The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- JESD-30 Code
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- Number of LABs/CLBs
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- Package / Case:
484-BGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Material | Dielectric Material | Weight | Insert Material | Shape | Package Cooled | Material Finish | Number of Terminals | Backshell Material, Plating | Base Product Number | Clock Frequency-Max | CoilResistance | Contact Finish Mating | Contact Materials | ElectricalLife | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rated | Voltage, Rating | Watchdog Timers | Operating Temperature | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Additional Feature | HTS Code | Fastening Type | Subcategory | Power Rating | Current Rating (Amps) | Max Power Dissipation | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Base Part Number | Shell Finish | Reference Standard | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Body Length or Diameter | Body Breadth | Physical Dimension | Operating Supply Voltage | Power Supplies | Temperature Grade | Contact Current(DC)-Max | Contact Voltage(DC)-Max | Max Supply Voltage | Min Supply Voltage | Termination Type | Memory Size | Operating Supply Current | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | RAM Size | Shell Size, MIL | Q @ Freq | Cable Opening | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Relay Type | Adjustment Type | Number of Logic Elements/Cells | Min Reset Threshold Voltage | Max Reset Threshold Voltage | Contact Current(AC)-Max | Operate Time | Release Time | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Coil Power | Contact Voltage(AC)-Max | Contact/Output Supply Type | Relay Action | Coil/Input Supply Type | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of GPIO | Capacitance Range | Relay Function | Number of Equivalent Gates | Thermal Resistance @ Natural | Coil Voltage(DC)-Max | Coil Current(DC)-Max | Coil Operate Voltage(DC) | Coil Release Voltage(DC) | Power Dissipation @ Temperature Rise | Features | Diameter | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Body Height | Material Flammability Rating | Radiation Hardening | Lead Free |
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 | Mfr Part No A3P600L-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P600L-FG484I | Microchip Technology | 3 | 235 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.54 | Compliant | No | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 781.25 MHz | STD | 13824 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V2-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | AGL1000 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL1000V2-FGG484I | Microchip Technology | 3 | 300 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.41 | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 85°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP3C16F484A7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 484-BGA | 484 | 484-FBGA (23x23) | 346 | Compliant | 150 V | -40°C ~ 125°C (TJ) | Cyclone® III | 1 % | Active | 50 ppm/°C | 340 kΩ | 155 °C | -55 °C | Thin Film | 125 mW | 1.15 V ~ 1.25 V | 437.5 MHz | EP3C16 | 1.25 V | 1.15 V | 63 kB | 63 kB | 15408 | 516096 | 315 MHz | 963 | 963 | 650 µm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL005S-FG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL005 | MICROSEMI CORP | Microsemi Corporation | M2GL005S-FG484 | Microchip Technology | 3 | 209 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.28 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | OTHER | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | 719872 | 6060 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7S50-1FGGA484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 484-BGA | 4 | 484-FPBGA (23x23) | XC7S50 | AMD | 250 | Tray | Active | Compliant | No | -40°C ~ 100°C (TJ) | Spartan®-7 | 125 °C | -40 °C | 245 mW | 0.95V ~ 1.05V | 5.5 V | 1 V | 52160 | 2.048 V | 2.153 V | 2764800 | 4075 | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V2-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | AGL1000 | 108 MHz | MICROSEMI CORP | Microsemi Corporation | AGL1000V2-FGG484 | Microchip Technology | 3 | 300 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.46 | Yes | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 70°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | OTHER | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050TS-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL050 | MICROSEMI CORP | Microsemi Corporation | M2GL050TS-1FG484I | Microchip Technology | 3 | 267 | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 228.3 kB | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M50DCF484I6G | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FBGA (23x23) | 484 | 450 MHz | INTEL CORP | Intel Corporation | 10M50DCF484I6G | Glenair | 3 | 360 | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.26 | Yes | 1.25 V | 1.15 V | 1.2 V | -40°C ~ 100°C (TJ) | * | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | OPERATES AT 2.5V NOMINAL VCC | 1.15 V ~ 1.25 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B484 | 360 | INDUSTRIAL | 360 | 3125, CLBS | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 50000 | 1677312 | 3125 | 3125 | 50000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XA7S100-2FGGA484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | 484-BGA | 484-FPBGA (23x23) | Polytetrafluoroethylene (PTFE) | XA7S100 | AMD | 338 | Tray | Active | 1000V | -65°C ~ 125°C | E_HV | 0.300 Dia (7.62mm) | Active | 0.95V ~ 1.05V | 2000 @ 100MHz | Side | 102400 | 4423680 | 8000 | 1 ~ 16pF | General Purpose | 0.500 (12.70mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP4CGX75CF23I7 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484 | 484-FBGA (23x23) | Aluminum | Square, Fins | Assorted (BGA, LGA, CPU, ASIC...) | Blue Anodized | 484 | 472.5 MHz | INTEL CORP | Intel Corporation | EP4CGX75CF23I7 | 3 | 290 | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | 30 | 5.23 | Non-Compliant | No | 1.24 V | 1.16 V | 1.2 V | -40°C ~ 100°C (TJ) | pushPIN™ | e0 | Active | Top Mount | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | 1.16 V ~ 1.24 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP4CGX75 | S-PBGA-B484 | 290 | Not Qualified | 1.2 V | 1.2,1.2/3.3,2.5 V | 1.24 V | 1.16 V | 519.8 kB | Push Pin | 0.984 (25.00mm) | 7.01°C/W @ 100 LFM | 519.8 kB | 3.125 Gbps | 290 | 4620 CLBS | 2.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 73920 | 4257792 | 200 MHz | 4620 | 4620 | 7 | 8 | 4620 | 73920 | 290 | -- | -- | -- | 0.984 (25.00mm) | 0.984 (25.00mm) | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1FG484M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Panel Mount | 484-BGA | Flange | Aluminum Alloy | 484-FPBGA (23x23) | - | - | MS27497E16B | Gold | Copper Alloy | Amphenol Aerospace Operations | 300 | 11000 LE | Bulk | Metal | Active | Compliant | 8542390000 | - | -65°C ~ 175°C | Military, MIL-DTL-38999 Series II, JT | Crimp | Receptacle, Female Sockets | 23 | 125 °C | -55 °C | Olive Drab | Aviation, Marine, Military | Bayonet Lock | - | 1.425V ~ 1.575V | N (Normal) | Unshielded | Environment Resistant | Olive Drab Cadmium over Nickel | 16-99 | 18 kB | - | - | 147456 | 1e+06 | - | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-1FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (27X27) | 484 | A54SX32 | 278 MHz | MICROSEMI CORP | Microsemi Corporation | A54SX32A-1FGG484 | Microchip Technology | 3 | 249 | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Yes | 2.75 V | 2.25 V | 2.5 V | 0°C ~ 70°C (TA) | SX-A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 249 | Not Qualified | 2.5,2.5/5 V | COMMERCIAL | 249 | 2880 CLBS, 48000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1 | 1.1 ns | 2880 | 2880 | 48000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-1FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | AX500 | Microchip Technology | 317 | Tray | Active | 0°C ~ 70°C (TA) | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-1FGG484K | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | AFS600 | 350 MHz | MICROSEMI CORP | ABB | AFS600-1FGG484K | Microchip Technology | 3 | 172 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | Yes | -55°C ~ 100°C (TJ) | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 172 | Not Qualified | 1.5,3.3 V | 172 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | AX500 | GE - General Electric | Microchip Technology | 317 | Tray | Active | -40°C ~ 85°C (TA) | Axcelerator | 1.425V ~ 1.575V | 73728 | 500000 | 8064 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CEBA7F23C7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484 | 484-FBGA (23x23) | 484 | INTEL CORP | -- | VITRAMON | 5CEBA7F23C7N | 240 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2 | NO | Yes | FPGA - Field Programmable Gate Array FPGA - Cyclone V E 5648 LABs 240 IOs | 8542390000 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Cyclone® V E | Active | -- | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.07 V ~ 1.13 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CEBA7 | S-PBGA-B484 | 240 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 962 kB | 962 kB | 240 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 149500 | 7880704 | 800 MHz | 56480 | 56480 | 7 | 150000 | 240 | 23 mm | 23 mm | No | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CGXBC9C6F23C7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FBGA (23x23) | 224 | 0°C ~ 85°C (TJ) | Cyclone® V GX | Active | 1.07 V ~ 1.13 V | 5CGXBC9 | 301000 | 14251008 | 113560 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CEFA7F23C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FBGA (23x23) | 240 | 0°C ~ 85°C (TJ) | Cyclone® V E | Active | 1.07 V ~ 1.13 V | 5CEFA7 | 149500 | 7880704 | 56480 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CGXFC9C7F23C8N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | THROUGH HOLE-STRAIGHT MOUNT | 484-FBGA (23x23) | 484 | 80 | 100000 | INTEL CORP | Intel Corporation | 5CGXFC9C7F23C8N | 3 | 224 | 85 | -40 | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.58 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Cyclone® V GX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.07 V ~ 1.13 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CGXFC9 | UL | S-PBGA-B484 | 224 | Not Qualified | 21.4 | 16.6 | 21.4mm x 16.6mm x 15mm | 1.1,1.2/3.3,2.5 V | OTHER | 7 | 250 | SOLDER | 224 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | POWER/SIGNAL RELAY | 301000 | 12 | 10 | 5 | 14251008 | 113560 | 450 | 125 | AC/DC | MOMENTARY | DC | 301000 | SPST | 6 | .08 | 4.5 | .3 | 23 mm | 23 mm | 15 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CEFA7F23C7N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FBGA (23x23) | 240 | 0°C ~ 85°C (TJ) | Cyclone® V E | Active | 1.07 V ~ 1.13 V | 5CEFA7 | 149500 | 7880704 | 56480 |
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A3P600L-FG484I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL1000V2-FGG484I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP3C16F484A7N
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL005S-FG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC7S50-1FGGA484I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL1000V2-FGG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL050TS-1FG484I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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10M50DCF484I6G
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XA7S100-2FGGA484I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP4CGX75CF23I7
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000-1FG484M
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A54SX32A-1FGG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AX500-1FGG484
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AFS600-1FGG484K
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AX500-1FGG484I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5CEBA7F23C7N
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5CGXBC9C6F23C7N
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5CEFA7F23C6N
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5CGXFC9C7F23C8N
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5CEFA7F23C7N
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire