The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Operating Temperature
- Series
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- Supplier Device Package
- Voltage - Supply
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- Number of I/Os
- Total RAM Bits
- Number of Logic Elements/Cells
- Number of LABs/CLBs
- Part Status
- Base Part Number
- Operating Temperature:
0°C ~ 85°C (TJ)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Number of Registers | Number of CLBs | Max Junction Temperature (Tj) | Number of Logic Cells | Ambient Temperature Range High | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No A3P060-FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | 160 | MICROSEMI CORP | A3P060-FG144 | 350 MHz | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 96 I/O | - | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.52 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P060 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | STD | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLP125V2-CSG281 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CSP-281 | YES | 281-CSP (10x10) | 281 | AGLP125 | 160 MHz | 184 | MICROSEMI CORP | AGLP125V2-CSG281 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 212 I/O | 70 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA281,19X19,20 | BGA281,19X19,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Obsolete | NOT SPECIFIED | 5.25 | Details | Yes | 1.575 V | 1.14 V | 1.5 V | IGLOO PLUS | 0°C ~ 85°C (TJ) | Tray | AGLP125V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B281 | 212 | Not Qualified | 1.2 V to 1.5 V | 1.2/1.5 V | COMMERCIAL | 212 | 3120 CLBS, 125000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 3120 | 36864 | 125000 | STD | 3120 | 3120 | 125000 | 0.71 mm | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | A3PE3000-FGG484 | 350 MHz | + 85 C | FLASH | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 341 I/O | 35000 LE | 70 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.58 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 516096 bit | ProASIC3 | 0.861390 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 341 | Not Qualified | 1.425 V to 1.575 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 128 B | 25 mA | 63 kB | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 35000 | 516096 | 3000000 | 231 MHz | STD | - | 75264 | 75264 | 85 °C | 75264 | 70 °C | 3000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||
| Mfr Part No AFS1500-FGG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS1500 | 90 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.0989 GHz | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.0989 GHz | STD | 38400 | 1.2 mm | 17 mm | 17 mm | No | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000-FGG324 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | 350 MHz | 84 | MICROSEMI CORP | A3PE3000-FGG324 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 221 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B324 | 221 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 25 mA | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 231 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | Lead Free | ||||||||||||||||||||||||||||||
| Mfr Part No A3P060-VQ100 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | 71 | 1536 | A3P060 | 350 MHz | 60000 | 90 | ProASIC®3 | MICROSEMI CORP | A3P060-VQ100 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 71 I/O | 60000 | 1.575(V) | 1.425(V) | 1.5(V) | 0C to 85C | 85C | 0C | Commercial | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | VQFP | Active | 130NM | Active | Yes | No | 30 | 1.49 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P060 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 231(MHz) | 100 | S-PQFP-G100 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | STD | 1536 | 60000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | 484-FPBGA (23x23) | A3PE600 | 60 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 270 I/O | - | 6500 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 110592 bit | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3PE600 | 1.425V ~ 1.575V | 1.5 V | 5 mA | 700 Mb/s | 110592 | 600000 | STD | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-2FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3P1000 | 350 MHz | 60 | MICROSEMI CORP | A3P1000-2FGG484 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000-2FGG896 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 27 | MICROSEMI CORP | A3PE3000-2FGG896 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 620 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 310 MHz | 2 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P1000 | 350 MHz | 60 | MICROSEMI CORP | M1A3P1000-FGG484 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-2FGG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-2FGG256 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 157 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-2FGG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-2FGG144 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLP030V2-VQG128 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VTQFP | YES | 128-VTQFP (14x14) | 128 | AGLP030 | 160 MHz | 90 | MICROSEMI CORP | AGLP030V2-VQG128 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 101 I/O | 70 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, TQFP128,.63SQ,16 | TQFP128,.63SQ,16 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.59 | Details | Yes | 1.575 V | 1.14 V | 1.5 V | IGLOO PLUS | 0°C ~ 85°C (TJ) | Tray | AGLP030V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | GULL WING | NOT SPECIFIED | 0.4 mm | compliant | S-PQFP-G128 | 101 | Not Qualified | 1.2 V to 1.5 V | 1.2/1.5 V | COMMERCIAL | 16 uA | 101 | 792 CLBS, 30000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | 30000 | STD | 792 | 792 | 30000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010-VF256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL010 | 119 | MICROSEMI CORP | M2GL010-VF256 | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 138 I/O | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL010 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | STD | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-1FGG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-1FGG256 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 157 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLP125V5-CS281 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CSP-281 | YES | 281-CSP (10x10) | 281 | AGLP125 | 250 MHz | 184 | MICROSEMI CORP | AGLP125V5-CS281 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 212 I/O | 70 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA281,19X19,20 | BGA281,19X19,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Obsolete | NOT SPECIFIED | 5.26 | N | No | 1.575 V | 1.425 V | 1.5 V | IGLOO PLUS | 0°C ~ 85°C (TJ) | Tray | AGLP125V5 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | S-PBGA-B281 | 212 | Not Qualified | 1.5 V | 1.5 V | COMMERCIAL | 212 | 3120 CLBS, 125000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 3120 | 36864 | 125000 | STD | 3120 | 3120 | 125000 | 0.71 mm | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE1500-PQG208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3PE1500 | 350 MHz | 24 | MICROSEMI CORP | M1A3PE1500-PQG208 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 147 I/O | 70 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.59 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3PE1500 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | STD | 38400 | 38400 | 1500000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | AFS1500 | 60 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 223 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.0989 GHz | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.0989 GHz | 38400 | 1.73 mm | 23 mm | 23 mm | No | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | M1AFS600 | 90 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 1 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-1FG144 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 13 mm | 13 mm |
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