The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Mounting Type
- Operating Temperature
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- Number of I/Os
- Base Product Number
- Operating Temperature:
-55°C ~ 125°C (TJ)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Screening Level | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Length | Width | Radiation Hardening |
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 | Mfr Part No MPF300TS-FC484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 484-BFCPGA | 484-CCGA (23x23) | 1 | Microchip Technology | 284 | 300000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | -55°C ~ 125°C (TJ) | Tray | MPF300TS | 0.97V ~ 1.08V | 1.05 V | 300000 | 21600666 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010T-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL010 | 60 | MICROSEMI CORP | M2GL010T-1FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 233 I/O | 12084 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -55°C ~ 125°C (TJ) | Tray | M2GL010T | 3A001.A.2.C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | MILITARY | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 4 Transceiver | 12084 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | 484-FPBGA (23x23) | A3P1000 | 60 | Microchip Technology | Yes | 300 | 11000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 18 kB | 147456 | 1e+06 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050T-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | M2GL050 | 60 | Microchip Technology | Yes | 267 | Tray | Active | Details | This product may require additional documentation to export from the United States. | IGLOO2 | -55°C ~ 125°C (TJ) | Tray | M2GL050T | 1.14V ~ 2.625V | 56340 | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090TS-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | 60 | MICROSEMI CORP | M2GL090TS-1FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 267 I/O | 86184 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.27 | Details | Yes | FPGA - Field Programmable Gate Array IGLOO 2 | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -55°C ~ 125°C (TJ) | Tray | M2GL090TS | 3A001.A.2.C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | MILITARY | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 4 Transceiver | 86316 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025T-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | 484-FPBGA (23x23) | M2GL025 | 60 | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 267 I/O | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | -55°C ~ 125°C (TJ) | Tray | M2GL025T | 1.14V ~ 2.625V | 1.2 V | 27696 | 1130496 | 4 Transceiver | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-FG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-FG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||
| Mfr Part No A3PE600L-FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3PE600 | 250 MHz | 60 | MICROSEMI CORP | A3PE600L-FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 270 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE600L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 270 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | 13824 | 600000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1FGG144M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-1FGG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 504 kbit | 60 | MICROSEMI CORP | M1A3PE3000L-1FGG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 341 I/O | 3500 LAB | 35000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 700 Mb/s | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | |||||||||||||||||||||||||
| Mfr Part No A3P1000-1PQG208M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A3P1000 | 350 MHz | 24 | MICROSEMI CORP | A3P1000-1PQG208M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 154 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 1.36 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 250 MHz | 27 | MICROSEMI CORP | M1A3PE3000L-1FG896M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 620 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | ||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-PQG208M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P1000 | 350 MHz | 24 | MICROSEMI CORP | M1A3P1000-PQG208M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 154 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | M1A3P1000 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-1FGG144M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | M1A3P1000 | 160 | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 97 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3P1000 | 1.425V ~ 1.575V | 1.5 V | 8 mA | 147456 | 1000000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | A3PE3000L-1FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | No | ||||||||||||||||||
| Mfr Part No A54SX32A-1CQ208B | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CQFP-208 | YES | 208-CQFP (75x75) | 208 | A54SX32 | 278 MHz | 1 | MICROSEMI CORP | A54SX32A-1CQ208B | 278 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 174 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Active | Active | 20 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A54SX32A | e0 | 3A001.A.2.C | TIN LEAD | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 174 | Not Qualified | 2.5 V | 2.5,3.3/5 V | MILITARY | 174 | 2880 CLBS, 48000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | MIL-STD-883 Class B | 1.1 ns | 2880 | 2880 | 48000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||
| Mfr Part No A54SX72A-CQ256B | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CQFP-256 | YES | 256-CQFP (75x75) | 256 | A54SX72 | 217 MHz | 1 | MICROSEMI CORP | A54SX72A-CQ256B | 217 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 213 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, | SQUARE | FLATPACK | Active | Active | NOT SPECIFIED | 5.18 | N | No | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A54SX72A | 3A001.A.2.C | IT CAN ALSO OPERATE WITH 3.3V AND 5V | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | NOT SPECIFIED | 0.5 mm | unknown | S-CQFP-F256 | Not Qualified | 2.5 V | MILITARY | 4024 CLBS, 108000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | MIL-STD-883 Class B | 1.4 ns | 4024 | 108000 | 36 mm | 36 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX36-CQ208B | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP-208 | YES | 208 | 208-CQFP (75x75) | 208 | A42MX36 | 73 MHz | 1 | MICROSEMI CORP | A42MX36-CQ208B | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 176 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | CERAMIC, QFP-208 | SQUARE | FLATPACK, GUARD RING | Active | QFP | Active | 20 | 5.19 | N | No | This product may require additional documentation to export from the United States. | 3.3 V | 3.3 V | 3.3 V | Actel | Military grade | -55°C ~ 125°C (TJ) | A42MX36 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | FLAT | 225 | 0.5 mm | compliant | 208 | S-CQFP-F208 | Not Qualified | 3.3 V | MILITARY | 320 B | 2438 CLBS, 54000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 2560 | 54000 | MIL-STD-883 | 1822 | 2.7 ns | 2438 | 2414 | 54000 | 29.21 mm | 29.21 mm | No | |||||||||||||||||||||||
| Mfr Part No A54SX32A-CQ256B | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CQFP-256 | 256-CQFP (75x75) | A54SX32 | 1 | 238 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 228 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | Actel | -55°C ~ 125°C (TJ) | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 |
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MPF300TS-FC484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL010T-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL050T-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090TS-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL025T-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000L-FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000L-FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE600L-FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000-1FGG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000L-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P1000-PQG208M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P1000-1FGG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3PE3000L-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
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A42MX36-CQ208B
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A54SX32A-CQ256B
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire