The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Mfr
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- Number of I/Os
- Number of Logic Elements/Cells
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- Supplier Device Package
- Operating Temperature:
-55°C ~ 85°C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Supplier Device Package | Dielectric Material | Body Material | Number of Terminals | Center Contact Plating | Center Contact Material | Base Product Number | Clock Frequency-Max | CoilResistance | Contact Materials | Frequency-Max | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Applications | Additional Feature | HTS Code | Capacitance | Fastening Type | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Lead Spacing | Temperature Grade | Impedance | Connector Style | Number of Ports | RAM Size | Mating Cycles | Contact Termination | Contact Form | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Relay Type | Number of Logic Elements/Cells | Operate Time | Coil Voltage | Coil Type | Switching Voltage | Includes | Coil Current | Release Time | Total RAM Bits | Must Operate Voltage | Contact Rating (Current) | Number of Gates | Number of LABs/CLBs | Coil Power | Must Release Voltage | Insertion Loss | Number of Logic Blocks (LABs) | Speed Grade | Body Finish | Cable Group | Shield Termination | Seal Rating | Number of CLBs | Number of Logic Cells | Coil Insulation | Number of Equivalent Gates | Features | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No XC4952XLA-09BG432I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Chassis Mount | 2kOhms | - | Sensata-Gigavac Clean Energy | Bulk | Active | -55°C ~ 85°C | GX11 | Stud, Wire Leads | SPST-NO (DM) (1 Form X) | 20 ms | 120VDC | 800VDC - Max | 60 mA | 12 ms | 72 VDC | 150 A | 7.2W | 4.5 VDC | Sealed - Hermetically | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCR3064XL VQ44 | Xilinx | Datasheet | 212 | - | Min: 1 Mult: 1 | Through Hole | 97 Ohms | Silver Tin Oxide (AgSnO) | American Zettler | Box | Active | Non-Compliant | -55°C ~ 85°C | AZ2151 | PC Pin | SPDT (1 Form C) | General Purpose | 12 ms | 9VDC | Non Latching | 300VAC, 30VDC - Max | 92.8 mA | 5 ms | 6.75 VDC | 40 A | 0.9 VDC | Sealed - Fully | Class B | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL060V5-VQG100I | Microchip | Datasheet | 443 | - | Min: 1 Mult: 1 | Through Hole | Radial | YES | 100-VQFP (14x14) | Polypropylene (PP), Metallized | 100 | AGL060 | 108 MHz | MICROSEMI CORP | -- | Microsemi Corporation | AGL060V5-VQG100I | Microchip Technology | 3 | 71 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.02 | Yes | 1.575 V | 1.425 V | 1.5 V | 160V | 630V | -55°C ~ 85°C | Bulk | MKP420 | 0.492 L x 0.236 W (12.50mm x 6.00mm) | ±2% | e3 | Active | -- | PC Pins | Tin (Sn) | High Frequency, Switching | 8542.39.00.01 | 0.033µF | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 0.394 (10.00mm) | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 18432 | 60000 | STD | 1536 | 60000 | -- | 0.472 (12.00mm) | 14 mm | 14 mm | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AX115S4F45I3SG | ALTERA | Datasheet | 554 |
| Min: 1 Mult: 1 | Through Hole | 1932-BBGA, FCBGA | 1932-FBGA, FC (45x45) | 40 Ohms | Silver Tin Oxide (AgSnO) | American Zettler | 624 | Box | Active | -55°C ~ 85°C | AZ2100 | Active | 0.87 V ~ 0.93 V | PC Pin, Quick Connect - 0.250 (6.3mm) | SPDT (1 Form C) | General Purpose | 1150000 | 15 ms | 6VDC | Non Latching | 300VAC, 30VDC - Max | 150 mA | 10 ms | 68857856 | 4.5 VDC | 40 A | 427200 | 0.6 VDC | - | Class B | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC4028XL-3HQ304C | AMD | Datasheet | 651 | - | Min: 1 Mult: 1 | Panel Mount, Through Hole, Right Angle | 304-BFQFP Exposed Pad | Bulkhead - Front Side Nut | 304-PQFP (40x40) | Polypropylene (PP) | Zinc Die Cast | Gold | Phosphor Bronze | XC4028XL | 1GHz | -- | AMD | 256 | Tray | Obsolete | 500V | -55°C ~ 85°C | Bulk | -- | Active | -- | Jack, Female Socket | Bayonet Lock | 3V ~ 3.6V | -- | Silver, White | 50 Ohm | BNC | 1 | 500 | Solder | 2432 | -- | 32768 | 28000 | 1024 | 0.2dB | Nickel | -- | Solder | Board Lock, Isolated | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCV200E-7PQ240C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount, Through Hole, Right Angle | 240-BFQFP | Bulkhead - Front Side Nut | 240-PQFP (32x32) | Polypropylene (PP) | Zinc Die Cast | Gold | Phosphor Bronze | XCV200E | 1GHz | -- | AMD | 158 | Tray | Obsolete | 500V | -55°C ~ 85°C | Tray | -- | Active | -- | Jack, Female Socket | Bayonet Lock | 1.71V ~ 1.89V | -- | Black, Silver | 75 Ohm | BNC | 1 | 500 | Solder | 5292 | -- | 114688 | 306393 | 1176 | 0.2dB | Nickel | -- | Solder | Board Guide, Isolated | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M08SAM153C8G | ALTERA | Datasheet | 8000 |
| Min: 1 Mult: 1 | Surface Mount | Chassis Mount | 153-VFBGA | YES | 153 | 153-MBGA (8x8) | 153 | 402 MHz | 40 Ohms | Silver Cadmium Oxide (AgCdO) | INTEL CORP | -- | Intel Corporation | 10M08SAM153C8G | American Zettler | 3 | 112 | 85 °C | Box | PLASTIC/EPOXY | VFBGA | VFBGA, BGA153,15X15,20 | BGA153,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.53 | Compliant | Yes | 3.15 V | 2.85 V | 3 V | -55°C ~ 85°C | AZ2280 | Active | -- | 85 °C | 0 °C | OPERATES AT 3.3V NOMINAL VCC | 8542.39.00.01 | 2.85 V ~ 3.465 V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | Quick Connect - 0.187/0.250 | S-PBGA-B153 | 112 | OTHER | 47.3 kB | SPDT (1 Form C) | 112 | 500 CLBS | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | General Purpose | 8000 | 15 ms | 6VDC | Non Latching | 277VAC, 28VDC - Max | 150 mA | 10 ms | 387072 | 4.5 VDC | 20 A | 500 | 0.6 VDC | 500 | 8 | Sealed - Fully | 500 | 8000 | Class F | - | 8 mm | 8 mm |
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XC4952XLA-09BG432I
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCR3064XL VQ44
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL060V5-VQG100I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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10AX115S4F45I3SG
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
8,213.270532
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XC4028XL-3HQ304C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCV200E-7PQ240C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
10M08SAM153C8G
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
33.151931