The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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-40°C ~ 105°C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Contact Shape | Supplier Device Package | Weight | Material - Insulation | Number of Terminals | Terminal Screw Material | Surface Mount Land Size | Base Product Number | Brand | Clock Frequency-Max | CoilResistance | Contact Finish Mating | Contact Length-Mating | Contact Materials | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Insulation Materials | Lead Free Status / RoHS Status | Lifetime @ Temp. | Manufacturer | Manufacturer Part Number | Mated Stacking Heights | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rated | Voltage-Output 1 | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Applications | Number of Rows | Additional Feature | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Insulation Height | Style | Number of Positions Loaded | Reach Compliance Code | Current Rating | Frequency | Pitch - Mating | Frequency Stability | Base Part Number | Insulation Color | Output | Pin Count | Termination Style | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Approval Agency | Row Spacing - Mating | Contact Length - Post | Shrouding | Contact Finish - Post | Efficiency | Voltage - Input (Max) | Output Type | Operating Supply Voltage | Voltage - Input (Min) | ESR (Equivalent Series Resistance) | Lead Spacing | Overall Contact Length | Power Supplies | Wire Gauge | Temperature Grade | Current - Supply (Disable) (Max) | Number of Circuits | Max Supply Voltage | Min Supply Voltage | Polarization | Current - Output (Max) | Impedance | RAM Size | Ripple Current @ Low Frequency | Ripple Current @ High Frequency | Propagation Delay | Spread Spectrum Bandwidth | Accuracy | Voltage - Output 2 | Data Rate | Contact Form | Number of Inputs | Organization | Terminal Block Type | Bottom Termination | Barrier Type | Top Termination | Seated Height-Max | Programmable Logic Type | Relay Type | Operating Pressure | Pressure Type | Port Style | Port Size | Number of Logic Elements/Cells | Product Type | Voltage - Output 3 | Operate Time | Coil Voltage | Coil Type | Switching Voltage | Coil Current | Terminal Screw Finish | Release Time | Total RAM Bits | Must Operate Voltage | Contact Rating (Current) | Number of Gates | Max Frequency | Voltage - Output 4 | Number of LABs/CLBs | Must Release Voltage | Maximum Pressure | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Wire Entries | Number of Transceivers | Absolute Pull Range (APR) | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Seal Rating | Number of CLBs | JTAG BST | Number of Logic Cells | Number of Dedicated Inputs | Number of GPIO | Coil Insulation | Number of Equivalent Gates | In-System Programmable | Features | Product Category | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating | Radiation Hardening | Lead Free | Ratings |
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 | Mfr Part No A3P060-1QNG132 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 100 Ohms | Silver Nickel (AgNi), Gold (Au) | American Zettler | Box | Active | -40°C ~ 105°C | AZ762H | PC Pin | SPDT (1 Form C) | General Purpose | 7 ms | 5VDC | Non Latching | 440VAC, 125VDC - Max | 50 mA | 3 ms | 3.75 VDC | 10 A | 0.5 VDC | Sealed - Fully | Class F | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C32-4CP56C | Xilinx | Datasheet | 166 | - | Min: 1 Mult: 1 | Through Hole, Right Angle | YES | Square | 56 | 043650 | Tin | - | Brass Alloy | XILINX INC | Liquid Crystal Polymer (LCP), Glass Filled | Xilinx | XC2C32-4CP56C | - | Molex | 3 | 33 | 70 °C | Bulk | PLASTIC/EPOXY | LFBGA | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | Active | 30 | 5.22 | No | 1.9 V | 1.7 V | 1.8 V | 600VAC/DC | -40°C ~ 105°C | Micro-Fit 3.0 43650 | e0 | Solder | Header | 3 | Tin/Lead (Sn63Pb37) | General Purpose, Medical, Military, Telecommunications | 1 | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | Locking Ramp | Programmable Logic Devices | Male Pin | Varies by Wire Gauge | CMOS | BOTTOM | BALL | 240 | - | 0.5 mm | 0.172 (4.37mm) | Board to Cable/Wire | 1 | not_compliant | 0.118 (3.00mm) | Black | 56 | S-PBGA-B56 | Not Qualified | - | 0.125 (3.18mm) | Shrouded - 4 Wall | Tin | - | 1.5/3.3,1.8 V | COMMERCIAL | 4 ns | 1 DEDICATED INPUTS, 33 I/O | 1.35 mm | FLASH PLD | MACROCELL | 32 | YES | 1 | YES | Board Lock | 6 mm | 6 mm | 60.0µin (1.52µm) | 60.0µin (1.52µm) | UL94 V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FWXP422BB | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | SG-8101 | EPSON | Tape & Reel (TR) | Active | -40°C ~ 105°C | SG-8101 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | XO (Standard) | 1.8V ~ 3.3V | 49.58 MHz | ±20ppm | CMOS | Enable/Disable | Crystal | 6.8mA (Typ) | 3.5mA | - | - | 0.051 (1.30mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7S25-1CSGA324I | AMD | Datasheet | 1838 | - | Min: 1 Mult: 1 | Surface Mount | 8-SMD, No Lead | 324-CSGA (15x15) | XC7S25 | Jauch Quartz | 150 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -40°C ~ 105°C | JTP75HCV | 0.276 L x 0.197 W (7.00mm x 5.00mm) | VCTCXO | 3.3V | 38.88 MHz | ±50ppb | HCMOS | Amplitude Control | Crystal | 10mA | - | - | 23360 | 1658880 | 1825 | - | 0.094 (2.40mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7K420T-1FFG901C | AMD | Datasheet | 401 |
| Min: 1 Mult: 1 | Through Hole | Radial, Can - Snap-In | 901-FCBGA (31x31) | - | XC7K420 | 5000 Hrs @ 105°C | United Chemi-Con | 380 | Bulk | Active | 420 V | -40°C ~ 105°C | LHJ | 1.378 Dia (35.00mm) | ±20% | General Purpose | 430 µF | 0.97V ~ 1.03V | - | 0.394 (10.00mm) | Polar | 2.95 A @ 120 Hz | 4.307 A @ 50 kHz | 416960 | 30781440 | 32575 | 1 | 1.713 (43.50mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-1FG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount, Wettable Flank | 13-PowerLFDFN Module | YES | 896 | DFN3625-11A | 400.011771 mg | 896 | XDL602 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-1FG896I | Torex Semiconductor Ltd | 3 | 620 | 85 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Obsolete | 30 | 5.29 | Compliant | No | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.14 V | 1.2 V | 1.25V | -40°C ~ 105°C | Automotive, AEC-Q100, XDL602 | 0.14 L x 0.10 W x 0.06 H (3.6mm x 2.5mm x 1.6mm) | e0 | Non-Isolated PoL Module | TIN LEAD | 85 °C | -40 °C | ITE (Commercial) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 1 | Not Qualified | - | 93% | 5.5V | 1.2 V | 2.5V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 1.5A | 63 kB | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | 892.86 MHz | - | 1 | 75264 | 75264 | 75264 | 3000000 | OCP, OTP, SCP, UVLO | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RT3PE3000L-1CG484EX3 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Chassis, Panel | Thermoplastic | Steel | 300V | -40°C ~ 105°C | Bulk | A2000 | Active | Black | 1 | 0.375 (9.53mm) | 30A | 12-22 AWG | 6 | Barrier Block | Closed | 2 Wall (Dual) | Screws with Solder Lugs, Single | -- | 6 | Flange, Positions Stamped | UL94 V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC5202-3PQG100I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 100 | SG-8101 | 83 MHz | XILINX INC | Xilinx | XC5202-3PQG100I | EPSON | 3 | Tape & Reel (TR) | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | Active | 30 | 5.78 | Yes | 5.5 V | 4.5 V | 5 V | -40°C ~ 105°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | e3 | Yes | XO (Standard) | Matte Tin (Sn) | TYP. GATES = 2000-3000 | CMOS | 