The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- ECCN Code:
3A001.A.2.C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Approvals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Load Capacitance | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Output Level | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No AX1000-FGG676M | Microchip Technology | Datasheet | 722 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 649 MHz | 40 | MICROSEMI CORP | AX1000-FGG676M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 418 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||
![]() | Mfr Part No A42MX16-1PQG208M | Microchip Technology | Datasheet | 438 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A42MX16 | 108 MHz | 24 | MICROSEMI CORP | A42MX16-1PQG208M | 198 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 140 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.28 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A42MX16 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 3.3 V, 5 V | MILITARY | 1232 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 2.4 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A40MX02-VQG80M | Microchip Technology | Datasheet | 2307 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 80-VQFP (14x14) | 80 | A40MX02 | 80 MHz | 90 | MICROSEMI CORP | A40MX02-VQG80M | 139 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 57 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | TQFP | TQFP, | SQUARE | FLATPACK, THIN PROFILE | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A40MX02 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.65 mm | compliant | S-PQFP-G80 | Not Qualified | 3.3 V, 5 V | MILITARY | 295 CLBS, 3000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2.7 ns | 295 | 3000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-1FGG676M | Microchip Technology | Datasheet | 526 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 763 MHz | 40 | MICROSEMI CORP | AX1000-1FGG676M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 418 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||
![]() | Mfr Part No AX1000-1FGG484M | Microchip Technology | Datasheet | 668 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 763 MHz | 60 | MICROSEMI CORP | AX1000-1FGG484M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 317 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||
![]() | Mfr Part No A3P1000-FG144M | Microchip Technology | Datasheet | 2169 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-FG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 1.48 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | unknown | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | - | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | - | 24576 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-FG484M | Microchip Technology | Datasheet | 692 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 60 | MICROSEMI CORP | A3PE3000L-FG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-1FGG896M | Microchip Technology | Datasheet | 2016 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | 27 | MICROSEMI CORP | A3PE3000L-1FGG896M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 620 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 25 mA | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 350 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE3000L-1FG484M | Microchip Technology | Datasheet | 699 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-1FG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | not_compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000-FGG144M | Microchip Technology | Datasheet | 2255 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-FGG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3P1000 | e1 | 3A001.A.2.C | TIN SILVER COPPER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-1FG484M | Microchip Technology | Datasheet | 591 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | A3PE3000L-1FG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 35000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | FPGA - Field Programmable Gate Array ProASIC3 Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | - | 75264 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | No | Contains Lead | ||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX16P-1TQ144M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 280 MHz | MICROSEMI CORP | A54SX16P-1TQ144M | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 30 | 5.85 | No | 3.6 V | 3 V | 3.3 V | e0 | 3A001.A.2.C | TIN LEAD | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G144 | Not Qualified | MILITARY | 1452 CLBS, 16000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.8 ns | 1452 | 16000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A40MX02-PL44M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | A40MX02 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A40MX02-PL44M | Microchip Technology | 3 | Surface Mount | 34 | 125 °C | -55 °C | 40 MHz | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.23 | No | SMD | 3.6 V | 3 V | 3.3 V | -10 to 60 °C | MX | e0 | 3A001.A.2.C | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 4 | S-PQCC-J44 | Not Qualified | MILITARY | 10 pF | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2.7 ns | 295 | 3000 | Clipped Sinewave | 16.5862 mm | 16.5862 