The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Mfr
- Mounting Type
- Operating Temperature
- Series
- Package
- Package / Case
- Product Status
- Supplier Device Package
- Number of I/Os
- Number of Logic Elements/Cells
- Total RAM Bits
- Voltage - Supply
- Operating Temperature:
-40°C ~ 100°C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Number of Terminals | Base Product Number | Contact Materials | Current Transfer Ratio-Min | Current-IEC | Current-UL | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Torque-Screw | Tradename | Voltage-IEC | Voltage-Output 1 | Voltage-UL | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Applications | Power (Watts) | HTS Code | Subcategory | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Insulation Height | Reach Compliance Code | Base Part Number | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Approval Agency | Efficiency | Voltage - Isolation | Voltage - Input (Max) | Output Type | Operating Supply Voltage | Voltage - Input (Min) | Power Supplies | Temperature Grade | Number of Channels | Contact Tail Length | Memory Size | Operating Supply Current | Current - Output (Max) | Number of Levels | RAM Size | Voltage - Forward (Vf) (Typ) | Input Type | Contact Mating Finish | Voltage - Output 2 | Data Rate | Wire Gauge or Range - AWG | Number of Inputs | Organization | Positions Per Level | Seated Height-Max | Programmable Logic Type | Plug Wire Entry | Header Orientation | Number of Logic Elements/Cells | Wire Gauge or Range - mm² | Wire Strip Length | Voltage - Output 3 | Total RAM Bits | Rise / Fall Time (Typ) | Current - Output / Channel | Screw Size | Number of Gates | Voltage - Output (Max) | Voltage - Output 4 | Number of LABs/CLBs | Current - DC Forward (If) (Max) | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Transceivers | Current Transfer Ratio (Max) | Turn On / Turn Off Time (Typ) | Number of CLBs | Number of Logic Cells | Vce Saturation (Max) | Number of GPIO | Features | Length | Width | Material Flammability Rating | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No M2GL090-1FG484I | Microchip Technology | Datasheet | 2265 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M2GL090 | 60 | MICROSEMI CORP | M2GL090-1FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86184 LE | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.29 | N | No | 8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C | Tray | M2GL090 | e0 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 323.3 kB | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 1 | 86316 | 23 mm | 23 mm | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC4VFX140-10FF1704C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 9-DIP Module | Half Brick | TDK-Lambda Americas Inc | Bulk | Obsolete | 28V | -40°C ~ 100°C | PAH (50W) | 2.40 L x 2.28 W x 0.50 H (61.0mm x 57.9mm x 12.7mm) | Isolated Module | ITE (Commercial) | 50 W | 1 | CE, cUR, UR | 88% | 1.5 kV | 76V | 36V | 1.8A | - | - | - | Remote On/Off, OCP, OTP, OVP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2018-50PG84B 5962-88 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Polyamide (PA), Nylon | Copper Alloy | 12A | 16 A | Phoenix Contact | Bulk | Active | - | 320 V | 300 V | -40°C ~ 100°C | COMBICON PST | Header, Male Pins, Unshrouded | 4 | Orange | 0.138 (3.50mm) | - | - | Solder | 0.138 (3.50mm) | 1 | Tin | - | 4 | - | Vertical | - | - | - | - | UL94 V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7VX690T-1FF1157I | AMD | Datasheet | 349 | - | Min: 1 Mult: 1 | Surface Mount | 1156-BBGA, FCBGA | 1157-FCBGA (35x35) | XC7VX690 | AMD | 600 | Tray | Active | -40°C ~ 100°C | Virtex®-7 XT | 0.97V ~ 1.03V | 693120 | 54190080 | 54150 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5SGXMA7K3F40C2LN | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 6-SMD, Gull Wing | YES | 1517 | 6-SMD | 1517 | 1000% @ 10mA | INTEL CORP | Lead free / RoHS Compliant | Intel Corporation | 5SGXMA7K3F40C2LN | Fairchild Semiconductor | 696 | 85 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | Active | 5.28 | Compliant | Yes | 0.88 V | 0.82 V | 0.85 V | -40°C ~ 100°C | - | Active | 3 (168 Hours) | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 0.82 V ~ 0.88 V | BOTTOM | BALL | 1 mm | compliant | 5SGXMA7 | S-PBGA-B1517 | 696 | Not Qualified | 4170Vrms | Darlington with Base | 880 mV | 0.85,1.5,2.5,2.5/3,1.2/3 V | OTHER | 1 | 7.1 MB | 1.3V | DC | 14.1 Gbps | 696 | 23472 CLBS | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 622000 | 59939840 | - | - | 100V | 234720 | 60 mA | 234720 | 2 | 36 | - | 5µs, 100µs | 23472 | 622000 | 1V | 696 | 40 mm | 40 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP1M350F780I6N | ALTERA | Datasheet | 477 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | INTEL CORP | Intel Corporation | EP1M350F780I6N | Altera | 3 | 486 | 486 | Bulk | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | Active | 40 | 5.28 | Non-Compliant | Yes | 1.89 V | 1.71 V | 1.8 V | -40°C ~ 100°C | Mercury | e1 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | CMOS | 1.71V ~ 1.89V | BOTTOM | BALL | 245 | 1 mm | compliant | S-PBGA-B780 | Not Qualified | 1.8 V | 14 kB | 60 mA | 14 kB | 0 DEDICATED INPUTS, 486 I/O | 3.5 mm | LOADABLE PLD | 14400 | 114688 | 350000 | 1440 | 1440 | MIXED | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LAV-AT-E30-3ASG324I | Lattice Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 324-BGA, WLCSP | 324-WLCSP (11x9) | Lattice Semiconductor Corporation | 208 | -40°C ~ 100°C | Tray | Avant?-E | Active | 0.82V | 196000 | 1740800 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7VX330T-2FF1157I | AMD | Datasheet | 521 | - | Min: 1 Mult: 1 | Surface Mount | 1156-BBGA, FCBGA | 1157-FCBGA (35x35) | XC7VX330 | AMD | 600 | Tray | Active | -40°C ~ 100°C | Virtex®-7 XT | 0.97V ~ 1.03V | 326400 | 27648000 | 25500 |
M2GL090-1FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC4VFX140-10FF1704C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC2018-50PG84B 5962-88
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC7VX690T-1FF1157I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
5SGXMA7K3F40C2LN
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EP1M350F780I6N
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
2,770.757176
LAV-AT-E30-3ASG324I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC7VX330T-2FF1157I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
