The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Mounting Type
- Number of I/Os
- Operating Temperature
- Package / Case
- Series
- Voltage - Supply
- Programmable Logic Type
- Number of Gates
- Packaging
- Part Status
- Moisture Sensitivity Level (MSL)
- Peak Reflow Temperature (Cel)
- Package / Case:
48-VFQFN Exposed Pad
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Material | Number of Terminals | Base Product Number | Clock Frequency-Max | Contact Finish Mating | Contact Materials | Core Factor (ΣI/A) mm-1 | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | Termination | Connector Type | Terminal Finish | Color | HTS Code | Fastening Type | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Shell Finish | JESD-30 Code | Qualification Status | Temperature Grade | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Number of Gates | Speed Grade | Number of CLBs | Finish | Core Type | Gap | Effective Length (le) mm | Number of Equivalent Gates | Features | Diameter | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No A3PN010-QNG48 | Microchip | Datasheet | 184 | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | A3PN010 | MICROSEMI CORP | Microsemi Corporation | A3PN010-QNG48 | Microchip Technology | 3 | 34 | 70 °C | -20 °C | Tray | UNSPECIFIED | HQCCN | 6 X 6 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-48 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | 30 | 0.85 | Yes | 1.575 V | 1.425 V | 1.5 V | -20°C ~ 85°C (TJ) | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | OTHER | 260 CLBS, 10000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 10000 | STD | 260 | 10000 | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P030-QNG48I | Microchip | Datasheet | 3432 | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | A3P030 | MICROSEMI CORP | Microsemi Corporation | A3P030-QNG48I | Microchip Technology | 3 | 34 | 100 °C | -40 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | 30 | 5.24 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 30000 | STD | 768 | 30000 | 6 mm | 6 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN030-Z1QNG48 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) | A3PN030 | Microchip Technology | 34 | Tray | Obsolete | -20°C ~ 85°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 30000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGLN010V5-QNG48I | Microchip | Datasheet | 16 |
| Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | AGLN010 | MICROSEMI CORP | Microsemi Corporation | AGLN010V5-QNG48I | 1.575 V | Microchip Technology | 1.425 V | 3 | 34 | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 1.51 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | IGLOO nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 260 CLBS, 10000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 260 | 10000 | STD | 260 | 10000 | 6 mm | 6 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN010-1QNG48 | Microchip | Datasheet | 31 |
| Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | A3PN010 | MICROSEMI CORP | Microsemi Corporation | A3PN010-1QNG48 | 1.575 V | Microchip Technology | 1.425 V | 3 | 34 | 70 °C | -20 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | 30 | 1.44 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -20 to 70 °C | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | OTHER | 260 CLBS, 10000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 10000 | 1 | 260 | 10000 | 6 mm | 6 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN010-QNG48I | Microchip | Datasheet | 24 |
| Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | A3PN010 | MICROSEMI CORP | Microsemi Corporation | A3PN010-QNG48I | 1.575 V | Microchip Technology | 1.425 V | 3 | 34 | 85 °C | -40 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | 30 | 5.25 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 260 CLBS, 10000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 10000 | STD | 260 | 10000 | 6 mm | 6 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN030-Z1QNG48I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) | A3PN030 | Microchip Technology | 34 | Tray | Obsolete | -40°C ~ 100°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 30000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN010-2QNG48 | Microchip | Datasheet | 39 |
| Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | A3PN010 | MICROSEMI CORP | A3PN010-2QNG48 | 1.575 V | Microchip Technology | 1.425 V | 3 | 34 | 70 °C | -20 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | 30 | 5.26 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -20 to 70 °C | ProASIC3 nano | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | OTHER | 260 CLBS, 10000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 10000 | 2 | 260 | 10000 | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL030V5-QNG48 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | AGL030 | MICROSEMI CORP | AGL030V5-QNG48 | Microchip Technology | 3 | 34 | 85 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | NOT SPECIFIED | 5.23 | Yes | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 70°C (TA) | IGLOO | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | compliant | S-XQCC-N48 | Not Qualified | OTHER | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN030-Z2QNG48 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) | A3PN030 | Murrelektronik | 72641 | Microchip Technology | 34 | Tray | Obsolete | -20°C ~ 85°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 30000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P030-QNG48 | Microchip | Datasheet | 2825 | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | RM 4 | N87 | 48 | A3P030 | 350 MHz | 1.7 | MICROSEMI CORP | Microsemi Corporation | A3P030-QNG48 | Microchip Technology | 3 | 34 | 85 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | 30 | 1.37 | Yes | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 85°C (TJ) | -- | -- | Active | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | COMMERCIAL | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 30000 | STD | 768 | Uncoated | RM | -- | 22 | 30000 | -- | 10.50mm | 11.00mm | 4.60mm | |||||||||||||||||||||||
![]() | Mfr Part No AGLN010V2-QNG48I | Microchip | Datasheet | 1550 |
| Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | AGLN010 | MICROSEMI CORP | Microsemi Corporation | AGLN010V2-QNG48I | Microchip Technology | 3 | 34 | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 5.58 | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Each | IGLOO nano | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 260 CLBS, 10000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 260 | 10000 | STD | 260 | 10000 | 6 mm | 6 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN030-Z2QNG48I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) | A3PN030 | Kamaya Inc. | 34 | Tape & Reel (TR) | Active | -40°C ~ 100°C (TJ) | * | 1.425V ~ 1.575V | 30000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGLN010V2-QNG48 | Microchip | Datasheet | 12 |
| Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | AGLN010 | MICROSEMI CORP | AGLN010V2-QNG48 | Microchip Technology | 3 | 34 | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 1.49 | Yes | 1.575 V | 1.14 V | 1.2 V | -20°C ~ 85°C (TJ) | IGLOO nano | e3 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | OTHER | 260 CLBS, 10000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 260 | 10000 | STD | 260 | 10000 | 6 mm | 6 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No AGLN010V5-QNG48 | Microchip | Datasheet | 19 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | 48-VFQFN Exposed Pad | YES | Flange | Aluminum | 48-QFN (6x6) | 48 | AGLN010 | Gold | Copper Alloy | MICROSEMI CORP | Microsemi Corporation | AGLN010V5-QNG48 | Glenair | 3 | 34 | 70 °C | -20 °C | Retail Package | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Metal | Active | NOT SPECIFIED | 5.61 | Yes | 1.575 V | 1.425 V | 1.5 V | -65°C ~ 175°C | 806 | Solder | Receptacle, Female Sockets | Silver | 8542.39.00.01 | Threaded | CMOS | 1.425V ~ 1.575V | QUAD | E | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | Electroless Nickel | S-XQCC-N48 | Not Qualified | OTHER | 260 CLBS, 10000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 260 | 10000 | STD | 260 | 10000 | Ground | 6 mm | 6 mm | |||||||||||||||||||
![]() | Mfr Part No AGL030V5-QNG48I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | AGL030 | MICROSEMI CORP | Microsemi Corporation | AGL030V5-QNG48I | Microchip Technology | 3 | 34 | 100 °C | -40 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | NOT SPECIFIED | 5.24 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 85°C (TA) | IGLOO | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | compliant | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN030-ZQNG48I | Microchip | Datasheet | 888 | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | A3PN030 | MICROSEMI CORP | Miscellaneous | SW-05V | Microchip Technology | 3 | 34 | 85 °C | -40 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Not Recommended | Active | 30 | 7.07 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 30000 | STD | 768 | 30000 | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P030-1QNG48I | Microchip | Datasheet | 16 |
| Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | A3P030 | MICROSEMI CORP | Microsemi Corporation | A3P030-1QNG48I | Microchip Technology | 3 | 34 | 100 °C | -40 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | 30 | 5.24 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 1 | 768 | 30000 | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PN030-ZQNG48 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | A3PN030 | MICROSEMI CORP | Microsemi Corporation | A3PN030-ZQNG48 | Microchip Technology | 3 | 34 | 70 °C | -20 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Not Recommended | Active | 30 | 7.65 | Yes | FPGA | 1.575 V | 1.425 V | 1.5 V | -20°C ~ 85°C (TJ) | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N48 | Not Qualified | OTHER | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 30000 | STD | 768 | 30000 | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL030V2-QNG48I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 48-VFQFN Exposed Pad | YES | 48-QFN (6x6) | 48 | AGL030 | MICROSEMI CORP | Microsemi Corporation | AGL030V2-QNG48I | Microchip Technology | 3 | 34 | 100 °C | -40 °C | Tray | UNSPECIFIED | HQCCN | HQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG | Active | Active | NOT SPECIFIED | 5.24 | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 85°C (TA) | IGLOO | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | compliant | S-XQCC-N48 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | STD | 768 | 30000 |
A3PN010-QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P030-QNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PN030-Z1QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGLN010V5-QNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
10.620240
A3PN010-1QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
7.346640
A3PN010-QNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
7.653598
A3PN030-Z1QNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PN010-2QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
7.623416
AGL030V5-QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PN030-Z2QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P030-QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGLN010V2-QNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
10.782108
A3PN030-Z2QNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGLN010V2-QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
7.100674
AGLN010V5-QNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.430421
AGL030V5-QNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PN030-ZQNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P030-1QNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
11.863309
A3PN030-ZQNG48
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGL030V2-QNG48I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
