The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Package / Case:
256-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Number of Terminals | Base Product Number | Base/Housing Material | Body Orientation | Brand | Clock Frequency-Max | Contact Materials | Device Logic Units | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Number of User I/Os | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Number of Outlets | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Gender | Additional Feature | HTS Code | Subcategory | Power Rating | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Screening Level | Speed Grade | Number of Transceivers | Resistance Tolerance | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Connection Type | Product Category | Product Length | Product Width | IP Rating | Height | Length | Width |
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 | Mfr Part No M1AFS1500-FGG256K | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | M1AFS1500 | 90 | Microchip Technology | Yes | 119 | Tray | Active | Details | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS1500 | 1.425V ~ 1.575V | 276480 | 1500000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-1FG256K | Microchip Technology | Datasheet | 489 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 256 | AFS1500 | 90 | MICROSEMI CORP | AFS1500-1FG256K | Microchip Technology | Yes | 3 | 119 | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | -55°C ~ 100°C (TJ) | Tray | AFS1500 | e0 | Tin/Lead (Sn/Pb) | 100 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | OTHER | 33.8 kB | 1500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1.5e+06 | 1500000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1AFS1500-2FGG256 | Microchip Technology | Datasheet | 1980 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | P1AFS1500 | 90 | Microchip Technology | Yes | 119 | Tray | Active | Details | This product may require additional documentation to export from the United States. | Fusion | 0°C ~ 85°C (TJ) | Tray | P1AFS1500 | 1.425V ~ 1.575V | 276480 | 1500000 | 2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-1FG256K | Microchip Technology | Datasheet | 2196 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-1FG256K | Microchip Technology | Yes | 3 | 119 | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | -55°C ~ 100°C (TJ) | Tray | M1AFS600 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No U1AFS1500-FG256 | Microchip Technology | Datasheet | 2350 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | U1AFS1500 | 90 | MICROSEMI CORP | U1AFS1500-FG256 | Microchip Technology | Yes | 3 | 119 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0°C ~ 85°C (TJ) | Tray | U1AFS1500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | COMMERCIAL | 38400 CLBS, 1500000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | STD | 38400 | 1500000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7A35T-2FTG256C | AMD | Datasheet | 64 | - | Min: 1 Mult: 1 | Gold | Surface Mount | 256-LBGA | 256-FTBGA (17x17) | XC7A35 | PCT (Polychlorinated Terphenyl) | Straight | Phosphor Bronze | 100 | 1.05 V | AMD | 0.95 V | Through Hole | 170 | Tray | Active | FBGA | Solder | 1.0000 V | Commercial grade | -65 to 105 °C | Artix-7 | Receptacle | 2.5400 mm | 0.95V ~ 1.05V | 256 | Black | 33280 | 1843200 | 2600 | Commercial | 2 | 50.8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7A100T-2FTG256C | AMD | Datasheet | 272 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FTBGA (17x17) | XC7A100 | 63,400 | 170 | 1.05 V | AMD | 0.95 V | Surface Mount | 170 | Tray | Active | FCBGA | 1.0000 V | Commercial grade | 0 to 85 °C | Artix-7 | 20 ppm/°C | 34.8 kOhm | 30 W | 0.95V ~ 1.05V | 256 | 101440 | 4976640 | 7925 | Commercial | 2 | 1 | 126,800 | 70.64 | 28.96 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-FGG256I | Microchip | Datasheet | 5 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P250 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P250-FGG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 157 | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.3 | Details | Yes | FPGA - Field Programmable Gate Array ProASIC3 | 1.575 V | 1.425 V | 1.5 V | 36864 bit | ProASIC3 | 1.5000 V | 0.032170 oz | -40 to 85 °C | Tray | ProASIC3 | e1 | 3A001.A.7.B | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 30 mA | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-2FG256I | Microchip | Datasheet | 4000 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P250 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P250-2FG256I | 310 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 157 | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | ProASIC3 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 36864 | 250000 | 2 | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-FG256I | Microchip | Datasheet | 12 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P250 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P250-FG256I | 350 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 157 | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.47 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | ProASIC3 | e0 | 3A001.A.7.B | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 36864 | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-FGG256I | Microchip | Datasheet | 400 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P400 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P400-FGG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 178 | 5000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 500 V | -40 to 85 °C | Tray | ProASIC3 | e1 | 3A001.A.7.B | 100 ppm/°C | 150 kOhm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | 250 mW | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | Thick Film | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 55296 | 400000 | STD | - | 1 | 9216 | 400000 | FPGA - Field Programmable Gate Array | 3.2 mm | 1.6 mm | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-2FG256I | Microchip | Datasheet | 2171 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3PE600 | MICROSEMI CORP | GE - General Electric | A3PE600-2FG256I | 1.575 V | Microchip Technology | 1.425 V | 3 | 165 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3E | e0 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLE600V2-FG256I | Microchip | Datasheet | 1950 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | AGLE600 | 250 MHz | MICROSEMI CORP | Turck | U-92501 | 1.575 V | Microchip Technology | 1.14 V | 3 | 165 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | No | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -40 to 85 °C | IGLOOe | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | 165 | Not Qualified | 1.2/1.5 V | INDUSTRIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000L-FGG256 | Microchip | Datasheet | 1600 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | MICROSEMI CORP | Murrelektronik | 7000-89561-2410030 | 1.26 V | Microchip Technology | 1.14 V | 3 | 177 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.38 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V5-FGG256 | Microchip | Datasheet | 32 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | AGL400 | MICROSEMI CORP | GE | CR305X100A | Microchip Technology | 3 | 178 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 55296 | 400000 | STD | 9216 | 400000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLE600V2-FG256 | Microchip | Datasheet | 2156 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | Aluminum | 256 | AGLE600 | 250 MHz | MICROSEMI CORP | Grace Technologies | P-G2R2-M3RE3 | 1.575 V | Microchip Technology | 1.14 V | 3 | 165 | (1) Continental European Receptacle | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | No | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | 0 to 70 °C | IGLOOe | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | 165 | Not Qualified | 1.2/1.5 V | COMMERCIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 13824 | 600000 | IP65 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLE600V2-FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | AGLE600 | 250 MHz | MICROSEMI CORP | Schneider | 139610 | 1.575 V | Microchip Technology | 1.14 V | 3 | 165 | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | 0 to 70 °C | IGLOOe | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 165 | Not Qualified | 1.2/1.5 V | COMMERCIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 13824 | 600000 | Sweat | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC6SLX16-2FTG256I | AMD | Datasheet | 32 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FTBGA (17x17) | XC6SLX16 | AMD | 186 | Tray | Active | -40°C ~ 100°C (TJ) | Spartan®-6 LX | 1.14V ~ 1.26V | 14579 | 589824 | 1139 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3S200-4FT256I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FTBGA (17x17) | XC3S200 | AMD | 173 | Bulk | Active | -40°C ~ 100°C (TJ) | Spartan®-3 | 1.14V ~ 1.26V | 4320 | 221184 | 200000 | 480 | 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M16DCF256A7G | ALTERA | Datasheet | 28 |
| Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FBGA (17x17) | 256 | 382 MHz | INTEL CORP | Lead free / RoHS Compliant | Intel Corporation | 10M16DCF256A7G | 3 | 178 | 125 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | NOT SPECIFIED | 5.25 | Yes | 1.25 V | 1.15 V | 1.2 V | -40°C ~ 125°C (TJ) | MAX® 10 | e1 | Active | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | OPERATES AT 2.5V NOMINAL VCC | 8542.39.00.01 | Field Programmable Gate Arrays | 1.15 V ~ 1.25 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B256 | 178 | Not Qualified | 1.2 V | AUTOMOTIVE | 178 | 1000 CLBS | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 16000 | 562176 | 1000 | 1000 | 16000 | 17 mm | 17 mm |
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M1AFS1500-FGG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AFS1500-1FG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
984.479757
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P1AFS1500-2FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
314.945334
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M1AFS600-1FG256K
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
370.665539
-
U1AFS1500-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
267.972221
-
XC7A35T-2FTG256C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC7A100T-2FTG256C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-FGG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
29.796093
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A3P250-2FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P400-FGG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE600-2FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
149.592135
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AGLE600V2-FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
231.619960
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A3P1000L-FGG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL400V5-FGG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
99.361987
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AGLE600V2-FG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
208.706321
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AGLE600V2-FGG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC6SLX16-2FTG256I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S200-4FT256I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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10M16DCF256A7G
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
75.672624