The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Mounting Type
- Number of Gates
- Number of I/Os
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- Length
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- Moisture Sensitivity Level (MSL)
- Mount
- Package / Case:
68-VFQFN Exposed Pad
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Material | Housing Material | Weight | Shape | Package Cooled | Number of Terminals | Base Product Number | Body Orientation | Cable Types | Clock Frequency-Max | Contact Classification | Contact Finish Mating | Contact Materials | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Supply Voltage | Maximum Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Outlets | Operating Temp Range | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Status | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shell Size / Insert Arrangement | Side 1 Gender | Side 2 Gender | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Typical Operating Supply Voltage | Voltage, Rating | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Connector Type | Type | Number of Positions | Color | Gender | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Supply Voltage | Terminal Pitch | Reach Compliance Code | Current Rating | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Contact Gender | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Number of Ports | Shell Size, MIL | Family | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Number of Gates | Max Frequency | Speed Grade | Number of Registers | Number of CLBs | Shell Plating | Number of Logic Cells | Number of Equivalent Gates | Features | Strain Relief | IP Rating | Height | Length | Width | Contact Finish Thickness - Mating | Radiation Hardening | RoHS Status |
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 | Mfr Part No A3PN030-Z1QNG68I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | A3PN030 | MICROSEMI CORP | Microsemi Corporation | A3PN030-Z1QNG68I | Microchip Technology | 3 | 49 | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Not Recommended | Active | 30 | 5.26 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 768 | 30000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN020V2-QNG68 | Microchip | Datasheet | 17 |
| Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | AGLN020 | MICROSEMI CORP | Microsemi Corporation | AGLN020V2-QNG68 | 1.575 V | Microchip Technology | 1.14 V | 3 | 49 | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 5.59 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -20 to 70 °C | IGLOO nano | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | OTHER | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 520 | 20000 | STD | 520 | 20000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN030-ZQNG68I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) | A3PN030 | Microchip Technology | 49 | Tray | Active | -40°C ~ 100°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 30000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN015V2-QNG68 | Microchip | Datasheet | 110 |
| Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | AGLN015 | MICROSEMI CORP | Microsemi Corporation | AGLN015V2-QNG68 | 1.575 V | Microchip Technology | 1.14 V | 3 | 49 | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 5.61 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -20 to 70 °C | IGLOO nano | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | OTHER | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 384 | 15000 | STD | 384 | 15000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN015-QNG68 | Microchip | Datasheet | 343 |
| Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | Aluminum | 68 | A3PN015 | MICROSEMI CORP | Grace Technologies | P-D4R2-M2RF3 | 1.575 V | Microchip Technology | 1.425 V | 3 | 49 | (2) GFCI | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, LCC68,.32SQ,16 | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 1.42 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -20 to 70 °C | ProASIC3 nano | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | 49 | Not Qualified | 1.5,1.5/3.3 V | OTHER | 49 | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 15000 | STD | 384 | 384 | 15000 | IP65 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN015-QNG68I | Microchip | Datasheet | 36 |
| Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | A3PN015 | MICROSEMI CORP | Miscellaneous | A3PN015-QNG68I | 1.575 V | Microchip Technology | 1.425 V | 3 | 49 | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 1.43 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | ProASIC3 nano | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | 49 | Not Qualified | 1.5,1.5/3.3 V | INDUSTRIAL | 49 | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 15000 | STD | 384 | 384 | 15000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN020V5-QNG68 | Microchip | Datasheet | 22 |
| Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | AGLN020 | MICROSEMI CORP | Microsemi Corporation | AGLN020V5-QNG68 | Microchip Technology | 3 | 49 | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 1.47 | Yes | 1.575 V | 1.425 V | 1.5 V | -20°C ~ 85°C (TJ) | IGLOO nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | OTHER | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 520 | 20000 | STD | 520 | 20000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P030-QNG68 | Microchip | Datasheet | 416 | - | Min: 1 Mult: 1 | Silver | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 5 | A3P030 | Straight | 350 MHz | 5Signal | Copper Alloy | MICROSEMI CORP | Microsemi Corporation | A3P030-QNG68 | Microchip Technology | 3 | Cable | 49 | -55C to 125C | 85 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | No | 30 | 1.33 | Yes | 18-20 | 1.575 V | 1.425 V | 1.5 V | Crimp | 700VDC/500VAC | 0°C ~ 85°C (TJ) | ProASIC3 | Circular | RCP | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 5(POS) | PIN | COMMERCIAL | 1(Port) | ACC | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | STD | 768 | Cadmium | 30000 | No | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P030-1QNG68I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | A3P030 | MICROSEMI CORP | A3P030-1QNG68I | Microchip Technology | 3 | 49 | 100 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, GREEN, QFN-68 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 1.37 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 768 | 30000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN015V5-QNG68 | Microchip | Datasheet | 22 |
| Min: 1 Mult: 1 | Free Hanging (In-Line) | 68-VFQFN Exposed Pad | YES | - | Thermoplastic | 68-QFN (8x8) | 68 | NLDFT | Silver | MICROSEMI CORP | Microsemi Corporation | AGLN015V5-QNG68 | ITT Cannon, LLC | 3 | 49 | 70 °C | -20 °C | Bulk | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Plastic | Active | NOT SPECIFIED | 1.51 | Yes | 1.575 V | 1.425 V | 1.5 V | 1000VAC, 1500VDC | -30°C ~ 125°C | Powerlock | Set Screw | Line Drain, Female Sockets | 1 | - | 8542.39.00.01 | Bayonet Lock | 400A | CMOS | 1.425V ~ 1.575V | QUAD | Keyed | NO LEAD | - | NOT SPECIFIED | IP67 - Dust Tight, Waterproof | 0.4 mm | compliant | - | - | S-XQCC-N68 | Not Qualified | OTHER | - | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 384 | 15000 | STD | 384 | 15000 | Hand Grip, Locking Pin | 8 mm | 8 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN030-Z2QNG68 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | A3PN030 | MICROSEMI CORP | Microsemi Corporation | A3PN030-Z2QNG68 | PEI-Genesis | 3 | 49 | 70 °C | -20 °C | Bulk | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | Active | 30 | 5.8 | Yes | 1.575 V | 1.425 V | 1.5 V | -20°C ~ 85°C (TJ) | * | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | OTHER | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 768 | 30000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P030-QNG68I | Microchip | Datasheet | 416 | - | Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | A3P030 | MICROSEMI CORP | Microsemi Corporation | A3P030-QNG68I | Microchip Technology | 3 | 49 | 100 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.22 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | INDUSTRIAL | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | STD | 768 | 30000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN020V2-QNG68I | Microchip | Datasheet | 12 |
| Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 6 | 68-QFN (8x8) | 68 | AGLN020 | PUR | MICROSEMI CORP | Murrelektronik | 7000-PS202-8211050 | 600 VAC/600 VDC | Microchip Technology | 3 | 49 | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 5.59 | Yes | Female | Flying Leads | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO nano | Female to Flying Leads, 6-pole, M23 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | 15 Amps | S-XQCC-N68 | Not Qualified | INDUSTRIAL | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 520 | 20000 | STD | 520 | 20000 | IP65/IP67 | 10.5 Meters | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN030-Z2QNG68I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Push Pin | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) | Aluminium | Fins, Rectangular | ASIC | A3PN030 | Microchip Technology | 49 | Tray | Obsolete | Compliant | -40°C ~ 100°C (TJ) | ProASIC3 nano | 1.425V ~ 1.575V | 30000 | 57.912 mm | 60.96 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN015V5-QNG68I | Microchip | Datasheet | 37 |
| Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | AGLN015 | MICROSEMI CORP | AGLN015V5-QNG68I | 1.575 V | Microchip Technology | 1.425 V | 3 | 49 | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 2.09 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | IGLOO nano | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | INDUSTRIAL | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 384 | 15000 | STD | 384 | 15000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN015V2-QNG68I | Microchip | Datasheet | 37 |
| Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | AGLN015 | MICROSEMI CORP | AGLN015V2-QNG68I | 1.575 V | Microchip Technology | 1.14 V | 3 | 49 | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | NOT SPECIFIED | 5.61 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -40 to 85 °C | IGLOO nano | 8542.39.00.01 | 1.14V ~ 1.575V | QUAD | NO LEAD | NOT SPECIFIED | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | INDUSTRIAL | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 384 | 15000 | STD | 384 | 15000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN020-QNG68I | Microchip | Datasheet | 34 |
| Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | A3PN020 | MICROSEMI CORP | A3PN020-QNG68I | Microchip Technology | 3 | 49 | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 1.45 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 nano | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | INDUSTRIAL | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 20000 | STD | 520 | 20000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN030-Z1QNG68 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | A3PN030 | MICROSEMI CORP | Microsemi Corporation | A3PN030-Z1QNG68 | Microchip Technology | 3 | 49 | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Not Recommended | Active | 30 | 5.26 | Yes | FPGA - Field Programmable Gate Array 30K System Gates ProASIC3 nano | 1.575 V | 1.425 V | 1.5 V | -20°C ~ 85°C (TJ) | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | OTHER | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 768 | 30000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN030-ZQNG68 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-VFQFN Exposed Pad | YES | 68-QFN (8x8) | 68 | A3PN030 | MICROSEMI CORP | Microsemi Corporation | A3PN030-ZQNG68 | Microchip Technology | 3 | 49 | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Not Recommended | Active | 30 | 5.26 | Yes | 1.575 V | 1.425 V | 1.5 V | -20°C ~ 85°C (TJ) | ProASIC3 nano | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | OTHER | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | STD | 768 | 30000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A3PN015-QNG68I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Tin | Surface Mount | Surface Mount | 68-VFQFN Exposed Pad | 68 | 810.002575mg | 49 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | Active | 3 (168 Hours) | 68 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 260 | 1.5V | 0.4mm | 30 | A3PN015 | 49 | 1.5V | 1.51.5/3.3V | 8mA | FIELD PROGRAMMABLE GATE ARRAY | 160 | 15000 | 350MHz | 384 | 384 | 384 | 880μm | 8mm | 8mm | No | RoHS Compliant |
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A3PN030-Z1QNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGLN020V2-QNG68
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
10.372430
-
A3PN030-ZQNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGLN015V2-QNG68
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
10.061036
-
A3PN015-QNG68
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
7.319070
-
A3PN015-QNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.636623
-
AGLN020V5-QNG68
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
10.917556
-
A3P030-QNG68
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P030-1QNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AGLN015V5-QNG68
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
9.130397
-
A3PN030-Z2QNG68
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P030-QNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AGLN020V2-QNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
10.512777
-
A3PN030-Z2QNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGLN015V5-QNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
11.461295
-
AGLN015V2-QNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
12.705162
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A3PN020-QNG68I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.670955
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A3PN030-Z1QNG68
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PN030-ZQNG68
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PN015-QNG68I
Microsemi Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire