The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Operating Temperature:
-55°C ~ 105°C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Dielectric Material | Housing Material | Number of Terminals | Shell Material, Finish | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | Base Product Number | Clock Frequency-Max | Contact Finish Mating | Contact Materials | Current - Saturation (Isat) | Frequency-Self-Resonant | Ihs Manufacturer | Inductance Frequency-Test | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Material-Core | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Usage Level | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Applications | Number of Rows | Additional Feature | HTS Code | Capacitance | Subcategory | Contact Type | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Pitch - Mating | Pin Count | Contact Finish | JESD-30 Code | Number of Outputs | Qualification Status | Contact Finish - Post | Operating Supply Voltage | Lead Spacing | Power Supplies | Contact Resistance | Wire Gauge | Temperature Grade | Flange Feature | Inductance | Max Supply Voltage | Min Supply Voltage | DC Resistance (DCR) | Connector Style | RAM Size | Q @ Freq | Contact Form | Shell Size, Connector Layout | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Termination Post Length | Backset Spacing | Pitch - Post | Output Function | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Features | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating | Radiation Hardening | Ratings |
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 | Mfr Part No XCKU19P-L1FFVJ1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 1760-FCBGA (42.5x42.5) | Polypropylene (PP), Metallized | -- | AMD | 540 | Tray | Active | 250V | 400V | -55°C ~ 105°C | Bulk | PPB | 1.043 L x 0.433 W (26.50mm x 11.00mm) | ±10% | Active | -- | PC Pins | Commutation; High Pulse, DV/DT; Snubber | 0.33µF | 0.698V ~ 0.742V | 0.886 (22.50mm) | 1842750 | 63753421 | 105300 | -- | 0.787 (20.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S1500-5FG676C | AMD | Datasheet | 300 | - | Min: 1 Mult: 1 | Through Hole | Radial | 676-FBGA (27x27) | Polyester, Metallized | XC3S1500 | -- | AMD | 487 | Tray | Active | 220V | 400V | -55°C ~ 105°C | Bulk | MKT373 | 1.240 L x 0.591 W (31.50mm x 15.00mm) | ±5% | Active | -- | PC Pins | General Purpose | 1.2µF | 1.14V ~ 1.26V | 1.083 (27.50mm) | 29952 | 589824 | 1500000 | 3328 | 5 | Long Life | 1.102 (28.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S400AN-5FTG256C | AMD | Datasheet | 48 | - | Min: 1 Mult: 1 | Through Hole | Radial | 256-FTBGA (17x17) | Polypropylene (PP), Metallized | XC3S400 | -- | AMD | 195 | Tray | Active | 400V | 1000V (1kV) | -55°C ~ 105°C | Bulk | KP/MKP 375 | 1.181 L x 0.433 W (30.00mm x 11.00mm) | ±5% | Active | -- | PC Pins | High Pulse, DV/DT | 0.11µF | 1.14V ~ 1.26V | 0.394 (10.00mm) | 8064 | 368640 | 400000 | 896 | 5 | -- | 0.925 (23.50mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-FGG144T | Microchip | Datasheet | 24000 | - | Min: 1 Mult: 1 | Through Hole | Radial | YES | 144-FPBGA (13x13) | Polypropylene (PP), Metallized | 144 | A3P060 | 350 MHz | MICROSEMI CORP | -- | Microsemi Corporation | A3P060-FGG144T | Microchip Technology | 3 | 96 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, GREEN, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.22 | Yes | 1.575 V | 1.425 V | 1.5 V | Automotive grade | 300V | 1000V (1kV) | -55°C ~ 105°C | Bulk | MKP338 6 | 0.689 L x 0.335 W (17.50mm x 8.50mm) | ±20% | e1 | Active | -- | PC Pins | Tin/Silver/Copper (Sn/Ag/Cu) | Automotive; EMI, RFI Suppression | 8542.39.00.01 | 0.039µF | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 96 | Not Qualified | 0.591 (15.00mm) | 1.5/3.3 V | AUTOMOTIVE | 96 | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | AEC-Q100 | STD | 1536 | 1536 | 60000 | -- | 0.591 (15.00mm) | 13 mm | 13 mm | AEC-Q200, Y2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025TS-1FCSG325 | Microchip | Datasheet | 2081 | - | Min: 1 Mult: 1 | Through Hole | Radial | 325-FCBGA (11x11) | Polypropylene (PP), Metallized | M2GL025 | -- | + 85 C | Microchip Technology | 0 C | SMD/SMT | 180 | 27696 LE | Tray | Active | 1.2 V | 1.2 V | 900V | 2500V (2.5kV) | -55°C ~ 105°C | Bulk | MMKP383 | 1.024 L x 0.276 W (26.00mm x 7.00mm) | ±5% | Active | -- | PC Pins | High Pulse, DV/DT | 6800pF | 1.14V ~ 2.625V | 1.2 V | 0.886 (22.50mm) | 27696 | 1130496 | 2 Transceiver | -- | 0.650 (16.50mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S4000-4FGG676C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 676-FBGA (27x27) | Polyester, Metallized | XC3S4000 | -- | AMD | 489 | Tray | Active | 160V | 250V | -55°C ~ 105°C | Tape & Reel (TR) | MKT370 | 0.283 L x 0.177 W (7.20mm x 4.50mm) | ±5% | Active | -- | PC Pins | Automotive | 0.056µF | 1.14V ~ 1.26V | 0.200 (5.08mm) | 62208 | 1769472 | 4000000 | 6912 | 4 | Long Life | 0.354 (9.00mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-PL84A | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | YES | 84-PLCC (29.31x29.31) | Polypropylene (PP), Metallized | 84 | A40MX04 | 116 MHz | MICROSEMI CORP | -- | Microsemi Corporation | A40MX04-PL84A | Microchip Technology | 3 | 69 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.53 | No | 5.25 V | 4.75 V | 5 V | 350V | 1000V (1kV) | -55°C ~ 105°C | Bulk | MMKP383 | 0.689 L x 0.394 W (17.50mm x 10.00mm) | ±5% | e0 | Active | -- | PC Pins | Tin/Lead (Sn/Pb) | High Pulse, DV/DT | CAN ALSO BE OPERATED AT 3V SUPPLY | 8542.39.00.01 | 0.56µF | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 84 | S-PQCC-J84 | Not Qualified | 0.591 (15.00mm) | AUTOMOTIVE | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2.2 ns | 547 | 6000 | -- | 0.650 (16.50mm) | 29.3116 mm | 29.3116 mm | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2V40-6FGG256I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Axial | YES | Axial | 256 | 820 MHz | - | 3.3MHz | XILINX INC | 790 kHz | Xilinx | XC2V40-6FGG256I | Ferrite | Central Technologies | 3 | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | BGA | Active | 30 | 5.8 | Yes | 1.575 V | 1.425 V | 1.5 V | -55°C ~ 105°C | CTM2F | 0.156 Dia x 0.375 L (3.96mm x 9.52mm) | ±10% | e1 | Yes | Molded | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | Field Programmable Gate Arrays | 93 mA | CMOS | BOTTOM | BALL | Unshielded | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | 88 | Not Qualified | 1.5,1.5/3.3,3.3 V | 620 µH | 26Ohm Max | 65 @ 790kHz | 88 | 64 CLBS, 40000 GATES | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.35 ns | 64 | 576 | 40000 | - | - | 17 mm | 17 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC1718DSI | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Axial | Axial | - | 60MHz | 2.5 MHz | - | Central Technologies | Tape & Reel (TR) | Active | -55°C ~ 105°C | CTS1F | 0.110 Dia x 0.260 L (2.80mm x 6.60mm) | ±5% | Molded | 570 mA | Shielded | 12 µH | 550mOhm Max | 40 @ 2.5MHz | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVU23P-1VSVA1365I | AMD | Datasheet | 504 | - | Min: 1 Mult: 1 | Through Hole | 1365-BFBGA, FCBGA | 1365-FCBGA (35x35) | Polyamide (PA46), Nylon 4/6, Glass Filled | 36 (1 x 36) | Phosphor Bronze | Phosphor Bronze | Tin | AMD | 364 | Tray | Active | -55°C ~ 105°C | Bulk | 511 | Active | Solder | SIP | 0.825V ~ 0.876V | 1A | 0.100 (2.54mm) | Tin | -- | 2252250 | 77909197 | 128700 | 0.150 (3.81mm) | 0.100 (2.54mm) | -- | 50.0µin (1.27µm) | 50.0µin (1.27µm) | UL94 V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S1400A-5FTG256C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 256-FTBGA (17x17) | Polypropylene (PP), Metallized | XC3S1400 | -- | AMD | 161 | Tray | Active | 900V | 2500V (2.5kV) | -55°C ~ 105°C | Bulk | MMKP383 | 1.220 L x 0.512 W (31.00mm x 13.00mm) | ±5% | Active | -- | PC Pins | High Pulse, DV/DT | 0.027µF | 1.14V ~ 1.26V | 1.083 (27.50mm) | 25344 | 589824 | 1400000 | 2816 | 5 | -- | 0.906 (23.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2S200-5FGG456I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 456-FBGA (23x23) | Polyester, Metallized | XC2S200 | -- | AMD | 284 | Tray | Active | 63V | 100V | -55°C ~ 105°C | Bulk | MKT368 | 1.181 L x 0.433 W (30.00mm x 11.00mm) | ±5% | Active | -- | PC Pins | General Purpose | 5.6µF | 2.375V ~ 2.625V | 1.083 (27.50mm) | 5292 | 57344 | 200000 | 1176 | 5 | Long Life | 0.945 (24.00mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S1600E-4FGG400C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 400-FBGA (21x21) | Polyester, Metallized | XC3S1600 | -- | AMD | 304 | Tray | Active | 160V | 250V | -55°C ~ 105°C | Bulk | MKT468 | 1.024 L x 0.492 W (26.00mm x 12.50mm) | ±10% | Active | -- | PC Pins | General Purpose | 3.3µF | 1.14V ~ 1.26V | 0.886 (22.50mm) | 33192 | 663552 | 1600000 | 3688 | 4 | -- | 1.004 (25.50mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-2BG272I | Microchip | Datasheet | 653 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Through Hole | Radial | YES | 272 | 272-PBGA (27x27) | Polyester, Metallized | 272 | A42MX36 | 91 MHz | MICROSEMI CORP | -- | Microsemi Corporation | A42MX36-2BG272I | Microchip Technology | 3 | 202 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | PLASTIC, BGA-272 | SQUARE | GRID ARRAY | Active | BGA | Obsolete | 30 | 5.2 | Compliant | No | 3.6 V | 3 V | 3.3 V | 160V | 630V | -55°C ~ 105°C | Bulk | MKT303 | 0.689 L x 0.248 W (17.50mm x 6.30mm) | ±5% | e0 | Active | -- | PC Pins | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | General Purpose | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 0.15µF | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | BOTTOM | BALL | 225 | 1.27 mm | compliant | 272 | S-PBGA-B272 | Not Qualified | 5 V | 0.591 (15.00mm) | INDUSTRIAL | 5.5 V | 3 V | 320 B | 2438 CLBS, 54000 GATES | 2.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 2560 | 54000 | 164 MHz | 1184 | 2 | 1822 | 2.1 ns | 2438 | 54000 | Long Life | 1.73 mm | 0.433 (11.00mm) | 27 mm | 27 mm | No | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2S30-5CSG144C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 144-LCSBGA (12x12) | Polyester, Metallized | XC2S30 | -- | AMD | 92 | Tray | Active | 160V | 250V | -55°C ~ 105°C | Tape & Reel (TR) | MKT368 | 0.492 L x 0.177 W (12.50mm x 4.50mm) | ±10% | Active | -- | PC Pins | General Purpose | 0.047µF | 2.375V ~ 2.625V | 0.394 (10.00mm) | 972 | 24576 | 30000 | 216 | 5 | Long Life | 0.610 (15.50mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S2000-4FGG456I | AMD | Datasheet | 2150 |
| Min: 1 Mult: 1 | Through Hole | Radial | 456-FBGA (23x23) | Polyester, Metallized | XC3S2000 | -- | AMD | 333 | Tray | Active | 100V | 400V | -55°C ~ 105°C | Tape & Reel (TR) | MKT373M | 0.492 L x 0.157 W (12.50mm x 4.00mm) | ±10% | Active | -- | PC Pins | General Purpose | 0.15µF | 1.14V ~ 1.26V | 0.394 (10.00mm) | 46080 | 737280 | 2000000 | 5120 | 4 | Long Life | 0.728 (18.50mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVU9P-L2FLGA2104E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | 2104-FCBGA (47.5x47.5) | Polypropylene (PP), Metallized | XCVU9 | -- | AMD | 832 | Tray | Active | 700V | 2000V (2kV) | -55°C ~ 105°C | Bulk | MMKP383 | 0.689 L x 0.236 W (17.50mm x 6.00mm) | ±5% | Active | -- | PC Pins | High Pulse, DV/DT | 3300pF | 0.698V ~ 0.742V | 0.591 (15.00mm) | 2586150 | 391168000 | 147780 | L2 | -- | 0.472 (12.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPF10K250EGC599-3 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole, Right Angle | 599-BPGA | NO | 599-PGA (62.5x62.5) | -- | 599 | Steel, Tin Plated | Brass | INTEL CORP | -- | Intel Corporation | EPF10K250EGC599-3 | 1 | 470 | 70 °C | CERAMIC, METAL-SEALED COFIRED | HIPGA | HIPGA, SPGA599,47X47 | SPGA599,47X47 | SQUARE | GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH | Obsolete | NOT SPECIFIED | 5.77 | Non-Compliant | No | 2.7 V | 2.3 V | 2.5 V | 125V | -55°C ~ 105°C | Tray | AMPLIMITE HD-20 | e0 | Obsolete | -- | Solder | Plug, Male Pins | 15 | TIN LEAD | Black | 2 | 8542.39.00.01 | Field Programmable Gate Arrays | Signal | CMOS | PERPENDICULAR | PIN/PEG | 220 | -- | 2.54 mm | compliant | 6A | Gold | S-CPGA-P599 | 470 | Not Qualified | 2.5,2.5/3.3 V | -- | COMMERCIAL | Housing/Shell (Unthreaded) | D-Sub | -- | 2 (DA, A) | 470 | 4 DEDICATED INPUTS, 470 I/O | 5.08 mm | LOADABLE PLD | 0.318 (8.08mm) | MIXED | 12160 | 4 | Board Lock, Ground Strap, Grounding Indents | 62.484 mm | 62.484 mm | -- | UL94 V-0 |
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XCKU19P-L1FFVJ1760I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S1500-5FG676C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S400AN-5FTG256C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-FGG144T
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL025TS-1FCSG325
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S4000-4FGG676C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX04-PL84A
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC2V40-6FGG256I
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC1718DSI
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCVU23P-1VSVA1365I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S1400A-5FTG256C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC2S200-5FGG456I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S1600E-4FGG400C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A42MX36-2BG272I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
737.579588
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XC2S30-5CSG144C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S2000-4FGG456I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
156.152679
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XCVU9P-L2FLGA2104E
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EPF10K250EGC599-3
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire