A42MX09 | 117 MHz | MICROSEMI CORP | Microsemi Corporation | A42MX09-PQ100M | Microchip Technology | 3 | 83 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | Obsolete | 30 | 5.23 | No | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 225 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | MILITARY | 684 CLBS, 14000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 2.5 ns | 684 | 14000 | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600L-1FG484M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | Aluminum | Square, Fins | Assorted (BGA, LGA, CPU, ASIC...) | Blue Anodized | 484 | A3PE600 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE600L-1FG484M | Microchip Technology | 3 | 270 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | No | 1.575 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | pushPIN™ | e0 | Active | 3A001.A.2.C | Top Mount | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 270 | Not Qualified | 1.2/1.5,1.2/3.3 V | MILITARY | Push Pin | 0.590 (15.00mm) | 16.48°C/W @ 100 LFM | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | 13824 | 600000 | -- | -- | -- | 1.575 (40.00mm) | 1.575 (40.00mm) | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1460A-1PG207M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | NO | 207 | 125 MHz | MICROSEMI CORP | ABB | ACH580-BCR-124A-4+J429+L501 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | HPGA | HERMETIC SEALED, CERAMIC, PGA-207 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Obsolete | NOT SPECIFIED | 5.85 | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | TIN LEAD | MAX 168 I/OS | 8542.39.00.01 | CMOS | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 2.54 mm | compliant | S-CPGA-P207 | Not Qualified | MILITARY | 848 CLBS, 6000 GATES | 9.4234 mm | FIELD PROGRAMMABLE GATE ARRAY | 2.6 ns | 848 | 6000 | 44.958 mm | 44.958 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1280A-1PQ160M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 160 | 160 | MICROSEMI CORP | Microsemi Corporation | A1280A-1PQ160M | 3 | 125 | 125 °C | -55 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | 30 | 5.79 | Non-Compliant | No | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 8542.39.00.01 | CMOS | QUAD | GULL WING | 225 | 0.65 mm | compliant | 90 MHz | S-PQFP-G160 | Not Qualified | 5 V | MILITARY | 5.5 V | 4.5 V | 4.3 ns | 1232 CLBS, 8000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1232 | 8000 | 1232 | 1 | 998 | 1232 | 8000 | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX16A-1TQ100M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-LQFP | YES | 100-TQFP (14x14) | 100 | A54SX16A | 263 MHz | MICROSEMI CORP | Miscellaneous | A54SX16A-1TQ100M | Microchip Technology | 3 | 81 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | No | 2.75 V | 2.25 V | 2.5 V | -55°C ~ 125°C (TC) | SX-A | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 16000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | 81 | Not Qualified | 2.5,3.3/5 V | MILITARY | 81 | 1452 CLBS, 24000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 1452 | 1.2 ns | 1452 | 1452 | 24000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-1PQ208M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A42MX36 | 83 MHz | MICROSEMI CORP | Microsemi Corporation | A42MX36-1PQ208M | Microchip Technology | 3 | 176 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | PLASTIC, QFP-208 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | Obsolete | 30 | 5.23 | Compliant | No | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | MX | 3A001.A.2.C | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | 5 V | MILITARY | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 151 MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 2414 | 54000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-1BGG729M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 729-BBGA | YES | 729 | 729-PBGA (35x35) | 729 | AX1000 | 763 MHz | MICROSEMI CORP | Microsemi Corporation | AX1000-1BGG729M | Microchip Technology | 3 | 516 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA729,27X27,50 | BGA729,27X27,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | Military grade | -55°C ~ 125°C (TA) | Axcelerator | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B729 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1e+06 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 35 mm | 35 mm | No | |||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-PQ208M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | M1A3P1000 | 350 MHz | MICROSEMI CORP | M1A3P1000-PQ208M | Microchip Technology | 3 | 154 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.24 | No | 1.575 V | 1.425 V | 1.5 V | -55°C ~ 125°C (TJ) | ProASIC3 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | Not Qualified | 1.5,1.5/3.3 V | MILITARY | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 28 mm | 28 mm |
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Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire