The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Features
- Mounting Type
- Operating Temperature
- Series
- Base Product Number
- Mfr
- Number of I/Os
- Number of Logic Elements/Cells
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- Part Status
- Product Status
- Additional Feature
- Operating Temperature:
-65°C ~ 125°C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Dielectric Material | Housing Material | Material - Insulation | Number of Terminals | Shell Material, Finish | Base Product Number | Clock Frequency-Max | Contact Materials | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rated | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Part Status | Termination | Connector Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Number of Rows | Gender | Additional Feature | HTS Code | Subcategory | Contact Type | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Contact Finish | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Wire Gauge | Temperature Grade | Card Type | Read Out | Number of Positions/Bay/Row | Flange Feature | Max Supply Voltage | Min Supply Voltage | Connector Style | RAM Size | Q @ Freq | Contact Form | Shell Size, Connector Layout | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Adjustment Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Backset Spacing | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Capacitance Range | Number of Equivalent Gates | Features | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness | Card Thickness | Material Flammability Rating | Radiation Hardening |
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![]() | Mfr Part No XC95144-TQ100AE-10C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Diallyl Phthalate (DAP) | 336-016 | Copper Alloy | EDAC Inc. | Bulk | Active | -65°C ~ 125°C | 336 | Wire Wrap | 16 | Green | 1 | Female | Cantilever | 0.156 (3.96mm) | Gold | Non Specified - Single Edge | Single | 16 | - | - | 10.0µin (0.25µm) | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XA7S100-2FGGA484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 484-BGA | 484-FPBGA (23x23) | Polytetrafluoroethylene (PTFE) | XA7S100 | AMD | 338 | Tray | Active | 1000V | -65°C ~ 125°C | E_HV | 0.300 Dia (7.62mm) | Active | 0.95V ~ 1.05V | 2000 @ 100MHz | Side | 102400 | 4423680 | 8000 | 1 ~ 16pF | General Purpose | 0.500 (12.70mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EX128-FTQ100 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 100-LQFP | YES | 100-TQFP (14x14) | Polyester Thermoplastic, Glass Filled | 100 | -- | EX128 | 178 MHz | Copper Alloy | MICROSEMI CORP | -- | Microsemi Corporation | EX128-FTQ100 | Microchip Technology | 3 | 70 | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-100 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.59 | No | 2.7 V | 2.3 V | 2.5 V | -- | -65°C ~ 125°C | Bulk | MDVB | e0 | Active | Solder Cup | Receptacle, Female Sockets | 31 | Tin/Lead (Sn/Pb) | -- | 2 | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | Signal | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 225 | -- | 0.5 mm | unknown | 3A | Gold | S-PQFP-G100 | 24-32 AWG | COMMERCIAL | Housing/Shell (Unthreaded) | D-Type, Micro-D | -- | 0.050 Pitch x 0.043 Row to Row | 6000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 256 | 6000 | -- | 1.4 ns | 6000 | -- | 14 mm | 14 mm | -- | -- | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX36-3PQG240I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | YES | 240 | Polytetrafluoroethylene (PTFE) | 240 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A42MX36-3PQG240I | 3 | 202 | 85 °C | -40 °C | PLASTIC/EPOXY | FQFP | FQFP, QFP240,1.3SQ,20 | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | 40 | 5.81 | Compliant | Yes | 3.6 V | 3 V | 3.3 V | 500V | -65°C ~ 125°C | A1_HV | -- | e3 | Active | MATTE TIN | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G240 | 202 | Not Qualified | 5 V | 3.3,3.3/5,5 V | INDUSTRIAL | 5.5 V | 3 V | 320 B | 3000 @ 100MHz | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | Top | 1184 | 54000 | 180 MHz | 1184 | 3 | 1822 | 1.9 ns | 2438 | 2438 | 0.5 ~ 8pF | 54000 | Sealed | 3.4 mm | 0.440 (11.18mm) | 32 mm | 32 mm | No |
XC95144-TQ100AE-10C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XA7S100-2FGGA484I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EX128-FTQ100
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A42MX36-3PQG240I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
