The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Number of I/Os
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- Package / Case:
896-BGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Housing Material | Weight | Number of Terminals | Panel Mount | Approvals | Base Product Number | Body Orientation | Brand | Case Size | Case Style | Clock Frequency-Max | Connections | Contact Classification | Contact Materials | Degree of protection (IP) | Degree of protection (NEMA) | Explosion safety category for dust | Explosion safety category for gas | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Material housing | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of contacts as change-over contact | Number of contacts as normally closed contact | Number of contacts as normally open contact | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temp Range | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Rad Hardened | Range | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shell Size / Insert Arrangement | Shipping Restrictions | Suitable for safety functions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Total Memory | Tradename | Type of control element | Type of electric connection | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Wire Gauge Max | Wire Gauge Min | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Applications | Gender | Additional Feature | HTS Code | Subcategory | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Contact Gender | Operating Supply Voltage | Power Supplies | Temperature Grade | Voltage | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | RAM Size | Number of Poles | Family | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Number of CLBs | Shell Plating | Number of Logic Cells | Number of GPIO | Number of Equivalent Gates | Product | Connection Type | Product Category | Strain Relief | Height | Length | Width | Radiation Hardening | Flammability Rating | Lead Free |
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![]() | Mfr Part No 5CGXFC9E7F31C8N | ALTERA | Datasheet | 632 |
| Min: 1 Mult: 1 | Surface Mount | 896-BGA | 896-FBGA (31x31) | 480 | 0°C ~ 85°C (TJ) | Cyclone® V GX | Active | 1.07 V ~ 1.13 V | 5CGXFC9 | 301000 | 14251008 | 113560 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA750-FG896A | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | APA750 | IP67 | Other | None | None | MICROSEMI CORP | Microsemi Corporation | APA750-FG896A | Plastic | Microchip Technology | 0 | 2 | 0 | 562 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | Compliant | No | Yes | Roller cam | Cable entry PG | -40°C ~ 125°C (TJ) | ProASICPLUS | 125 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B896 | 562 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 2.625 V | 2.375 V | 18 kB | 562 | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 750000 | 180 MHz | STD | 32768 | 32768 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CEBA7F31C7N | ALTERA | Datasheet | 2213 |
| Min: 1 Mult: 1 | Tin | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | Thermoplastic (TP) | 896 | Bussmann / Eaton | Brass | 100 | INTEL CORP | Eaton | 5CEBA7F31C7N | 480 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.04 | Details | Yes | 1.13 V | 1.07 V | 1.1 V | EuroMag | 300 V | 12 AWG | 24 AWG | 0°C ~ 85°C (TJ) | Bulk | EM2115 | Active | 3 Position | 85 °C | 0 °C | 8542.39.00.01 | Terminal Blocks | 5 mm | CMOS | 1.07 V ~ 1.13 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 16 A | 5CEBA7 | SMD/SMT | S-PBGA-B896 | 480 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 962 kB | 962 kB | 480 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 149500 | Pluggable Terminal Blocks | 7880704 | 800 MHz | 56480 | 56480 | 7 | 150000 | 480 | Edge Connector - PCB | Pluggable Terminal Blocks | 31 mm | 31 mm | UL 94 V-0 | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CEFA7F31I7N | ALTERA | Datasheet | 2168 |
| Min: 1 Mult: 1 | Surface Mount | 896-BGA | 896 | 896-FBGA (31x31) | Molex | 1 | -- | Molex | 480 | 845030D12M025 01300300082 130030-0082 | Details | Brad | -40°C ~ 100°C (TJ) | 130030 | Active | -- | 100 °C | -40 °C | Cable Assemblies | 1.07 V ~ 1.13 V | 5CEFA7 | 1.13 V | 962 kB | 962 kB | 149500 | Specialized Cables | 7880704 | 800 MHz | 56480 | 56480 | 7 | 480 | Specialized Cables | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP4CGX110DF31C7N | ALTERA | Datasheet | 1688 |
