The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Minimum Operating Temperature
- Mounting Styles
- Number of I/Os
- Operating Supply Voltage
- Package / Case
- Series
- Supply Voltage-Max
- Supply Voltage-Min
- Base Product Number
- Height
- Package / Case:
BGA-456
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Registers | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No APA1000-BG456 | Microchip Technology | Datasheet | 552 |
| Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA1000 | 180 MHz | 24 | MICROSEMI CORP | APA1000-BG456 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 356 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0°C ~ 70°C (TA) | Tray | APA1000 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 356 | 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | STD | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-BG456 | Microchip Technology | Datasheet | 676 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Lead, Silver, Tin | Surface Mount | Surface Mount | BGA-456 | YES | 456 | 456-PBGA (35x35) | 456 | APA600 | 180 MHz | 24 | MICROSEMI CORP | APA600-BG456 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 356 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | IC FPGA 356 I/O 456BGA | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | 0 to 70 °C | Tray | APA600 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 456 | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 15.8 kB | 356 | 600000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 129024 | 600000 | 180 MHz | STD | 21504 | 21504 | 600000 | 1.73 mm | 35 mm | 35 mm | No | Contains Lead | ||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-BGG456M | Microchip Technology | Datasheet | 613 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | 456-PBGA (35x35) | APA1000 | 24 | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 356 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | -55°C ~ 125°C (TC) | Tray | APA1000 | 2.3V ~ 2.7V | 2.5 V | 202752 | 1000000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-BGG456I | Microchip Technology | Datasheet | 483 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA1000 | 180 MHz | 24 | MICROSEMI CORP | APA1000-BGG456I | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 356 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | -40 to 85 °C | Tray | APA1000 | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1.27 mm | compliant | 456 | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 356 | 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | STD | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA750-BG456 | Microchip Technology | Datasheet | 644 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | BGA-456 | 456 | 456-PBGA (35x35) | APA750 | 24 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 356 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0°C ~ 70°C (TA) | Tray | APA750 | 70 °C | 0 °C | 2.3V ~ 2.7V | 2.5 V | 2.7 V | 2.3 V | 18 kB | 147456 | 750000 | 180 MHz | STD | 32768 | 1.73 mm | 35 mm | 35 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA750-BG456I | Microchip Technology | Datasheet | 694 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Silver, Tin | Surface Mount | Surface Mount | BGA-456 | YES | 456 | 456-PBGA (35x35) | 456 | APA750 | 180 MHz | 24 | MICROSEMI CORP | APA750-BG456I | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 356 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | -40 to 85 °C | Tray | APA750 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 180 MHz | 456 | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 18 kB | 356 | 750000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 750000 | 180 MHz | STD | 32768 | 32768 | 750000 | 1.73 mm | 35 mm | 35 mm | No | ||||||||||||||||||||||||
![]() | Mfr Part No APA300-BG456I | Microchip Technology | Datasheet | 459 |
| Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | 290 | 8192 | APA300 | 180 MHz | 300000 | 24 | PROASICPLUS | MICROSEMI CORP | APA300-BG456I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 290 I/O | 300000 | 2.7(V) | 2.3(V) | 2.5(V) | -40C to 85C | 85C | -40C | INDUSTRIALC | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | BGA | Active | 0.22UM | Active | Yes | No | 30 | 5.24 | N | No | FPGA ProASICPLUS Family 300K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA Tray | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -40°C ~ 85°C (TA) | Tray | APA300 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 180(MHz) | 456 | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||
![]() | Mfr Part No APA1000-BG456I | Microchip Technology | Datasheet | 522 |
| Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA1000 | 180 MHz | 24 | MICROSEMI CORP | APA1000-BG456I | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 356 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | -40 to 85 °C | Tray | APA1000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 456 | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 356 | 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | STD | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-BGG456M | Microchip Technology | Datasheet | 440 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | BGA-456 | 456 | 456-PBGA (35x35) | APA600 | 24 | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 356 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | -55°C ~ 125°C (TC) | Tray | APA600 | 125 °C | -55 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | 21504 | 1.73 mm | 35 mm | 35 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-BG456M | Microchip Technology | Datasheet | 561 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA300 | 180 MHz | 24 | MICROSEMI CORP | APA300-BG456M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 290 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -55°C ~ 125°C (TC) | Tray | APA300 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-BG456M | Microchip Technology | Datasheet | 723 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | BGA-456 | 456 | 456-PBGA (35x35) | APA600 | 24 | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 356 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | -55°C ~ 125°C (TC) | Tray | APA600 | 125 °C | -55 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | 21504 | 1.73 mm | 35 mm | 35 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-BG456M | Microchip Technology | Datasheet | 401 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA1000 | 180 MHz | 24 | MICROSEMI CORP | APA1000-BG456M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 356 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 1.54 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -55°C ~ 125°C (TC) | Tray | APA1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | NOT SPECIFIED | 1.27 mm | unknown | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 356 | 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-BGG456 | Microchip Technology | Datasheet | 1989 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA450 | 180 MHz | 24 | MICROSEMI CORP | APA450-BGG456 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 344 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | 0 to 70 °C | Tray | APA450 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1.27 mm | compliant | 456 | S-PBGA-B456 | 344 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 344 | 450000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 450000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-BGG456I | Microchip Technology | Datasheet | 1827 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | BGA-456 | 456 | 456-PBGA (35x35) | APA600 | 24 | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 356 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 2.5000 V | -40 to 85 °C | Tray | APA600 | 85 °C | -40 °C | 2.3V ~ 2.7V | 456 | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 35 mm | 35 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-BGG456 | Microchip Technology | Datasheet | 1963 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA300 | 180 MHz | 24 | MICROSEMI CORP | APA300-BGG456 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 290 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0°C ~ 70°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-BGG456 | Microchip Technology | Datasheet | 432 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Copper, Silver, Tin | Surface Mount | Surface Mount | BGA-456 | 456 | 456-PBGA (35x35) | APA600 | 24 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | SMD/SMT | 356 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 2.5000 V | 0 to 70 °C | Tray | APA600 | 70 °C | 0 °C | 2.3V ~ 2.7V | 180 MHz | 456 | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 35 mm | 35 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-BGG456I | Microchip Technology | Datasheet | 2030 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | 456-PBGA (35x35) | APA450 | 24 | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | SMD/SMT | 344 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 2.5000 V | -40 to 85 °C | Tray | APA450 | 2.3V ~ 2.7V | 456 | 2.5 V | 110592 | 450000 | STD | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2VP7-5FGG456I4307 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-456 | 154 Kb | 1 | + 100 C | - 40 C | SMD/SMT | 248 I/O | 1232 LAB | 11088 LE | 1.575 V | 1.425 V | XC2VP7 | 1.425 V to 1.575 V | 6.25 Gb/s | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2VP4-5FGG456I4307 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-456 | 94 Kb | 1 | + 100 C | - 40 C | SMD/SMT | 248 I/O | 752 LAB | 6768 LE | 1.575 V | 1.425 V | XC2VP4 | 1.425 V to 1.575 V | 6.25 Gb/s | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2VP7-5FG456I4307 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-456 | 154 Kb | 1 | + 100 C | - 40 C | SMD/SMT | 248 I/O | 1232 LAB | 11088 LE | 1.575 V | 1.425 V | XC2VP7 | 1.425 V to 1.575 V | 6.25 Gb/s |
APA1000-BG456
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,779.521885
APA600-BG456
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
881.269777
APA1000-BGG456M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA1000-BGG456I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA750-BG456
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
857.973669
APA750-BG456I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,919.373990
APA300-BG456I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
560.246409
APA1000-BG456I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
3,508.777851
APA600-BGG456M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA300-BG456M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA600-BG456M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA1000-BG456M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA450-BGG456
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA600-BGG456I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA300-BGG456
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA600-BGG456
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA450-BGG456I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC2VP7-5FGG456I4307
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC2VP4-5FGG456I4307
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC2VP7-5FG456I4307
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
