The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Moisture Sensitivity Level (MSL)
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- Package / Case:
256-LBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Weight | Number of Terminals | Approvals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Number of I/O Lines | Number of I/Os | Number of Outlets | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | RAM Size | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Terminal Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of GPIO | Number of Equivalent Gates | Connection Type | Contacts | IP Rating | Height | Length | Width | Radiation Hardening |
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![]() | Mfr Part No AGL400V5-FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | AGL400 | MICROSEMI CORP | GE | CR305X100A | Microchip Technology | 3 | 178 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 70 °C | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 55296 | 400000 | STD | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGLE600V2-FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | Aluminum | 256 | AGLE600 | 250 MHz | MICROSEMI CORP | Grace Technologies | P-G2R2-M3RE3 | 1.575 V | Microchip Technology | 1.14 V | 3 | 165 | (1) Continental European Receptacle | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | No | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | 0 to 70 °C | IGLOOe | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | 165 | Not Qualified | 1.2/1.5 V | COMMERCIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 13824 | 600000 | IP65 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGLE600V2-FGG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | AGLE600 | 250 MHz | MICROSEMI CORP | Schneider | 139610 | 1.575 V | Microchip Technology | 1.14 V | 3 | 165 | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | 0 to 70 °C | IGLOOe | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 165 | Not Qualified | 1.2/1.5 V | COMMERCIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 13824 | 600000 | Sweat | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC6SLX16-2FTG256I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FTBGA (17x17) | XC6SLX16 | AMD | 186 | Tray | Active | -40°C ~ 100°C (TJ) | Spartan®-6 LX | 1.14V ~ 1.26V | 14579 | 589824 | 1139 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC3S200-4FT256I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FTBGA (17x17) | XC3S200 | AMD | 173 | Bulk | Active | -40°C ~ 100°C (TJ) | Spartan®-3 | 1.14V ~ 1.26V | 4320 | 221184 | 200000 | 480 | 4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC3S400A-4FTG256C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FTBGA (17x17) | XC3S400 | AMD | 195 | Tray | Active | 0°C ~ 85°C (TJ) | Spartan®-3A | 1.14V ~ 1.26V | 8064 | 368640 | 400000 | 896 | 4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE600-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3PE600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE600-FG256I | Microchip Technology | 3 | 165 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.76 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3E | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 165 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-FG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | APA600 | 180 MHz | MICROSEMI CORP | Microsemi Corporation | APA600-FG256M | Microchip Technology | 3 | 186 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | Compliant | No | 2.7 V | 2.3 V | 2.5 V | -55°C ~ 125°C (TC) | ProASICPLUS | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 2.7 V | 2.3 V | 15.8 kB | 186 | 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 129024 | 600000 | 180 MHz | 21504 | 21504 | 600000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||
![]() | Mfr Part No AX250-1FGG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | AX250 | 1.575 V | Microchip Technology | 1.425 V | 138 | Tray | Active | -40°C ~ 85°C (TA) | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P250-FGG256T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | A3P250 | Microchip Technology | 157 | Tray | Active | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | 1.425V ~ 1.575V | 36864 | 250000 | STD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL400V5-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | AGL400 | MICROSEMI CORP | Microsemi Corporation | AGL400V5-FG256I | Microchip Technology | 3 | 178 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 85°C (TA) | IGLOO | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 55296 | 400000 | STD | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX250-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256-FPBGA (17x17) | AX250 | 1.575 V | Microchip Technology | 1.425 V | 138 | Tray | Active | -40°C ~ 85°C (TA) | Axcelerator | 1.425V ~ 1.575V | 55296 | 250000 | 4224 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP3C25F256C7 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FBGA (17x17) | 256 | 472.5 MHz | INTEL CORP | Intel Corporation | EP3C25F256C7 | 3 | 156 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | 30 | 5.22 | No | 1.25 V | 1.15 V | 1.2 V | 0°C ~ 85°C (TJ) | Cyclone® III | e0 | Active | 3A991 | TIN LEAD | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP3C25 | S-PBGA-B256 | 156 | Not Qualified | OTHER | 156 | 24624 CLBS | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24624 | 608256 | 1539 | 24624 | 24624 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP2C20F256C6 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FBGA (17x17) | 256 | 500 MHz | INTEL CORP | Intel Corporation | EP2C20F256C6 | 3 | 152 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | 30 | 5.24 | No | 1.25 V | 1.15 V | 1.2 V | 0°C ~ 85°C (TJ) | Cyclone® II | e0 | Active | 3A991 | TIN LEAD | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP2C20 | S-PBGA-B256 | 136 | Not Qualified | 1.2,1.5/3.3,3.3 V | OTHER | 152 | 1172 CLBS | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18752 | 239616 | 1172 | 1172 | 18752 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP2C20F256I8 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FBGA (17x17) | 256 | 402.5 MHz | INTEL CORP | Intel Corporation | EP2C20F256I8 | 3 | 152 | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | 20 | 1.58 | No | 1.25 V | 1.15 V | 1.2 V | -40°C ~ 100°C (TJ) | Cyclone® II | e0 | Active | 3A991 | TIN LEAD | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP2C20 | S-PBGA-B256 | 136 | Not Qualified | 1.2,1.5/3.3,3.3 V | 152 | 1172 CLBS | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18752 | 239616 | 1172 | 1172 | 18752 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP4CE22F17I8L | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FBGA (17x17) | 256 | 362 MHz | INTEL CORP | Intel Corporation | EP4CE22F17I8L | 3 | 153 | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | 30 | 5.23 | No | 1.03 V | 0.97 V | 1 V | -40°C ~ 100°C (TJ) | Cyclone® IV E | e0 | Active | TIN LEAD | 8542.39.00.01 | Field Programmable Gate Arrays | 0.97 V ~ 1.03 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP4CE22 | S-PBGA-B256 | 153 | Not Qualified | 1,1.2/3.3,2.5 V | 153 | 1395 CLBS | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 22320 | 608256 | 1395 | 1395 | 22320 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EPF6016BC256-2 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-BGA (27x27) | 256 | 153 MHz | INTEL CORP | Intel Corporation | EPF6016BC256-2 | Altera | 3 | 204 | 204 | 85 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA256(UNSPEC) | BGA256(UNSPEC) | SQUARE | GRID ARRAY | Obsolete | Active | 30 | 5.12 | No | 5.25 V | 4.75 V | 5 V | 0°C ~ 85°C (TJ) | FLEX 6000 | e0 | Obsolete | 3A991 | Tin/Lead (Sn/Pb) | CAN ALSO BE USED 16000 LOGIC GATES | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 4.75 V ~ 5.25 V | BOTTOM | BALL | 220 | 1.27 mm | compliant | EPF6016 | S-PBGA-B256 | 204 | Not Qualified | 3.3/5,5 V | OTHER | 204 | 4 DEDICATED INPUTS, 204 I/O | 2.3 mm | LOADABLE PLD | 1320 | 16000 | 132 | MACROCELL | 1320 | 4 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EPF6016BC256-3 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-BGA (27x27) | 256 | 133 MHz | INTEL CORP | Intel Corporation | EPF6016BC256-3 | 3 | 204 | 204 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA256(UNSPEC) | BGA256(UNSPEC) | SQUARE | GRID ARRAY | Obsolete | 30 | 5.13 | No | 5.25 V | 4.75 V | 5 V | 0°C ~ 85°C (TJ) | FLEX 6000 | e0 | Obsolete | 3A991 | Tin/Lead (Sn/Pb) | CAN ALSO BE USED 16000 LOGIC GATES | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 4.75 V ~ 5.25 V | BOTTOM | BALL | 220 | 1.27 mm | compliant | EPF6016 | S-PBGA-B256 | 204 | Not Qualified | 3.3/5,5 V | OTHER | 204 | 4 DEDICATED INPUTS, 204 I/O | 2.3 mm | LOADABLE PLD | 1320 | 16000 | 132 | MACROCELL | 1320 | 4 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10M16DCF256A7G | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FBGA (17x17) | 256 | 382 MHz | INTEL CORP | Lead free / RoHS Compliant | Intel Corporation | 10M16DCF256A7G | 3 | 178 | 125 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | NOT SPECIFIED | 5.25 | Yes | 1.25 V | 1.15 V | 1.2 V | -40°C ~ 125°C (TJ) | MAX® 10 | e1 | Active | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | OPERATES AT 2.5V NOMINAL VCC | 8542.39.00.01 | Field Programmable Gate Arrays | 1.15 V ~ 1.25 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B256 | 178 | Not Qualified | 1.2 V | AUTOMOTIVE | 178 | 1000 CLBS | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 16000 | 562176 | 1000 | 1000 | 16000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CEBA4F17I7N | ALTERA | Datasheet | 447 | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | 256 | 256-FBGA (17x17) | CE, cURus, CSA | -- | IDEC | HA1S-32C6V | 128 | Compliant | -40°C ~ 100°C (TJ) | Cyclone® V E | Active | -- | 3 | 100 °C | -40 °C | 1.07 V ~ 1.13 V | 5CEBA4 | 1.13 V | 422.9 kB | 422.9 kB | PCB | 49000 | 3464192 | 800 MHz | 18480 | 18480 | 7 | 128 | DPDT | IP65 |
AGL400V5-FGG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGLE600V2-FG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGLE600V2-FGG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC6SLX16-2FTG256I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC3S200-4FT256I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC3S400A-4FTG256C
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE600-FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA600-FG256M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX250-1FGG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
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A3P250-FGG256T
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
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AGL400V5-FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
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AX250-FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EP3C25F256C7
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
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EP2C20F256C6
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
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EP2C20F256I8
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
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EP4CE22F17I8L
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
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EPF6016BC256-2
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
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EPF6016BC256-3
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
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10M16DCF256A7G
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
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5CEBA4F17I7N
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