| Min: 1 Mult: 1 | Surface Mount | 896-BGA | 896 | 896-FBGA (31x31) | 475 | Compliant | 0°C ~ 85°C (TJ) | Cyclone® IV GX | Active | 85 °C | 0 °C | 1.16 V ~ 1.24 V | EP4CGX110 | 1.2 V | 1.24 V | 1.16 V | 686.3 kB | 686.3 kB | 3.125 Gbps | 109424 | 5621760 | 200 MHz | 6839 | 6839 | 7 | 8 | 475 | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CGXBC9E6F31C7N | ALTERA | Datasheet | 581 |
| Min: 1 Mult: 1 | Surface Mount | 896-BGA | 896-FBGA (31x31) | 480 | 0°C ~ 85°C (TJ) | Cyclone® V GX | Active | 1.07 V ~ 1.13 V | 5CGXBC9 | 301000 | 14251008 | 113560 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CEBA9F31C7N | ALTERA | Datasheet | 2355 |
| Min: 1 Mult: 1 | Surface Mount | 896-BGA | 896-FBGA (31x31) | -- | 480 | 0°C ~ 85°C (TJ) | Cyclone® V E | Active | -- | 1.07 V ~ 1.13 V | 5CEBA9 | 301000 | 14251008 | 113560 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP2C70F896C8N | ALTERA | Datasheet | 606 |
| Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | Intel / Altera | 402.5 MHz | 27 | INTEL CORP | -- | Intel | EP2C70F896C8N | 260 MHz | + 70 C | 0 C | Yes | 3 | SMD/SMT | 622 | 4276 LAB | 68416 LE | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | 969723 | Active | 40 | 1.39 | Details | Yes | This product may require additional documentation to export from the United States. | 1.25 V | 1.15 V | 1.2 V | 1152000 bit | Cyclone II | 0.529109 oz | 0°C ~ 85°C (TJ) | Tray | Cyclone® II | e1 | Active | -- | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.15 V ~ 1.25 V | BOTTOM | BALL | 260 | 1 mm | compliant | EP2C70 | S-PBGA-B896 | 606 | Not Qualified | 1.15 V to 1.25 V | 1.2,1.5/3.3,3.3 V | OTHER | - | 622 | 4276 CLBS | 2.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 68416 | FPGA - Field Programmable Gate Array | 1152000 | 4276 | - | 4276 | 68416 | FPGA - Field Programmable Gate Array | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL050-1FG896 | Microchip Technology | Datasheet | 2110 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2GL050 | 27 | MICROSEMI CORP | M2GL050-1FG896 | Microchip Technology | Yes | 3 | 377 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL050 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | OTHER | 228.3 kB | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA750-FG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771 mg | APA750 | 2.5 | Lower Mount | 1/4 NPT | NOSHOK | 25-410-30-vac/bar | 2.7 V | Microchip Technology | 2.3 V | 562 | Tray | Active | -30 Hg-0 psi | Compliant | 2.5000 V | -40 to 85 °C | ProASICPLUS | 85 °C | -40 °C | 2.3V ~ 2.7V | 180 MHz | 896 | 2.5 V | 2.7 V | 2.3 V | 18 kB | 147456 | 750000 | 180 MHz | STD | 32768 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL050-1FGG896I | Microchip | Datasheet | 2008 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | Metal | 896 | M2GL050 | MICROSEMI CORP | Microsemi Corporation | M2GL050-1FGG896I | Microchip Technology | 3 | 377 | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 5.3 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 228.3 kB | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP4CGX150DF31C8 | ALTERA | Datasheet | 488 |
| Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | 472.5 MHz | INTEL CORP | Intel Corporation | EP4CGX150DF31C8 | 3 | 475 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | 30 | 5.27 | Non-Compliant | No | 1.24 V | 1.16 V | 1.2 V | 0°C ~ 85°C (TJ) | Cyclone® IV GX | e0 | Active | TIN LEAD | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | 1.16 V ~ 1.24 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP4CGX150 | S-PBGA-B896 | 475 | Not Qualified | 1.2 V | 1.2,1.2/3.3,2.5 V | OTHER | 810 kB | 810 kB | 3.125 Gbps | 475 | 9360 CLBS | 2.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 149760 | 6635520 | 200 MHz | 9360 | 9360 | 8 | 8 | 9360 | 149760 | 475 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL050TS-1FG896 | Microchip | Datasheet | 1772 | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | No | M2GL050 | MICROSEMI CORP | Microsemi Corporation | M2GL050TS-1FG896 | Microchip Technology | 3 | 377 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | Black | Power | Receptacle | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | OTHER | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CGXFC7D6F31I7N | ALTERA | Datasheet | 1984 | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | 896 | 896-FBGA (31x31) | -- | Cutler Hammer, Div of Eaton Co | HVX075A1-2A1N1C2 | 480 | Compliant | -40°C ~ 100°C (TJ) | Cyclone® V GX | Active | -- | 100 °C | -40 °C | 1.07 V ~ 1.13 V | 5CGXFC7 | 1.13 V | 962 kB | 962 kB | 3.125 Gbps | 149500 | 7880704 | 800 MHz | 56480 | 56480 | 7 | 9 | 480 | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA750-FGG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | APA750 | 180 MHz | MICROSEMI CORP | Microsemi Corporation | APA750-FGG896 | Microchip Technology | 3 | 562 | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Compliant | Yes | 2.7 V | 2.3 V | 2.5 V | 2.5000 V | 0 to 70 °C | ProASICPLUS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 250 | 1 mm | compliant | 180 MHz | 896 | S-PBGA-B896 | 562 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 18 kB | 562 | 750000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 750000 | 180 MHz | STD | 32768 | 32768 | 750000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-FGG896M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | UL;CSA | A3PE3000 | 250 MHz | MICROSEMI CORP | Hubbell | VP10487 | Microchip Technology | 3 | 620 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | ProASIC3L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 100 Amps | 50 to 400 Hertz | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 600 | 1.575 V | 1.14 V | 63 kB | 4 | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 75264 | 75264 | 75264 | 3000000 | Plug | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-1FG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-1FG896 | Microchip Technology | 3 | 620 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | ProASIC3L | e0 | TIN LEAD | 70 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-FG896 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE3000L-FG896 | 1.26 V | Microchip Technology | 1.14 V | 3 | 620 | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.2 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CGXFC7D6F31C7N | ALTERA | Datasheet | 1835 |
| Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | INTEL CORP | -- | Intel Corporation | 5CGXFC7D6F31C7N | 3 | 480 | 85 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2 | Compliant | Yes | 8542390000 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Cyclone® V GX | e1 | Active | -- | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 8542.39.00.01 | 1.07 V ~ 1.13 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CGXFC7 | S-PBGA-B896 | 1.13 V | OTHER | 962 kB | 962 kB | 3.125 Gbps | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | 149500 | 7880704 | 800 MHz | 56480 | 56480 | 7 | 9 | 480 | 31 mm | 31 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA750-FGG896A | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Gold Over Nickel | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 2 | APA750 | Straight | 2Signal | Copper Alloy | MICROSEMI CORP | Microsemi Corporation | APA750-FGG896A | Microchip Technology | 562 | -55C to 125C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | No | 5.61 | Compliant | Yes | 12S-3 | Crimp | 700VDC/500VAC | -40°C ~ 125°C (TJ) | ProASICPLUS | Circular | 125 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B896 | 562 | Not Qualified | 2(POS) | PIN | 2.5 V | 2.5,2.5/3.3 V | 2.625 V | 2.375 V | 1(Port) | 18 kB | ACC | 562 | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 750000 | 180 MHz | STD | 32768 | Cadmium | 32768 | No | 1.73 mm | 31 mm | 31 mm | No |
5CGXFC9E7F31C8N
ALTERA
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Microchip
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326.537006
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Microchip Technology
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Microchip
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Microchip
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Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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389.231178
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Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
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