The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | RAM Size | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Max Junction Temperature (Tj) | Number of Logic Cells | Ambient Temperature Range High | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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![]() | Mfr Part No M1A3PE1500-2FGG484I | Microchip Technology | Datasheet | 1804 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE1500-2FGG484I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 280 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P250-2FG144 | Microchip Technology | Datasheet | 22 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P250 | 350 MHz | 160 | MICROSEMI CORP | M1A3P250-2FG144 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1AGL250V5-FG144 | Microchip Technology | Datasheet | 29 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M1AGL250 | 108 MHz | 160 | MICROSEMI CORP | M1AGL250V5-FG144 | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | M1AGL250V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P600-1FGG144I | Microchip Technology | Datasheet | 23 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P600 | 160 | MICROSEMI CORP | M1A3P600-1FGG144I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE1500-2FG484 | Microchip Technology | Datasheet | 2272 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE1500-2FG484 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 280 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3PE1500 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-FG676I | Microchip Technology | Datasheet | 538 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Tin | Surface Mount | Surface Mount | FBGA | 676 | 676-FBGA (27x27) | 400.011771 mg | APA600 | 40 | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | SMD/SMT | 454 I/O | Tray | Active | N | 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 2.5000 V | 0.014110 oz | -40 to 85 °C | Tray | APA600 | 85 °C | -40 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE3000L-1FG896 | Microchip Technology | Datasheet | 588 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000L-1FG896 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 620 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3PE3000L | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32A-FG256A | Microchip Technology | Datasheet | 1912 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | A54SX32 | 90 | 238 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 203 I/O | Tray | Active | N | 2.75 V | 2.25 V | Actel | 0.014110 oz | -40°C ~ 125°C (TA) | Tray | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | STD | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL1000V2-FG256 | Microchip Technology | Datasheet | 2260 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AGL1000 | 108 MHz | 90 | MICROSEMI CORP | AGL1000V2-FG256 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | 0 to 70 °C | Tray | AGL1000V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | OTHER | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-FG896I | Microchip Technology | Datasheet | 672 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | APA1000 | 180 MHz | 27 | MICROSEMI CORP | APA1000-FG896I | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 642 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | 0.014110 oz | -40 to 85 °C | Tray | APA1000 | e0 | 3A001.A.7.A | TIN LEAD | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | 896 | S-PBGA-B896 | 642 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 642 | 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | STD | 56320 | 1000000 | 1.73 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX72A-1FG256I | Microchip Technology | Datasheet | 1780 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX72 | 250 MHz | 90 | MICROSEMI CORP | A54SX72A-1FG256I | 250 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 203 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | A54SX72A | e0 | TIN LEAD/TIN LEAD SILVER | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,3.3/5 V | INDUSTRIAL | 203 | 6036 CLBS, 108000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1AFS600-FG484I | Microchip Technology | Datasheet | 2320 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | M1AFS600 | 60 | MICROSEMI CORP | M1AFS600-FG484I | 1098.9 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 172 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-1FGG484 | Microchip Technology | Datasheet | 2283 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 60 | MICROSEMI CORP | A3PE3000-1FGG484 | 272 MHz | 1.575 V | + 70 C | FLASH | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 341 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 272 MHz | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 128 B | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 35000 | 516096 | 3000000 | 272 MHz | 1 | 75264 | 75264 | 85 °C | 70 °C | 3000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||
![]() | Mfr Part No XC2V3000-5FG676C | Xilinx | Datasheet | 8 | - | Min: 1 Mult: 1 | FBGA | YES | 2007 | e0 | no | Discontinued | 3 (168 Hours) | 676 | 3A991.D | Tin/Lead (Sn63Pb37) | 85°C | 0°C | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | 676 | S-PBGA-B676 | 484 | 1.5V | OTHER | 216kB | 484 | FIELD PROGRAMMABLE GATE ARRAY | 5 | 28672 | 0.39 ns | 3000000 | 2.6mm | 27mm | 27mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-FG896M | Microchip Technology | Datasheet | 695 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | APA1000 | 180 MHz | 27 | MICROSEMI CORP | APA1000-FG896M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 642 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -55°C ~ 125°C (TC) | Tray | APA1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | 642 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 642 | 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | 56320 | 1000000 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-2FGG484I | Microchip Technology | Datasheet | 513 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 60 | MICROSEMI CORP | A3PE3000-2FGG484I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 341 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE3000 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 310 MHz | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 310 MHz | 2 | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||
![]() | Mfr Part No M1AFS600-2FGG256I | Microchip Technology | Datasheet | 1712 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-2FGG256I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | FBGA-256 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000-1FG144I | Microchip Technology | Datasheet | 1617 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-1FG144I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE3000-FGG896 | Microchip Technology | Datasheet | 2084 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000-FGG896 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 620 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE600-1FGG484 | Microchip Technology | Datasheet | 2302 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE600 | 60 | MICROSEMI CORP | A3PE600-1FGG484 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 270 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 272 MHz | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 272 MHz | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No |
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