The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Package / Case
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- Number of Terminations
- Package / Case:
Axial
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Lead Free Status / RoHS Status | Lifetime @ Temp. | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Usage Level | Voltage Rated | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Power (Watts) | Additional Feature | HTS Code | Capacitance | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | RAM Size | Lead Style | Propagation Delay | Manufacturer Size Code | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Transceivers | Number of ADC Channels | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Features | Product Category | Height Seated (Max) | Length | Width | Thickness (Max) | Lead Free | Ratings |
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 | Mfr Part No A3PN250-Z1VQ100I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | YES | Axial | 100 | A3PN250 | MICROSEMI CORP | Microsemi Corporation | A3PN250-Z1VQ100I | Microchip Technology | 3 | 68 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, VQFP-100 | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.91 | No | 1.575 V | 1.425 V | 1.5 V | -65°C ~ 175°C | Tape & Reel (TR) | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | e0 | Active | 2 | ±25ppm/°C | 117 kOhms | TIN LEAD | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | 68 | Not Qualified | S (0.001%) | 1.5,1.5/3.3 V | INDUSTRIAL | 68 | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 6144 | 6144 | 250000 | Military, Moisture Resistant, Weldable | -- | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EX128-TQG64 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | YES | Axial | 64 | EX128 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | EX128-TQG64 | Microchip Technology | 3 | 46 | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.32 | Yes | 2.7 V | 2.3 V | 2.5 V | -65°C ~ 150°C | Tape & Reel (TR) | Military, MIL-PRF-39017/02, RLR20 | 0.138 Dia x 0.375 L (3.51mm x 9.53mm) | ±1% | e3 | Active | 2 | ±100ppm/°C | 8.45 kOhms | Matte Tin (Sn) | Metal Film | 0.5W, 1/2W | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G64 | R (0.01%) | COMMERCIAL | 6000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 256 | 6000 | STD | 1 ns | 6000 | Military, Moisture Resistant, Weldable | -- | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P125-1TQ144I | Microchip | Datasheet | 48 | - | Min: 1 Mult: 1 | Surface Mount | Axial | YES | Axial | 144 | A3P125 | 350 MHz | MICROSEMI CORP | Microsemi Corporation | A3P125-1TQ144I | Microchip Technology | 3 | 100 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | -65°C ~ 150°C | Tape & Reel (TR) | Military, MIL-PRF-39017/05, RLR05 | 0.066 Dia x 0.150 L (1.68mm x 3.81mm) | ±1% | e0 | Active | 2 | ±100ppm/°C | 118 Ohms | Tin/Lead (Sn/Pb) | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G144 | Not Qualified | S (0.001%) | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 3072 | 125000 | Military, Moisture Resistant, Weldable | -- | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP1K10FC256-1 | ALTERA | Datasheet | 2400 |
| Min: 1 Mult: 1 | Surface Mount | Axial | Axial | EP1K10 | -- | Altera | 136 | Bulk | Active | -65°C ~ 175°C | Tape & Reel (TR) | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | -- | 2 | ±25ppm/°C | 2.71 kOhms | Metal Film | 0.125W, 1/8W | 2.375 V ~ 2.625 V | EP1K10 | S (0.001%) | 576 | 12288 | 56000 | 72 | Military, Moisture Resistant, Weldable | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7A50T-L1FTG256I | AMD | Datasheet | 26 |
| Min: 1 Mult: 1 | Through Hole | Axial | 256-FTBGA (17x17) | XC7A50 | Lead free / RoHS Compliant | AMD | 170 | Tray | Active | 0.9500 V | 500V | -55°C ~ 125°C | Tape & Box (TB) | A | 0.098 Dia x 0.150 L (2.50mm x 3.80mm) | ±5% | 1 (Unlimited) | C0G, NP0 | General Purpose | 150pF | 0.95V ~ 1.05V | - | - | - | 52160 | 2764800 | 4075 | 1L | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7A75SLT-1CSG485C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 years ago) | Axial | Axial | RCD Components | 300 | Bulk | Active | Non-Compliant | -55°C ~ 235°C | RSF | 0.134 Dia x 0.354 L (3.40mm x 9.00mm) | ±5% | 2 | ±100ppm/°C | 12 kOhms | Metal Oxide Film | 1W | - | 71642 | 1 | 6 | 1 | Moisture Resistant | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX16-PL84A | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | YES | Axial | 84 | A42MX16 | MICROSEMI CORP | Microsemi Corporation | A42MX16-PL84A | Microchip Technology | 3 | 72 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | Obsolete | 30 | 5.53 | No | 5.25 V | 4.75 V | 5 V | -55°C ~ 350°C | Tape & Box (TB) | G200 | 0.224 Dia x 0.512 L (5.70mm x 13.00mm) | ±5% | e0 | Active | 2 | 100/ +180ppm/°C | 390 Ohms | Tin/Lead (Sn/Pb) | Wirewound | 4W | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | S-PQCC-J84 | Not Qualified | -- | AUTOMOTIVE | 24000 GATES | 4.57 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 2.4 ns | 24000 | Flame Proof, Pulse Withstanding, Safety | -- | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVU13P-2FSGA2577I | AMD | Datasheet | 489 | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | RN65 | Vishay Dale | 448 | Bulk | Active | -65°C ~ 175°C | Military, MIL-R-10509/2, RN65 | 0.180 Dia x 0.562 L (4.57mm x 14.27mm) | ±0.1% | 2 | ±25ppm/°C | 232 Ohms | Metal Film | 0.5W, 1/2W | 0.825V ~ 0.876V | - | 3780000 | 99090432 | 216000 | Flame Retardant Coating, Military, Moisture Resistant, Safety | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-FG144T | Microchip | Datasheet | 2380 | - | Min: 1 Mult: 1 | Through Hole | Axial | YES | 144-FPBGA (13x13) | 144 | A3P250 | 350 MHz | MICROSEMI CORP | -- | -- | Microsemi Corporation | A3P250-FG144T | Microchip Technology | 3 | 97 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.23 | No | 1.575 V | 1.425 V | 1.5 V | Automotive grade | 50V | -55°C ~ 125°C | Bulk | Military, MIL-PRF-39003/1, CSR13 | 0.135 Dia x 0.286 L (3.43mm x 7.26mm) | ±10% | e0 | Active | -- | Hermetically Sealed | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1µF | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 235 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | -- | B (0.1%) | -- | 1.5/3.3 V | AUTOMOTIVE | A | 97 | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | AEC-Q100 | STD | 6144 | 6144 | 250000 | Military | -- | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C256PQ208 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | Stackpole Electronics Inc | Bulk | Active | -55°C ~ 155°C | RNF | 0.071 Dia x 0.130 L (1.80mm x 3.30mm) | ±5% | 2 | ±100ppm/°C | 30 kOhms | Metal Film | 0.125W, 1/8W | - | Flame Retardant Coating, Safety | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5SGXEA7H2F35C1WN | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | 5SGXEA7 | Intel | 552 | Tray | Obsolete | -65°C ~ 175°C | Tape & Reel (TR) | Military, MIL-PRF-55182/07, RNC50 | 0.070 Dia x 0.150 L (1.78mm x 3.81mm) | ±1% | Active | 2 | ±50ppm/°C | 158 Ohms | Metal Film | 0.1W, 1/10W | 0.87V ~ 0.93V | S (0.001%) | 622000 | 51200000 | 234720 | Military, Moisture Resistant, Weldable | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 17S300AVQ44C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | -55°C ~ 175°C | Bulk | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.1% | Active | 2 | ±25ppm/°C | 4.81 kOhms | Metal Film | 0.5W, 1/2W | -- | Flame Retardant Coating, Moisture Resistant, Safety | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 18V04VQ44 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.1% | Active | 2 | ±25ppm/°C | 28.4 kOhms | Metal Film | 0.5W, 1/2W | -- | Flame Retardant Coating, Moisture Resistant, Safety | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 18V256JC | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.1% | Active | 2 | ±25ppm/°C | 274 kOhms | Metal Film | 0.5W, 1/2W | -- | Flame Retardant Coating, Moisture Resistant, Safety | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AX057K2F35I1HG | ALTERA | Datasheet | 639 |
| Min: 1 Mult: 1 | Surface Mount | Axial | Axial | Intel / Altera | 24 | Intel | + 100 C | - 40 C | Yes | SMD/SMT | 492 | 27135 LAB | 57000 LE | 966285 | Details | This product may require additional documentation to export from the United States. | 930 mV | 870 mV | Arria 10 FPGA | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.180 Dia x 0.562 L (4.57mm x 14.27mm) | ±1% | Active | 2 | ±100ppm/°C | 16.2 kOhms | Metal Film | 1.5W | Programmable Logic ICs | 0.87 V ~ 0.98 V | 950 mV | -- | 570000 | FPGA - Field Programmable Gate Array | 42082304 | 217080 | Flame Retardant Coating, Moisture Resistant, Safety | FPGA - Field Programmable Gate Array | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10M40DCF256I6G | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | YES | Axial | 256 | 450 MHz | INTEL CORP | Intel Corporation | 10M40DCF256I6G | 178 | 100 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | NOT SPECIFIED | 5.26 | Yes | 1.25 V | 1.15 V | 1.2 V | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.5% | e1 | Active | 2 | ±50ppm/°C | 2.43 kOhms | Tin/Silver/Copper (Sn/Ag/Cu) | Metal Film | 0.5W, 1/2W | OPERATES AT 2.5V NOMINAL VCC | 1.15 V ~ 1.25 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B256 | 178 | -- | INDUSTRIAL | 178 | 2500 CLBS | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 40000 | 1290240 | 2500 | 2500 | 40000 | Flame Retardant Coating, Moisture Resistant, Safety | -- | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP20K100EQC208-2 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | Axial | YES | 208 | Axial | 208 | INTEL CORP | Intel Corporation | EP20K100EQC208-2 | Kamaya Inc. | 3 | 151 | 151 | 85 °C | Bulk | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 30 | 5.04 | Compliant | No | 1.89 V | 1.71 V | 1.8 V | -55°C ~ 125°C | Bulk | RC | 0.094 Dia x 0.248 L (2.40mm x 6.30mm) | ±5% | e0 | Obsolete | 2 | - | 13 Ohms | Tin/Lead (Sn/Pb) | 85 °C | 0 °C | Carbon Composition | 0.25W, 1/4W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.71 V ~ 1.89 V | QUAD | GULL WING | 220 | 0.5 mm | compliant | 250 MHz | EP20K100 | S-PQFP-G208 | 143 | Not Qualified | - | 1.8,1.8/3.3 V | OTHER | 1.89 V | 1.71 V | 6.5 kB | 6.5 kB | 2.02 ns | 143 | 4 DEDICATED INPUTS, 151 I/O | 4.1 mm | LOADABLE PLD | 4160 | 53248 | 263000 | 170 MHz | 416 | 416 | MACROCELL | 4160 | 4 | - | - | 28 mm | 28 mm | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF300T-1FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Axial | Axial | Microchip Technology | 284 | Tray | Active | -65°C ~ 350°C | Tape & Reel (TR) | CW | 0.375 Dia x 1.781 L (9.52mm x 45.24mm) | ±5% | Active | 2 | ±30ppm/°C | 22 Ohms | Wirewound | 13W | 0.97V ~ 1.08V | -- | 300000 | 21600666 | Moisture Resistant | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LCMXO22000UHE4FG484CES | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | -55°C ~ 175°C | Bulk | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.1% | Active | 2 | ±25ppm/°C | 392 kOhms | Metal Film | 0.5W, 1/2W | -- | Flame Retardant Coating, Moisture Resistant, Safety | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LCMXO24000HE6MG132IES | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | -55°C ~ 175°C | Tape & Reel (TR) | CMF | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±0.1% | Active | 2 | ±25ppm/°C | 18.2 kOhms | Metal Film | 0.5W, 1/2W | -- | Flame Retardant Coating, Moisture Resistant, Safety | -- |
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A3PN250-Z1VQ100I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EX128-TQG64
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P125-1TQ144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP1K10FC256-1
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
43.442073
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XC7A50T-L1FTG256I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
77.422230
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XC7A75SLT-1CSG485C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A42MX16-PL84A
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCVU13P-2FSGA2577I
AMD
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-FG144T
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC2C256PQ208
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5SGXEA7H2F35C1WN
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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17S300AVQ44C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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18V04VQ44
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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18V256JC
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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10AX057K2F35I1HG
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
5,438.116944
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10M40DCF256I6G
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP20K100EQC208-2
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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MPF300T-1FCVG484T2
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO22000UHE4FG484CES
Lattice Semiconductor
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO24000HE6MG132IES
Lattice Semiconductor
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire