The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Logic Elements/Cells
- Operating Temperature
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- RoHS Status
- Series
- Voltage - Supply
- Factory Lead Time
- Package / Case:
256-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Memory Types | Mfr | Moisture Sensitive | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Memory Size | Operating Supply Current | Nominal Supply Current | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Output Function | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Dedicated Inputs | Number of Equivalent Gates | Height Seated (Max) | Length | Width | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No LCMXO2280E-3FTN256I | Lattice Semiconductor Corporation | Datasheet | 33 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | SRAM | 211 | -40°C~100°C TJ | Tray | 2013 | MachXO | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | not_compliant | 40 | LCMXO2280 | 256 | 211 | Not Qualified | 1.2V | 20mA | 20mA | 5.1 ns | 5.1 ns | FLASH PLD | 2280 | 28262 | 500MHz | 285 | MACROCELL | 1140 | 7 | 1.55mm | 17mm | 17mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP4CE6F17I8LN | Intel | Datasheet | 1797 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 179 | -40°C~100°C TJ | Tray | 2016 | Cyclone® IV E | e1 | Active | 3 (168 Hours) | 256 | TIN SILVER COPPER | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 260 | 1V | 1mm | 40 | EP4CE6 | S-PBGA-B256 | 179 | Not Qualified | 11.2/3.32.5V | 362MHz | 179 | FIELD PROGRAMMABLE GATE ARRAY | 6272 | 276480 | 392 | 392 | 1.55mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP4CE10F17I7 | Intel | Datasheet | 16 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 179 | -40°C~100°C TJ | Tray | 2016 | Cyclone® IV E | e0 | Active | 3 (168 Hours) | 256 | TIN LEAD | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP4CE10 | S-PBGA-B256 | 179 | Not Qualified | 1.21.2/3.32.5V | 472.5MHz | 179 | FIELD PROGRAMMABLE GATE ARRAY | 10320 | 423936 | 645 | 645 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M50DAF256C8G | Intel | Datasheet | 864 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 178 | 0°C~85°C TJ | Tray | MAX® 10 | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B256 | 178 | Not Qualified | 1.2V | 178 | FIELD PROGRAMMABLE GATE ARRAY | 50000 | 1677312 | 3125 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP3C16F256A7N | Intel | Datasheet | 2085 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 168 | -40°C~125°C TJ | Tray | Cyclone® III | Active | 3 (168 Hours) | 256 | 3A991 | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 2.5V | 1mm | EP3C16 | S-PBGA-B256 | 168 | Not Qualified | 1.2/3.3V | 168 | FIELD PROGRAMMABLE GATE ARRAY | 15408 | 516096 | 963 | 3.5mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP3C10F256C7 | Intel | Datasheet | 192 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 182 | 0°C~85°C TJ | Tray | 2009 | Cyclone® III | e0 | Active | 3 (168 Hours) | 256 | EAR99 | TIN LEAD | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP3C10 | S-PBGA-B256 | 182 | Not Qualified | 472.5MHz | 182 | FIELD PROGRAMMABLE GATE ARRAY | 10320 | 423936 | 645 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO2-4000HC-5FTG256C | Lattice Semiconductor Corporation | Datasheet | 20 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | FLASH | 206 | 0°C~85°C TJ | Tray | 2000 | MachXO2 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~3.465V | BOTTOM | BALL | 260 | 2.5V | 1mm | not_compliant | 30 | LCMXO2-4000 | 207 | Not Qualified | 2.5V | 2.5/3.3V | 27.8kB | 128μA | 11.5kB | FIELD PROGRAMMABLE GATE ARRAY | 4320 | 94208 | 133MHz | 540 | 2160 | 1.55mm | 17mm | 17mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M1AFS600-1FGG256K | Microchip Technology | Datasheet | 640 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-1FGG256K | Microchip Technology | Yes | 3 | 119 | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XA6SLX9-2FTG256I | Xilinx Inc. | Datasheet | 2400 | - | Min: 1 Mult: 1 | 11 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | 186 | Automotive grade | -40°C~100°C TJ | Tray | 2008 | Automotive, AEC-Q100, Spartan®-6 LX XA | e1 | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1mm | 30 | XA6SLX9 | 186 | Not Qualified | 1.2V | 72kB | FIELD PROGRAMMABLE GATE ARRAY | 9152 | 589824 | 715 | 2 | 11440 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LCMXO2-2000HE-4FTG256I | Lattice Semiconductor Corporation | Datasheet | 33 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | FLASH | 206 | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | not_compliant | 30 | LCMXO2-2000 | 207 | Not Qualified | 1.2V | 21.3kB | 82μA | 9.3kB | FIELD PROGRAMMABLE GATE ARRAY | 2112 | 75776 | 133MHz | 264 | 1056 | 1.55mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S200-5FT256C | Xilinx Inc. | Datasheet | 33 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | 173 | 0°C~85°C TJ | Tray | 1998 | Spartan®-3 | e0 | no | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 1.14V~1.26V | BOTTOM | BALL | 240 | 1.2V | 1mm | 30 | XC3S200 | 256 | 173 | Not Qualified | 1.2V | 27kB | FIELD PROGRAMMABLE GATE ARRAY | 4320 | 221184 | 200000 | 480 | 5 | 480 | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP3C25F256C6 | Intel | Datasheet | 16 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 156 | 0°C~85°C TJ | Tray | 2009 | Cyclone® III | e0 | Active | 3 (168 Hours) | 256 | 3A991 | TIN LEAD | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP3C25 | S-PBGA-B256 | 156 | Not Qualified | 472.5MHz | 156 | FIELD PROGRAMMABLE GATE ARRAY | 24624 | 608256 | 1539 | 1.55mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LCMXO1200E-3FT256C | Lattice Semiconductor Corporation | Datasheet | 64 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA | 256 | SRAM | 211 | 0°C~85°C TJ | Tray | 2009 | MachXO | e0 | no | Obsolete | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | LCMXO1200 | 256 | 211 | Not Qualified | 1.2V | 18mA | 18mA | 5.1 ns | FLASH PLD | 1200 | 9421 | 500MHz | 150 | MACROCELL | 600 | 7 | 1.55mm | 17mm | 17mm | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP4CE15F17C6 | Intel | Datasheet | 30 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 165 | 0°C~85°C TJ | Tray | 2016 | Cyclone® IV E | e0 | Active | 3 (168 Hours) | 256 | TIN LEAD | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP4CE15 | S-PBGA-B256 | 165 | Not Qualified | 1.21.2/3.32.5V | 472.5MHz | 165 | FIELD PROGRAMMABLE GATE ARRAY | 15408 | 516096 | 963 | 963 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M08DAF256C7G | Intel | Datasheet | 33 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 178 | 0°C~85°C TJ | Tray | MAX® 10 | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B256 | 178 | Not Qualified | 1.2V | 178 | FIELD PROGRAMMABLE GATE ARRAY | 8000 | 387072 | 500 | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M25DCF256C7G | Intel | Datasheet | 30 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 178 | 0°C~85°C TJ | Tray | MAX® 10 | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.15V~1.25V | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B256 | 178 | Not Qualified | 1.2V | 178 | FIELD PROGRAMMABLE GATE ARRAY | 25000 | 691200 | 1563 | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LCMXO2-2000ZE-1FTG256I | Lattice Semiconductor Corporation | Datasheet | 99 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | FLASH | 206 | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | not_compliant | 104MHz | 30 | LCMXO2-2000 | 207 | Not Qualified | 1.2V | 21.3kB | 82μA | 9.3kB | 10.21 ns | FIELD PROGRAMMABLE GATE ARRAY | 2112 | 75776 | 264 | 1056 | 1.55mm | 17mm | 17mm | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS1500-FG256K | Microchip Technology | Datasheet | 737 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS1500 | 90 | MICROSEMI CORP | M1AFS1500-FG256K | Microchip Technology | Yes | 3 | 119 | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.3 | N | No | 1.575 V | 1.425 V | 1.5 V | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS1500 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 1500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1500000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP4CE22F17C8LN | Intel | Datasheet | 724 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 153 | 0°C~85°C TJ | Tray | Cyclone® IV E | e1 | Active | 3 (168 Hours) | 256 | TIN SILVER COPPER | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 260 | 1V | 1mm | 40 | EP4CE22 | S-PBGA-B256 | 153 | Not Qualified | 11.2/3.32.5V | 362MHz | 153 | FIELD PROGRAMMABLE GATE ARRAY | 22320 | 608256 | 1395 | 1.55mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S400AN-4FT256C | Xilinx Inc. | Datasheet | 33 |
| Min: 1 Mult: 1 | 16 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | 195 | 0°C~85°C TJ | Tray | 2007 | Spartan®-3AN | e0 | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 1.14V~1.26V | BOTTOM | BALL | 240 | 1.2V | 1mm | not_compliant | 30 | XC3S400AN | 256 | 160 | Not Qualified | 1.2V | 1.21.2/3.33.3V | 45kB | 667MHz | 4.88 ns | FIELD PROGRAMMABLE GATE ARRAY | 8064 | 368640 | 400000 | 4 | 896 | 0.71 ns | 896 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant |
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LCMXO2280E-3FTN256I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
43.076866
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EP4CE6F17I8LN
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP4CE10F17I7
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
10M50DAF256C8G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP3C16F256A7N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
113.291042
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EP3C10F256C7
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO2-4000HC-5FTG256C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
26.329872
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M1AFS600-1FGG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XA6SLX9-2FTG256I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO2-2000HE-4FTG256I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
22.782075
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XC3S200-5FT256C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
68.894829
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EP3C25F256C6
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
104.412396
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LCMXO1200E-3FT256C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP4CE15F17C6
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
44.638688
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10M08DAF256C7G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
15.949982
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10M25DCF256C7G
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
44.965012
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LCMXO2-2000ZE-1FTG256I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
20.582235
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M1AFS1500-FG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
897.534324
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EP4CE22F17C8LN
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S400AN-4FT256C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
57.098878