The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Number of Gates
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- Package / Case:
144-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Contact Materials | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shell Sizes | Shell Style# | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Power Rating | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Contact Gender | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Speed Grade | Number of Transceivers | Resistance Tolerance | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Contact Configuration | Product Category | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No A3P250-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P250 | Microchip Technology / Atmel | 350 MHz | 160 | MICROSEMI CORP | Microchip | A3P250-FGG144 | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.32 | Details | Yes | FPGA - Field Programmable Gate Array A3P250-FGG144 LEAD FREE | 1.575 V | 1.425 V | 1.5 V | 36864 bit | ProASIC3 | 1.5000 V | 0.013369 oz | 0 to 70 °C | Tray | ProASIC3 | e1 | 100 ppm/K | 470 Ohm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | 0.25 W | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | General Purpose | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 3 mA | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 1 | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600-FG144I | PEI-Genesis | 3 | 97 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | * | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 231 MHz | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P125-FG144T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | 144-FPBGA (13x13) | A3P125 | Microchip Technology | 97 | Tray | Active | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | 1.425V ~ 1.575V | 36864 | 125000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-1FG144T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P060-1FG144T | Microchip Technology | 3 | 96 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.23 | No | 1.575 V | 1.425 V | 1.5 V | Automotive grade | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 235 | 1 mm | compliant | S-PBGA-B144 | 96 | Not Qualified | 1.5/3.3 V | AUTOMOTIVE | 96 | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | AEC-Q100 | 1 | 1536 | 1536 | 60000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL125V5-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL125 | 108 MHz | MICROSEMI CORP | Greenlee | 02446 | 1.575 V | Microchip Technology | 1.425 V | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.46 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | OTHER | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA075-FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | APA075 | 180 MHz | MICROSEMI CORP | Allied Moulded Products | APA075-FGG144I | Microchip Technology | 3 | 100 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.28 | Yes | 2.7 V | 2.3 V | 2.5 V | -40°C ~ 85°C (TA) | ProASICPLUS | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 100 | Not Qualified | 2.5,2.5/3.3 V | INDUSTRIAL | 100 | 75000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 27648 | 75000 | 3072 | 75000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA450-FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771 mg | APA450 | 2.7 V | Microchip Technology | 2.3 V | 100 | Tray | Active | Compliant | 2.5000 V | -40 to 85 °C | ProASICPLUS | 85 °C | -40 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 13.5 kB | 110592 | 450000 | 180 MHz | STD | 12288 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX08-FG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A54SX08 | 240 MHz | MICROSEMI CORP | Microsemi Corporation | A54SX08-FG144 | 3.63, 5.25 V | Microchip Technology | 2.97, 4.75 V | 3 | 111 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | No | 3.6 V | 3 V | 3.3 V | 3.3, 5 V | 0 to 70 °C | SX | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 111 | Not Qualified | 3.3,5 V | COMMERCIAL | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 12000 | 768 | STD | 0.9 ns | 768 | 768 | 8000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V5-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL1000 | 108 MHz | Silver Plated | MICROSEMI CORP | Joy Cooper Interconnect | C3100A36-9SN | Microchip Technology | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.37 | No | Yes | 36 | Wall Mounting Receptacle | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 70°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | Socket | OTHER | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | https://docs.galco.com/techdoc/coh/c3100a36-9sn_cf.pdf | 2.44 Inches | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-2FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600-2FGG144I | 1.575 V | Microchip Technology | 1.425 V | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.33 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-1FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600-1FG144I | 1.575 V | Microchip Technology | 1.425 V | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL125V2-FG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL125 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL125V2-FG144 | 1.575 V | Microchip Technology | 1.14 V | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.28 | No | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | 0 to 70 °C | IGLOO | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | OTHER | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600-FGG144I | Microchip Technology | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | No | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FG144T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P1000-FG144T | Microchip Technology | 3 | 97 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.23 | No | 1.575 V | 1.425 V | 1.5 V | Automotive grade | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 235 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5/3.3 V | AUTOMOTIVE | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | AEC-Q100 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1FG144T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P1000-1FG144T | Microchip Technology | 3 | 97 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.23 | No | 1.575 V | 1.425 V | 1.5 V | Automotive grade | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e0 | TIN LEAD SILVER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 235 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5/3.3 V | AUTOMOTIVE | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | AEC-Q100 | 1 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-2FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P400 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P400-2FG144I | 1.575 V | Microchip Technology | 1.425 V | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 2 | 9216 | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL1000V2-FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | M1AGL1000V2-FGG144I | Microchip Technology | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.32 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 85°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 127 µA | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 250 MHz | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-1FG144T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P250 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P250-1FG144T | Analog Devices Inc. | 3 | 97 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.23 | No | 1.575 V | 1.425 V | 1.5 V | Automotive grade | -40°C ~ 125°C (TA) | - | e0 | TIN LEAD SILVER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 235 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5/3.3 V | AUTOMOTIVE | 97 | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | AEC-Q100 | 1 | 6144 | 6144 | 250000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-2FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600-2FGG144 | Microchip Technology | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.35 | Non-Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 85°C (TJ) | ProASIC3 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL125V5-FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL125 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL125V5-FG144I | Microchip Technology | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.28 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 85°C (TA) | IGLOO | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 13 mm | 13 mm |
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A3P250-FGG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P600-FG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P125-FG144T
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1FG144T
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL125V5-FGG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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APA075-FGG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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APA450-FGG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A54SX08-FG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL1000V5-FGG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P600-2FGG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P600-1FG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL125V2-FG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P600-FGG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000-FG144T
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000-1FG144T
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P400-2FG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-FGG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-1FG144T
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P600-2FGG144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL125V5-FG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire