The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Mounting Type
- Number of Gates
- Number of I/Os
- Number of LABs/CLBs
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- Total RAM Bits
- Voltage - Supply
- Base Product Number
- Mfr
- Operating Temperature:
-55°C ~ 125°C (TA)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No AX2000-1FGG896M | Microchip Technology | Datasheet | 588 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 763 MHz | 27 | MICROSEMI CORP | AX2000-1FGG896M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 586 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX2000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 850 ps | 850 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 763 MHz | 32256 | MIL-STD-883 Class B | 21504 | 1 | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | ||
| Mfr Part No AX2000-FGG896M | Microchip Technology | Datasheet | 516 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 649 MHz | 27 | MICROSEMI CORP | AX2000-FGG896M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 586 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX2000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | |||
| Mfr Part No AX2000-FG896M | Microchip Technology | Datasheet | 444 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 649 MHz | 27 | MICROSEMI CORP | AX2000-FG896M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 586 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX2000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||
| Mfr Part No AX1000-FG484M | Microchip Technology | Datasheet | 718 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 649 MHz | 60 | MICROSEMI CORP | AX1000-FG484M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 317 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||
| Mfr Part No AX2000-1FG896M | Microchip Technology | Datasheet | 734 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 896 | 896-FBGA (31x31) | 400.011771 mg | AX2000 | 27 | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 586 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX2000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 36 kB | 850 ps | 21504 | 294912 | 2000000 | 763 MHz | 32256 | 1 | 21504 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-PQG208M | Microchip Technology | Datasheet | 472 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-208 | 208-PQFP (28x28) | AX500 | 24 | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 115 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | -55°C ~ 125°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-FG676M | Microchip Technology | Datasheet | 744 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 649 MHz | 40 | MICROSEMI CORP | AX1000-FG676M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 418 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | |||
| Mfr Part No AX2000-CQ352M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP | YES | 352 | 352-CQFP (75x75) | 10.567001 g | 352 | AX2000 | 649 MHz | 1 | MICROSEMI CORP | AX2000-CQ352M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 198 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK352,2.9SQ,20 | TPAK352,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.372740 oz | Military grade | -55°C ~ 125°C (TA) | AX2000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | FLAT | 225 | 0.5 mm | unknown | 649 MHz | S-CQFP-F352 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.89 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 2.66 mm | 48 mm | 48 mm | No | |||||
| Mfr Part No AX250-1FG256M | Microchip Technology | Datasheet | 467 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | AX250 | 90 | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 138 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-FG256M | Microchip Technology | Datasheet | 673 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AX250 | 649 MHz | 90 | MICROSEMI CORP | AX250-FG256M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 138 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX250 | 3A001.A.2.C | TIN LEAD/TIN LEAD SILVER | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.99 ns | 2816 | 4224 | 250000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||
| Mfr Part No AX250-FGG484M | Microchip Technology | Datasheet | 450 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AX250 | 649 MHz | 60 | MICROSEMI CORP | AX250-FGG484M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 248 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX250 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.99 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||
| Mfr Part No AX1000-FG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX1000 | 649 MHz | 27 | MICROSEMI CORP | AX1000-FG896M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 516 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | |||
| Mfr Part No AX250-1FGG484M | Microchip Technology | Datasheet | 516 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AX250 | 763 MHz | 60 | MICROSEMI CORP | AX250-1FGG484M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 248 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX250 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.84 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||
| Mfr Part No AX250-FGG256M | Microchip Technology | Datasheet | 400 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | AX250 | 90 | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 138 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1PQG208M | Microchip Technology | Datasheet | 573 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | AX250 | 763 MHz | 24 | MICROSEMI CORP | AX250-1PQG208M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 115 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.6 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | Military grade | -55°C ~ 125°C (TA) | Tray | AX250 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.84 ns | 2816 | 4224 | 250000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||
| Mfr Part No AX2000-FG1152M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 1152 | 1152-FPBGA (35x35) | 400.011771 mg | 1152 | AX2000 | 649 MHz | 24 | MICROSEMI CORP | AX2000-FG1152M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 684 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Obsolete | 20 | 5.29 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX2000 | 3A001.A.2.C | TIN LEAD/TIN LEAD SILVER | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B1152 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 35 mm | 35 mm | No | |||||||
| Mfr Part No AX2000-CGS624M | Microchip Technology | Datasheet | 683 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Through Hole | Through Hole | CCGA | 624 | 624-CCGA (32.5x32.5) | AX2000 | 1 | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 418 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | -55°C ~ 125°C (TA) | AX2000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 36 kB | 990 ps | 21504 | 294912 | 2000000 | 649 MHz | 32256 | 21504 | 2.73 mm | 32.5 mm | 32.5 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-LG624M | Microchip Technology | Datasheet | 663 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | LGA-624 | 624 | 624-CLGA (32.5x32.5) | AX1000 | 1 | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 440 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | Actel | -55°C ~ 125°C (TA) | AX1000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 20.3 kB | 12096 | 165888 | 1000000 | 350 MHz | 18144 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-1FG676M | Microchip Technology | Datasheet | 416 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 763 MHz | 40 | MICROSEMI CORP | AX1000-1FG676M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 418 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | Contains Lead | ||||
| Mfr Part No AX1000-1FG484M | Microchip Technology | Datasheet | 484 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 763 MHz | 60 | MICROSEMI CORP | AX1000-1FG484M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 317 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No |
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Price: please inquire
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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Package:Embedded - FPGAs (Field Programmable Gate Array)
8,206.789475
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Price: please inquire
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Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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