The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Mounting Type
- Number of Gates
- Number of I/Os
- Number of LABs/CLBs
- Operating Temperature
- Package / Case
- Series
- Supplier Device Package
- Total RAM Bits
- Voltage - Supply
- Base Product Number
- Mfr
- Operating Temperature:
-55°C ~ 125°C (TA)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Approvals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Fuse Size / Group | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of contacts as change-over contact | Number of contacts as normally closed contact | Number of contacts as normally open contact | Number of I/O Lines | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | RAM Size | Number of Poles | Illumination | Propagation Delay | Turn On Delay Time | Protections | Access Time | Memory Format | Memory Interface | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Write Cycle Time - Word, Page | Terminal Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product | Product Category | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No AX1000-1BG729M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 729-BBGA | 729 | 729-PBGA (35x35) | AX1000 | Microchip Technology | 516 | Tray | Active | Compliant | -55°C ~ 125°C (TA) | Axcelerator | 125 °C | -55 °C | 1.425V ~ 1.575V | 763 MHz | 1.5 V | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 12096 | 165888 | 1000000 | 763 MHz | 18144 | 12096 | 1 | 12096 | 1.73 mm | 35 mm | 35 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1CQ352M | Microchip | Datasheet | 8000 | - | Min: 1 Mult: 1 | Surface Mount | 352-BFCQFP with Tie Bar | 352-CQFP (75x75) | AX250 | Microchip Technology | 198 | Tray | Active | -55°C ~ 125°C (TA) | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-1BGG729M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 729-BBGA | YES | 729 | 729-PBGA (35x35) | 729 | AX1000 | 763 MHz | MICROSEMI CORP | Microsemi Corporation | AX1000-1BGG729M | Microchip Technology | 3 | 516 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA729,27X27,50 | BGA729,27X27,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | Military grade | -55°C ~ 125°C (TA) | Axcelerator | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B729 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1e+06 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 35 mm | 35 mm | No | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1PQ208M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFQFP | 208-PQFP (28x28) | AX250 | Microchip Technology | 1 | 0 | 0 | 115 | Tray | Obsolete | -55°C ~ 125°C (TA) | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-1FGG676M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 676-BGA | 676-FBGA (27x27) | AX500 | AIRPAX | 3 | Sensata | Microchip Technology | 336 | Tray | Active | -55°C ~ 125°C (TA) | Axcelerator | Circuit Breakers | 1.425V ~ 1.575V | 20 A | 73728 | 500000 | 8064 | Circuit Breakers | Circuit Breakers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-FGG676M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 676-BGA | 676-FBGA (27x27) | AX500 | Littelfuse | 40 | ZCASE | Littelfuse | + 105 C | Microchip Technology | - 40 C | Panel Mount | 336 | Tray | Active | Details | 13.523420 oz | 32 VDC | -55°C ~ 125°C (TA) | BMZF | Heavy Duty | Fuses | 1.425V ~ 1.575V | 325 A | Threaded Stud | 2 Pole | Non-Illuminated | Fuse Holders | 73728 | 500000 | 8064 | Fuse Holders | Fuse Holder | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-FG484M | Microchip Technology | Datasheet | 762 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX250 | 60 | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 248 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-1FG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX1000 | 763 MHz | 27 | MICROSEMI CORP | AX1000-1FG896M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 516 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1FG484M | Microchip Technology | Datasheet | 454 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AX250 | 763 MHz | 60 | MICROSEMI CORP | AX250-1FG484M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 248 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX250 | e0 | 3A001.A.2.C | TIN LEAD | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.84 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-1FG484M | Microchip Technology | Datasheet | 625 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX500 | 60 | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 317 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-FG484M | Microchip Technology | Datasheet | 456 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX500 | 60 | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 317 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX2000-1CQ352M | Microchip Technology | Datasheet | 765 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP | YES | 352 | 352-CQFP (75x75) | 10.567001 g | 352 | AX2000 | 763 MHz | 1 | MICROSEMI CORP | AX2000-1CQ352M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 198 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK352,2.9SQ,20 | TPAK352,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.372740 oz | Military grade | -55°C ~ 125°C (TA) | AX2000 | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F352 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 850 ps | 684 | 21504 CLBS, 2000000 GATES | 2.89 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 763 MHz | 32256 | MIL-STD-883 Class B | 1 | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | 2.66 mm | 48 mm | 48 mm | No | |||||||||||||||||||||||||||||||||||
| Mfr Part No AX2000-1LG624M | Microchip Technology | Datasheet | 604 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CCGA-624 | 624 | 624-CLGA (32.5x32.5) | AX2000 | 1 | Microchip Technology | Yes | SMD/SMT | 418 | Tray | Active | N | This product may require additional documentation to export from the United States. | Actel | -55°C ~ 125°C (TA) | AX2000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 36 kB | 21504 | 294912 | 2e+06 | 32256 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-1PQG208M | Microchip Technology | Datasheet | 522 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-208 | 208-PQFP (28x28) | AX500 | 24 | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 115 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | -55°C ~ 125°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX2000-LG624M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CCGA-624 | 624 | 624-CLGA (32.5x32.5) | AX2000 | 1 | Microchip Technology | Yes | SMD/SMT | 418 | Tray | Active | N | This product may require additional documentation to export from the United States. | Actel | -55°C ~ 125°C (TA) | AX2000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 36 kB | 21504 | 294912 | 2000000 | 32256 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-FGG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX1000 | 649 MHz | 27 | MICROSEMI CORP | AX1000-FGG896M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 516 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||
| Mfr Part No AX250-1CQ208M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 208-BFCQFP with Tie Bar | YES | 208-CQFP (75x75) | 208 | CCC, CSA, UL, VDE | AX250 | 763 MHz | MICROSEMI CORP | Cutler Hammer, Div of Eaton Co | FAZ-B1/1-NA-L | Microchip Technology | DIN Rail | 115 | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.29 | Yes | No | 1.575 V | 1.425 V | 1.5 V | Military grade | -55°C ~ 125°C (TA) | Axcelerator | e0 | 3A001.A.2.C | TIN LEAD | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | QUAD | FLAT | 225 | 0.5 mm | unknown | 1 A | S-CQFP-F208 | 248 | Not Qualified | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | Branch Circuit | 248 | 2816 CLBS, 250000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | Screw | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.84 ns | 2816 | 4224 | 250000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-1FGG484M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | AX500 | Microchip Technology | 317 | Tray | Active | -55°C ~ 125°C (TA) | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-CQ352M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 352-BFCQFP with Tie Bar | 352-CQFP (75x75) | AX250 | Microchip Technology | 198 | Tray | Active | -55°C ~ 125°C (TA) | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPF10K50SFC484-2XB | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 28-CDIP (0.300, 7.62mm) | YES | 28-CDIP | 484 | INTEL CORP | Intel Corporation | EPF10K50SFC484-2XB | Volatile | 254 | 220 | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | 5.56 | Non-Compliant | 2.625 V | 2.375 V | 2.5 V | -55°C ~ 125°C (TA) | Tube | -- | Active | SRAM - Asynchronous | 4.5 V ~ 5.5 V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B484 | 254 | COMMERCIAL | 256Kb (32K x 8) | 0.4 ns | 100ns | SRAM | Parallel | 254 | 254 I/O | 2.6 mm | LOADABLE PLD | 100ns | 2880 | 40960 | 199000 | 360 | MIXED | 23 mm | 23 mm |
-
AX1000-1BG729M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX250-1CQ352M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX1000-1BGG729M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX250-1PQ208M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX500-1FGG676M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX500-FGG676M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX250-FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,712.442863
-
AX1000-1FG896M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX250-1FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
2,174.238929
-
AX500-1FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
3,286.816635
-
AX500-FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
2,518.609470
-
AX2000-1CQ352M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
30,993.097741
-
AX2000-1LG624M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
26,253.705885
-
AX500-1PQG208M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
2,629.462756
-
AX2000-LG624M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX1000-FGG896M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX250-1CQ208M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX500-1FGG484M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX250-CQ352M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
EPF10K50SFC484-2XB
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire