The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Operating Temperature
- Series
- Package / Case
- Supplier Device Package
- Voltage - Supply
- Mounting Type
- Number of I/Os
- Total RAM Bits
- Number of Logic Elements/Cells
- Number of LABs/CLBs
- Part Status
- Base Part Number
- Operating Temperature:
0°C ~ 85°C (TJ)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No M1A3P1000-2FGG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-2FGG144 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||
![]() | Mfr Part No M2GL010T-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M2GL010 | 60 | MICROSEMI CORP | M2GL010T-1FGG484 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 233 I/O | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.57 | Details | Yes | FPGA - Field Programmable Gate Array IGLOO 2 | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL010T | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | OTHER | 1.26 V | 1.14 V | 114 kB | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 1 | 4 Transceiver | 12084 | 23 mm | 23 mm | No | Lead Free | ||||||||||||||||||
![]() | Mfr Part No A3P1000-2FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3P1000 | 350 MHz | 60 | MICROSEMI CORP | A3P1000-2FG484 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||
![]() | Mfr Part No AFS600-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | AFS600 | 60 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 172 I/O | 7000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.28205 GHz | 1 | 13824 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL050T-1FCS325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL050 | 176 | MICROSEMI CORP | M2GL050T-1FCS325 | Microchip Technology | Yes | 200 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL050T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 200 | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE1500-1PQG208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | A3PE1500 | 350 MHz | 24 | MICROSEMI CORP | A3PE1500-1PQG208 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 147 I/O | 70 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.61 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3PE1500 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 272 MHz | 1 | 38400 | 38400 | 38400 | 1500000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||
![]() | Mfr Part No M2GL025TS-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | 484-FPBGA (23x23) | M2GL025 | 60 | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 267 I/O | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL025TS | 1.14V ~ 2.625V | 1.2 V | 27696 | 1130496 | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL010TS-VFG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL010 | 119 | MICROSEMI CORP | M2GL010TS-VFG256 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 138 I/O | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL010TS | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 2 Transceiver | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS600-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS600 | 90 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | 7000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.28205 GHz | 1 | 13824 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P600L-1FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 350 MHz | 60 | MICROSEMI CORP | M1A3P600L-1FG484 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 235 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3P600L | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||
![]() | Mfr Part No AFS250-2FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS250 | 90 | MICROSEMI CORP | AFS250-2FG256 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 114 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS250 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1.47059 GHz | 2 | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||
![]() | Mfr Part No A3PE600-2FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | A3PE600 | 90 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 165 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 2 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000L-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000L-1FG256 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 70 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000L | e0 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||
![]() | Mfr Part No M2GL060-1FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-676 | 676-FBGA (27x27) | M2GL060 | 40 | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 387 I/O | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL060 | 1.14V ~ 2.625V | 1.2 V | 56520 | 1869824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P400-FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M1A3P400 | 350 MHz | 90 | MICROSEMI CORP | M1A3P400-FG256 | Microchip Technology | Yes | 3 | SMD/SMT | 178 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000L-FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000L-FG144 | 781.25 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 70 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000L | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||
![]() | Mfr Part No P1AFS600-2FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | P1AFS600 | 60 | Microchip Technology | Yes | 172 | Tray | Active | N | This product may require additional documentation to export from the United States. | Fusion | 0°C ~ 85°C (TJ) | Tray | P1AFS600 | 1.425V ~ 1.575V | 110592 | 600000 | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL060-1FCSG325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL060 | 176 | MICROSEMI CORP | M2GL060-1FCSG325 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 200 I/O | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL060 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 1.2 V | OTHER | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE600-2FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | A3PE600 | 60 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 270 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 2 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL050T-FCS325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL050 | 176 | MICROSEMI CORP | M2GL050T-FCS325 | Microchip Technology | Yes | 200 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL050T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 200 | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 |
M1A3P1000-2FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL010T-1FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AFS600-1FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL050T-1FCS325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE1500-1PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL025TS-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL010TS-VFG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AFS600-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P600L-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AFS250-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE600-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000L-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL060-1FG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000L-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
P1AFS600-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL060-1FCSG325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE600-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M2GL050T-FCS325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
