The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Operating Temperature:
-55°C ~ 125°C (TJ)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No A3P1000-FGG256M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FGG144M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-FGG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, GREEN, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.34 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | A3PE3000L-FGG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e1 | 3A001.A.2.C | TIN SILVER COPPER | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 25 mA | 63 kB | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 350 MHz | 75264 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | No | ||||||||||||||||||||||
| Mfr Part No A3P1000-1FG144M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-1FG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.22 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e0 | 3A001.A.2.C | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | not_compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1PQ208M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A3P1000 | 350 MHz | 24 | MICROSEMI CORP | A3P1000-1PQ208M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 154 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 154 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-CQ84B | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CQFP-84 | YES | 84-CQFP (42x42) | 84 | A54SX32 | 217 MHz | 1 | MICROSEMI CORP | A54SX32A-CQ84B | 238 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 62 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, | SQUARE | FLATPACK | Active | Active | 20 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A54SX32A | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE WITH 3.3V AND 5V | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.635 mm | compliant | S-CQFP-F84 | Not Qualified | 2.5 V | MILITARY | 1800 CLBS, 48000 GATES | 2.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | MIL-STD-883 Class B | 1.4 ns | 1800 | 48000 | 16.51 mm | 16.51 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-1CQ208B | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | A42MX36 | 83 MHz | 1 | MICROSEMI CORP | A42MX36-1CQ208B | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 176 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | CERAMIC, QFP-208 | SQUARE | FLATPACK, GUARD RING | Active | QFP | Active | 20 | 5.19 | N | No | This product may require additional documentation to export from the United States. | 3.3 V | 3.3 V | 3.3 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A42MX36 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 208 | S-CQFP-F208 | Not Qualified | 3.3 V | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 2560 | 54000 | MIL-STD-883 | 1 | 1822 | 2.3 ns | 2438 | 2414 | 54000 | 29.21 mm | 29.21 mm | No | ||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FGG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-896 | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 250 MHz | 504 kbit | 27 | MICROSEMI CORP | M1A3PE3000L-1FGG896M | 350 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 620 I/O | 3500 LAB | 35000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 700 Mb/s | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||
| Mfr Part No 5962-9958502QXC | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CQFP | 256-CQFP (75x75) | 5962-9958502 | 1 | 151 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 202 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | Actel | 0.372740 oz | -55°C ~ 125°C (TJ) | MX | 3V ~ 3.6V, 4.5V ~ 5.5V | 3.3 V, 5 V | 2560 | 54000 | 2.8 mm | 36 mm | 36 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-FG144M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-FG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3P1000 | e0 | 3A001.A.2.C | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No 5962-0054302QYC | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | 5962-0054302 | 1 | MICROSEMI CORP | 5962-0054302QYC | 250 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 171 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, | SQUARE | FLATPACK, GUARD RING | Active | Active | 5.3 | N | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | 2.5 V | Military grade | -55°C ~ 125°C (TJ) | SX-A | e4 | 3A001.A.2.C | GOLD | 125 °C | -55 °C | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 0.5 mm | compliant | 250 MHz | S-CQFP-F208 | Qualified | 2.5 V | MILITARY | 2.75 V | 2.25 V | 1.3 ns | 1.3 ns | 72000 GATES | 3.16 mm | FIELD PROGRAMMABLE GATE ARRAY | 4024 | 108000 | 250 MHz | 6036 | MIL-PRF-38535 Class Q | 6036 | 1 | 4024 | 72000 | 29.21 mm | 29.21 mm | No | ||||||||||||||||||||||||||||||
| Mfr Part No 5962-9958502QYC | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | 208-CQFP (75x75) | 5962-9958502 | 1 | 151 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 176 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | Actel | -55°C ~ 125°C (TJ) | MX | 3V ~ 3.6V, 4.5V ~ 5.5V | 3.3 V, 5 V | 2560 | 54000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5962-0151801QYC | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CQFP-208 | YES | 208-CQFP (75x75) | 208 | 5962-0151801 | 1 | MICROSEMI CORP | 5962-0151801QYC | 238 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 174 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, | SQUARE | FLATPACK, GUARD RING | Active | Active | 5.25 | N | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | SX-A | e4 | 3A001.A.2.C | GOLD | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 0.5 mm | compliant | S-CQFP-F208 | Qualified | 2.5 V | MILITARY | 32000 GATES | 3.22 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | MIL-PRF-38535 Class Q | 32000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5962-9958501QYC | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-CQFP (75x75) | 208 | 5962-9958501 | 1 | MICROSEMI CORP | 5962-9958501QYC | 79 MHz, 131 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 176 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, | SQUARE | FLATPACK, GUARD RING | Active | Active | 5.24 | N | This product may require additional documentation to export from the United States. | 5.25 V | 4.75 V | 3.3 V | Actel | Military grade | -55°C ~ 125°C (TJ) | MX | e4 | 3A001.A.2.C | GOLD | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 0.5 mm | compliant | S-CQFP-F208 | Qualified | 3.3 V, 5 V | MILITARY | 36000 GATES | 3.18 mm | FIELD PROGRAMMABLE GATE ARRAY | 2560 | 54000 | MIL-PRF-38535 Class Q | 36000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-1FG144M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-1FG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3P1000 | e0 | 3A001.A.2.C | TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010TS-1FG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL010 | 60 | MICROSEMI CORP | M2GL010TS-1FG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 233 I/O | 12084 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -55°C ~ 125°C (TJ) | Tray | M2GL010TS | 3A001.A.2.C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | MILITARY | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5962-0151802QXC | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CQFP-256 | YES | 256-CQFP (75x75) | 256 | 5962-0151802 | 1 | MICROSEMI CORP | 5962-0151802QXC | 278 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 228 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, | SQUARE | FLATPACK, GUARD RING | Active | Active | 5.23 | N | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | SX-A | e4 | 3A001.A.2.C | GOLD | 2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 0.5 mm | compliant | S-CQFP-F256 | Qualified | 2.5 V | MILITARY | 32000 GATES | 3.22 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | MIL-PRF-38535 Class Q | 32000 | 36 mm | 36 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-1PQG208M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P1000 | 350 MHz | 24 | MICROSEMI CORP | M1A3P1000-1PQG208M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 154 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | M1A3P1000 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025TS-1FG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | 484-FPBGA (23x23) | M2GL025 | 60 | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 267 I/O | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | -55°C ~ 125°C (TJ) | Tray | M2GL025TS | 1.14V ~ 2.625V | 1.2 V | 27696 | 1130496 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-2FG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | 484-FPBGA (23x23) | A3P1000 | 144 kbit | 144 kbit | 60 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 300 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 |
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A3P1000-FGG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000-FGG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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Microchip Technology
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5962-9958502QXC
Microchip Technology
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M1A3P1000-FG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip Technology
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5962-9958502QYC
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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5962-0151801QYC
Microchip Technology
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5962-9958501QYC
Microchip Technology
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M1A3P1000-1FG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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5962-0151802QXC
Microchip Technology
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip Technology
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Microchip Technology
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