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A1425A-1CQ132M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 132 | 132 | CSA, UL | 150 MHz | MICROSEMI CORP | Bussmann | BSPA200120N5P | Wall | 100 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | HERMETIC SEALED, CERAMIC, QFP-132 | TPAK132,2.5SQ,25 | SQUARE | FLATPACK, GUARD RING | Obsolete | 30 | 5.85 | Yes | No | 8542390000/8542390000/8542390000/8542390000/8542390000 | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 6250 PLD EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | FLAT | 225 | 0.635 mm | not_compliant | 150 MHz | S-CQFP-F132 | 100 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | 2.6 ns | 100 | 310 CLBS, 2500 GATES | 2.9464 mm | FIELD PROGRAMMABLE GATE ARRAY | 310 | 2500 | 310 | 2.6 ns | 310 | 310 | 2500 | 24.13 mm | 24.13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX16-1CQ208M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 240 MHz | MICROSEMI CORP | Microsemi Corporation | A54SX16-1CQ208M | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Obsolete | 20 | 5.25 | No | 3.63 V | 2.97 V | 3.3 V | e0 | 3A001.A.2.C | TIN LEAD | 24000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | S-CQFP-F208 | 172 | Not Qualified | 3.3,5 V | MILITARY | 172 | 1452 CLBS, 16000 GATES | 3.06 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.9 ns | 1452 | 1452 | 16000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-CQ352M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 1 month ago) | Surface Mount | YES | 352 | 352 | 180 MHz | MICROSEMI CORP | Microsemi Corporation | APA1000-CQ352M | 248 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | 1.05 MM PITCH, CERAMIC, QFP-208 | TPAK352,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Obsolete | 20 | 5.6 | Compliant | No | 2.7 V | 2.3 V | 2.5 V | Military grade | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | FLAT | 225 | 0.5 mm | unknown | 180 MHz | S-CQFP-F352 | 248 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 2.7 V | 2.3 V | 24.8 kB | 248 | 1000000 GATES | 2.89 mm | FIELD PROGRAMMABLE GATE ARRAY | 1e+06 | MIL-STD-883 Class B | 56320 | 56320 | 1000000 | 48 mm | 48 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-CQ352M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 352-BFCQFP with Tie Bar | YES | 352 | 352-CQFP (75x75) | 10.567001 g | 352 | CE, CSA, UL | AX1000 | 649 MHz | MICROSEMI CORP | Cutler Hammer, Div of Eaton Co | PDG34G0125E3XK | Microchip Technology | Panel | 198 | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK352,2.9SQ,20 | TPAK352,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.3 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | Military grade | -55°C ~ 125°C (TA) | Axcelerator | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | QUAD | FLAT | 225 | 0.5 mm | unknown | 125 A | 649 MHz | S-CQFP-F352 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.89 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1e+06 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 2.66 mm | 48 mm | 48 mm | No | |||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32-PQ208M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 208-BFQFP | YES | 208 | 208-PQFP (28x28) | 208 | A54SX32 | 240 MHz | MICROSEMI CORP | Miscellaneous | T507117064AB | Microchip Technology | 3 | 174 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | PLASTIC, MO-143, QFP-208 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | Compliant | No | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | SX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 225 | 0.5 mm | unknown | 240 MHz | S-PQFP-G208 | Not Qualified | 5 V | MILITARY | 5.5 V | 4.5 V | 900 ps | 900 ps | 2880 CLBS, 32000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 2880 | 48000 | 240 MHz | 2880 | 2880 | 1080 | 0.9 ns | 2880 | 2880 | 32000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX09-PL84M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 84-LCC (J-Lead) | YES | 84-PLCC (29.31x29.31) | 84 | A42MX09 | 117 MHz | MICROSEMI CORP | Microsemi Corporation | A42MX09-PL84M | Microchip Technology | 3 | 72 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.21 | No | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 84 | S-PQCC-J84 | Not Qualified | MILITARY | 684 CLBS, 14000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 2.5 ns | 684 | 14000 | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A1240A-1PQG144M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 144 | 144 | MICROSEMI CORP | Microsemi Corporation | A1240A-1PQG144M | 3 | 104 | 125 °C | -55 °C | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | 40 | 5.74 | Compliant | Yes | 5.5 V | 4.5 V | 5 V | e3 | 3A001.A.2.C | MATTE TIN | 125 °C | -55 °C | 8542.39.00.01 | CMOS | QUAD | GULL WING | 245 | 0.65 mm | compliant | 110 MHz | S-PQFP-G144 | Not Qualified | 5 V | MILITARY | 5.5 V | 4.5 V | 4.3 ns | 684 CLBS, 4000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 684 | 4000 | 684 | 1 | 568 | 684 | 4000 | 28 mm | 28 mm | No |
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Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
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Package:Embedded - FPGAs (Field Programmable Gate Array)
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Package:Embedded - FPGAs (Field Programmable Gate Array)
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