The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Logic Elements/Cells
- Operating Temperature
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- Series
- Voltage - Supply
- Factory Lead Time
- Package / Case:
256-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitive | Moisture Sensitivity Levels | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Nominal Supply Current | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Speed Grade | Output Function | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Dedicated Inputs | Number of Equivalent Gates | Height Seated (Max) | Length | Width | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No AFS600-1FGG256K | Microchip Technology | Datasheet | 1860 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | AFS600 | 90 | Microchip Technology | Yes | 119 | 7000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | AFS600 | 100 °C | -55 °C | 1.425V ~ 1.575V | 13.5 kB | 110592 | 600000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7A50T-2FTG256C | Xilinx Inc. | Datasheet | 396 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | 170 | 0°C~85°C TJ | Tray | 2010 | Artix-7 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | NOT SPECIFIED | 256 | 170 | Not Qualified | 1V | 1V | 337.5kB | 850 ps | FIELD PROGRAMMABLE GATE ARRAY | 52160 | 2764800 | 4075 | 2 | 65200 | 1.05 ns | 1.55mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10M04DCF256C8G | Intel | Datasheet | - |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 178 | 0°C~85°C TJ | Tray | MAX® 10 | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B256 | 178 | Not Qualified | 1.2V | 178 | FIELD PROGRAMMABLE GATE ARRAY | 4000 | 193536 | 250 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M16DAF256C8G | Intel | Datasheet | 160 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 178 | 0°C~85°C TJ | Tray | MAX® 10 | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B256 | 178 | Not Qualified | 1.2V | 178 | FIELD PROGRAMMABLE GATE ARRAY | 16000 | 562176 | 1000 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP4CE22F17C9LN | Intel | Datasheet | 227 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 153 | 0°C~85°C TJ | Tray | Cyclone® IV E | e1 | Active | 3 (168 Hours) | 256 | TIN SILVER COPPER | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 260 | 1V | 1mm | 40 | EP4CE22 | S-PBGA-B256 | 153 | Not Qualified | 11.2/3.32.5V | 265MHz | 153 | FIELD PROGRAMMABLE GATE ARRAY | 22320 | 608256 | 1395 | 1.55mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-1FG256K | Microchip Technology | Datasheet | 552 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 256 | AFS600 | 90 | MICROSEMI CORP | AFS600-1FG256K | Microchip Technology | Yes | 3 | 119 | 7000 LE | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.29 | N | No | 8542320050, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | -55°C ~ 100°C (TJ) | Tray | AFS600 | e0 | Tin/Lead (Sn/Pb) | 100 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | OTHER | 13.5 kB | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP2C20AF256A7N | Intel | Datasheet | 16 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 152 | -40°C~125°C TJ | Tray | Cyclone® II | e1 | Active | 3 (168 Hours) | 256 | TIN SILVER COPPER | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | EP2C20 | S-PBGA-B256 | Not Qualified | 450MHz | FIELD PROGRAMMABLE GATE ARRAY | 18752 | 239616 | 1172 | 1.55mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP4CE22F17I7 | Intel | Datasheet | 60 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 153 | -40°C~100°C TJ | Tray | Cyclone® IV E | e0 | Active | 3 (168 Hours) | 256 | TIN LEAD | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP4CE22 | S-PBGA-B256 | 153 | Not Qualified | 1.21.2/3.32.5V | 472.5MHz | 153 | FIELD PROGRAMMABLE GATE ARRAY | 22320 | 608256 | 1395 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC6SLX16-L1FTG256I | Xilinx Inc. | Datasheet | 27 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | 186 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1V | 1mm | 30 | XC6SLX16 | 256 | 186 | Not Qualified | 1V | 12.5/3.3V | 72kB | FIELD PROGRAMMABLE GATE ARRAY | 14579 | 589824 | 1139 | 18224 | 0.46 ns | 1.55mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XA6SLX16-2FTG256I | Xilinx Inc. | Datasheet | 56 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | 186 | Automotive grade | -40°C~100°C TJ | Tray | 2008 | Automotive, AEC-Q100, Spartan®-6 LX XA | e1 | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1mm | 30 | XA6SLX16 | 186 | Not Qualified | 1.2V | 72kB | FIELD PROGRAMMABLE GATE ARRAY | 14579 | 589824 | 1139 | 2 | 18224 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP4CE6F17C8 | Intel | Datasheet | 47 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 179 | 0°C~85°C TJ | Tray | 2016 | Cyclone® IV E | e0 | Active | 3 (168 Hours) | 256 | TIN LEAD | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP4CE6 | S-PBGA-B256 | 179 | Not Qualified | 1.21.2/3.32.5V | 472.5MHz | 179 | FIELD PROGRAMMABLE GATE ARRAY | 6272 | 276480 | 392 | 392 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7A35T-L1FTG256I | Xilinx Inc. | Datasheet | 792 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | 170 | -40°C~100°C TJ | Tray | 2010 | Artix-7 | e1 | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 0.95V | 1mm | NOT SPECIFIED | 225kB | FIELD PROGRAMMABLE GATE ARRAY | 33208 | 1843200 | 2600 | 1.27 ns | 1.55mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7A75T-1FTG256C | Xilinx Inc. | Datasheet | 2274 | - | Min: 1 Mult: 1 | 12 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 256-LBGA | 256 | 170 | 0°C~85°C TJ | Tray | 2010 | Artix-7 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | 256 | 170 | Not Qualified | 1V | 472.5kB | 1.09 ns | 1.09 ns | FIELD PROGRAMMABLE GATE ARRAY | 75520 | 3870720 | 5900 | 1 | 94400 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1AFS600-2FGG256I | Microchip Technology | Datasheet | 2182 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | P1AFS600 | 90 | Microchip Technology | Yes | 119 | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | -40°C ~ 100°C (TJ) | Tray | P1AFS600 | 1.425V ~ 1.575V | 110592 | 600000 | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-1FGG256K | Microchip Technology | Datasheet | 520 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | AFS1500 | 90 | Microchip Technology | Yes | 119 | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | -55°C ~ 100°C (TJ) | Tray | AFS1500 | 100 °C | -55 °C | 1.425V ~ 1.575V | 33.8 kB | 276480 | 1.5e+06 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M25DAF256C7G | Intel | Datasheet | 16 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 178 | 0°C~85°C TJ | Tray | MAX® 10 | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B256 | 178 | Not Qualified | 1.2V | 178 | FIELD PROGRAMMABLE GATE ARRAY | 25000 | 691200 | 1563 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP4CE22F17A7N | Intel | Datasheet | 30 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 153 | -40°C~125°C TJ | Tray | Cyclone® IV E | e1 | Active | 3 (168 Hours) | 256 | TIN SILVER COPPER | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | EP4CE22 | S-PBGA-B256 | 153 | Not Qualified | 1.21.2/3.32.5V | 472.5MHz | 153 | FIELD PROGRAMMABLE GATE ARRAY | 22320 | 608256 | 1395 | 1.55mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP3C5F256A7N | Intel | Datasheet | 30 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 182 | -40°C~125°C TJ | Tray | Cyclone® III | Active | 3 (168 Hours) | 256 | EAR99 | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 2.5V | 1mm | EP3C5 | S-PBGA-B256 | 182 | Not Qualified | 1.2/3.3V | 182 | FIELD PROGRAMMABLE GATE ARRAY | 5136 | 423936 | 321 | 3.5mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO2280E-4FTN256C | Lattice Semiconductor Corporation | Datasheet | 978 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | SRAM | 211 | 0°C~85°C TJ | Tray | 2007 | MachXO | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | not_compliant | 420MHz | 40 | LCMXO2280 | 256 | 211 | Not Qualified | 1.2V | 20mA | 20mA | 4.4 ns | FLASH PLD | 2280 | 28262 | 285 | MACROCELL | 1140 | 7 | 1.55mm | 17mm | 17mm | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC6SLX16-3FT256C | Xilinx Inc. | Datasheet | 50 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | 186 | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e0 | no | Active | 3 (168 Hours) | 256 | EAR99 | 1.14V~1.26V | BOTTOM | BALL | 240 | 1.2V | 1mm | not_compliant | 30 | XC6SLX16 | 256 | 186 | Not Qualified | 1.2V | 72kB | 862MHz | FIELD PROGRAMMABLE GATE ARRAY | 14579 | 589824 | 1139 | 3 | 18224 | 0.21 ns | 1.55mm | 17mm | 17mm | Non-RoHS Compliant |
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AFS600-1FGG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
368.243825
-
XC7A50T-2FTG256C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
10M04DCF256C8G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
17.895372
-
10M16DAF256C8G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
EP4CE22F17C9LN
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AFS600-1FG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
717.678525
-
EP2C20AF256A7N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
100.323634
-
EP4CE22F17I7
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
XC6SLX16-L1FTG256I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
XA6SLX16-2FTG256I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
53.599673
-
EP4CE6F17C8
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC7A35T-L1FTG256I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
XC7A75T-1FTG256C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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P1AFS600-2FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
520.521617
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AFS1500-1FGG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
975.904510
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10M25DAF256C7G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP4CE22F17A7N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP3C5F256A7N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO2280E-4FTN256C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
42.924691
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XC6SLX16-3FT256C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
65.661559