1.8V ~ 3.3V | QUAD | GULL WING | 245 | 0.65 mm | compliant | 2.224 MHz | ±20ppm | CMOS | 100 | R-PQFP-G100 | Standby (Power Down) | Crystal | 6.8mA (Typ) | Not Qualified | 1.1µA | - | 64 CLBS, 2000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 3 ns | 64 | 2000 | 0.055 (1.40mm) | 20 mm | 14 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S1400A-4FGG484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 484-FBGA (23x23) | SG-8101 | EPSON | 375 | Tape & Reel (TR) | Active | -40°C ~ 105°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 1.8V ~ 3.3V | 99.5328 MHz | ±20ppm | CMOS | Enable/Disable | Crystal | 6.8mA (Typ) | 3.5mA | - | 25344 | 589824 | 1400000 | 2816 | 4 | - | 0.055 (1.40mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-TQ144M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Chassis Mount | Radial, Can - Screw Terminals | 144-TQFP (20x20) | -- | A54SX32A | -- | 5000 Hrs @ 105°C | Microchip Technology | 113 | Tray | Obsolete | 350V | -40°C ~ 105°C | Bulk | 104 PHL-ST | 2.992 Dia (76.00mm) | ±20% | Active | -- | General Purpose | 10000µF | 2.25V ~ 5.25V | 20 mOhm @ 100Hz | 1.252 (31.80mm) | Polar | 18 mOhms | 18.5A @ 100Hz | 48000 | 2880 | 8.886 (225.70mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7VX690T-2FFG1930I | AMD | Datasheet | 503 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1930-FCBGA (45x45) | SG-8101 | EPSON | 1000 | Tape & Reel (TR) | Active | -40°C ~ 105°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 1.8V ~ 3.3V | 35.252 MHz | ±20ppm | CMOS | Standby (Power Down) | Crystal | 6.8mA (Typ) | 1.1µA | - | 693120 | 54190080 | 54150 | 2 | - | 0.055 (1.40mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX09-PQ-100I | Microsemi Actel | Datasheet | 560 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | SG-8101 | EPSON | Tape & Reel (TR) | Active | -40°C ~ 105°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 1.8V ~ 3.3V | 36.343 MHz | ±20ppm | CMOS | Enable/Disable | Crystal | 6.8mA (Typ) | 3.5mA | - | - | 0.055 (1.40mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M08SAU169I7P | ALTERA | Datasheet | 86 |
| Min: 1 Mult: 1 | Chassis Mount | Radial, Can - Screw Terminals | YES | 169-UBGA (11x11) | 169 | -- | 416 MHz | INTEL CORP | -- | 3000 Hrs @ 105°C | Intel Corporation | 10M08SAU169I7P | 130 | 100 °C | -40 °C | PLASTIC/EPOXY | LFBGA | LFBGA, BGA169,13X13,32 | BGA169,13X13,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | 2.15 | 3.15 V | 2.85 V | 3 V | 100V | -40°C ~ 105°C | Bulk | B41560 | 3.028 Dia (76.90mm) | ±20% | Active | -- | General Purpose | OPERATES AT 3.3V NOMINAL VCC | 33000µF | 2.85 V ~ 3.465 V | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B169 | 130 | 5 mOhm @ 100Hz | 1.248 (31.70mm) | INDUSTRIAL | Polar | 8.4 mOhms | 21A @ 100Hz | 130 | 500 CLBS | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 8000 | 387072 | 500 | 500 | 8000 | 5.677 (144.20mm) | 11 mm | 11 mm | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AX066K2F35I2SG | ALTERA | Datasheet | 660 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 1152-FCBGA (35x35) | 1152 | SG-8101 | Intel / Altera | 24 | INTEL CORP | Intel | 10AX066K2F35I2SG | EPSON | Yes | SMD/SMT | 396 | 31460 LAB | 660000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965151 | Active | Active | NOT SPECIFIED | 5.42 | Details | Yes | This product may require additional documentation to export from the United States. | 930 mV | 870 mV | 0.9 V | Arria 10 FPGA | -40°C ~ 105°C | Tray | SG-8101 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.8V ~ 3.3V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 161.1328 MHz | ±20ppm | CMOS | S-PBGA-B1152 | Standby (Power Down) | Crystal | 6.8mA (Typ) | 396 | Not Qualified | 0.9 V | INDUSTRIAL | 1.1µA | - | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 660000 | FPGA - Field Programmable Gate Array | 49610752 | 250540 | - | 660000 | FPGA - Field Programmable Gate Array | 0.047 (1.20mm) | 35 mm | 35 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AX048E2F29I1HG | ALTERA | Datasheet | 472 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 780-FBGA (29x29) | SG-8101 | Intel / Altera | 36 | INTEL CORP | Intel | 10AX048E2F29I1HG | + 100 C | EPSON | - 40 C | Yes | SMD/SMT | 360 | 22948.75 LAB | 480000 LE | Tape & Reel (TR) | 965499 | Active | Active | 5.62 | Details | Yes | This product may require additional documentation to export from the United States. | 930 mV | 870 mV | Arria 10 FPGA | -40°C ~ 105°C | Tray | SG-8101 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | XO (Standard) | Programmable Logic ICs | 1.8V ~ 3.3V | unknown | 135.3 MHz | ±20ppm | CMOS | Standby (Power Down) | Crystal | 6.8mA (Typ) | 950 mV | 1.1µA | - | 480000 | FPGA - Field Programmable Gate Array | 5664768 | 183590 | - | FPGA - Field Programmable Gate Array | 0.051 (1.30mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M40DCF484I7G | ALTERA | Datasheet | 2380 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 484-FBGA (23x23) | SG-8101 | EPSON | 360 | Tape & Reel (TR) | Active | -40°C ~ 105°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | Active | XO (Standard) | 1.8V ~ 3.3V | 35.2512 MHz | ±20ppm | CMOS | Enable/Disable | Crystal | 6.8mA (Typ) | 3.5mA | - | 40000 | 1290240 | 2500 | - | 0.055 (1.40mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7K325T-1FFG676C | AMD | Datasheet | 472 |
| Min: 1 Mult: 1 | Surface Mount | Cylinder | - | XC7K325 | Amphenol SSI Technologies | 400 | Box | Active | -40°C ~ 105°C | MediaSensor™ | Industrial Automation | 5V | 0.5 V ~ 4.5 V | Cable 3 | Analog Voltage | ±0.5% | 750PSI (5171.07kPa) | Sealed Gauge | Threaded | Male - M20 x 1.5 | 326080 | 16404480 | 25475 | - | Amplified Output, Temperature Compensated | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5SGSMD5H1F35C1N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Cylinder | YES | 1152 | -- | 1152 | INTEL CORP | Intel Corporation | 5SGSMD5H1F35C1N | 552 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | 5.29 | Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 105°C | MediaSensor™ | Obsolete | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 8 V ~ 30 V | BOTTOM | BALL | 1 mm | compliant | 5SGSMD5 | 1 V ~ 5 V | MD, 4 Pin | S-PBGA-B1152 | 552 | Not Qualified | Analog Voltage | 930 mV | 0.9,1.5,2.5,2.5/3,1.2/3 V | OTHER | 5.6 MB | ±0.5% | 14.1 Gbps | 552 | 17260 CLBS | 3.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 100 PSI (689.48 kPa) | Absolute | Threaded | -- | 457000 | 46769152 | 172600 | -- | 172600 | 1 | 24 | 17260 | 457000 | 552 | Amplified Output, Temperature Compensated | 35 mm | 35 mm | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVU23P-3FSVJ1760E | AMD | Datasheet | 461 |
| Min: 1 Mult: 1 | Surface Mount | 6-SMD, No Lead | 1760-FCBGA (42.5x42.5) | SIT9375 | SiTime | 644 | Tape & Reel (TR) | Active | -40°C ~ 105°C | SiT9375 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | XO (Standard) | 1.8V | 161.132813 MHz | ±20ppm | LVPECL | Enable/Disable | MEMS | 42.5mA | - | - | 2252250 | 77909197 | 128700 | - | 0.035 (0.90mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC6SLX9-2FT256C | AMD | Datasheet | 29 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 256-FTBGA (17x17) | SG-8101 | EPSON | 186 | Tape & Reel (TR) | Active | -40°C ~ 105°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 1.8V ~ 3.3V | 110 MHz | ±20ppm | CMOS | Standby (Power Down) | Crystal | 6.8mA (Typ) | 1.1µA | - | 9152 | 589824 | 715 | - | 0.055 (1.40mm) | - |
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