The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Base Part Number
- HTS Code
- JESD-30 Code
- Length
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Inputs
- Number of LABs/CLBs
- Number of Logic Elements/Cells
- Operating Temperature
- Package / Case
- Package / Case:
383-TFBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Number of I/Os | Operating Temperature-Max | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Memory Size | Operating Supply Current | RAM Size | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Number of Logic Cells | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No 5CGXFC4C6M13C6N | Intel | Datasheet | 12 | - | Min: 1 Mult: 1 | Surface Mount | 383-TFBGA | YES | 175 | 0°C~85°C TJ | Tray | Cyclone® V GX | Active | 3 (168 Hours) | 383 | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.5mm | NOT SPECIFIED | 5CGXFC4 | S-PBGA-B383 | 175 | Not Qualified | 1.11.2/3.32.5V | 175 | FIELD PROGRAMMABLE GATE ARRAY | 50000 | 2862080 | 18868 | 1.1mm | 13mm | 13mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CGXFC5C6M13C7N | Intel | Datasheet | 709 | - | Min: 1 Mult: 1 | Surface Mount | 383-TFBGA | YES | 175 | 0°C~85°C TJ | Tray | Cyclone® V GX | Active | 3 (168 Hours) | 383 | 8542.39.00.01 | 1.07V~1.13V | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.5mm | NOT SPECIFIED | 5CGXFC5 | S-PBGA-B383 | 175 | Not Qualified | 1.11.2/3.32.5V | 175 | FIELD PROGRAMMABLE GATE ARRAY | 77000 | 5001216 | 29080 | 1.1mm | 13mm | 13mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CEFA2M13C8N | ALTERA | Datasheet | 628 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 383-TFBGA | YES | 383 | 383-MBGA (13x13) | 383 | INTEL CORP | -- | Intel Corporation | 5CEFA2M13C8N | 223 | 85 °C | PLASTIC/EPOXY | TFBGA | TFBGA, BGA383,25X25,20 | BGA383,25X25,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | NOT SPECIFIED | 2 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Cyclone® V E | Active | -- | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.07 V ~ 1.13 V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | 5CEFA2 | S-PBGA-B383 | 223 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | OTHER | 244.5 kB | 100 mA | 244.5 kB | 223 | 1.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | 2002944 | 800 MHz | 9434 | 9434 | 25000 | 13 mm | 13 mm |