The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Minimum Operating Temperature
- Moisture Sensitive
- Mounting Styles
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Package / Case
- Packaging
- RoHS
- Series
- Package / Case:
FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No A3PE3000-1FGG896I | Microchip Technology | Datasheet | 571 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 27 | MICROSEMI CORP | A3PE3000-1FGG896I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 272 MHz | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FGG144A | Microchip Technology | Datasheet | 1705 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | APA450 | 160 | MICROSEMI CORP | APA450-FGG144A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 100 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | 5.59 | Details | Yes | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 125 °C | -40 °C | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 2.625 V | 2.375 V | 13.5 kB | 100 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-FGG896 | Microchip Technology | Datasheet | 677 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | APA1000 | 180 MHz | 27 | MICROSEMI CORP | APA1000-FGG896 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 642 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | 0.014110 oz | 0 to 70 °C | Tray | APA1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 250 | 1 mm | compliant | 180 MHz | 896 | S-PBGA-B896 | 642 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 24.8 kB | 642 | 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | 180 MHz | STD | 56320 | 56320 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||
![]() | Mfr Part No AX2000-FGG896I | Microchip Technology | Datasheet | 512 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 649 MHz | 27 | MICROSEMI CORP | AX2000-FGG896I | 649 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 586 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX2000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | 21504 | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||
![]() | Mfr Part No A54SX72A-1FGG256I | Microchip Technology | Datasheet | 1904 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX72 | 250 MHz | 90 | MICROSEMI CORP | A54SX72A-1FGG256I | 250 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 203 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | A54SX72A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,3.3/5 V | INDUSTRIAL | 203 | 6036 CLBS, 108000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-FG484 | Microchip Technology | Datasheet | 2195 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | A3PE3000-FG484 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 341 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 63 kB | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 231 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | Contains Lead | |||||||||||||||||||||||
![]() | Mfr Part No M1AFS600-FGG256I | Microchip Technology | Datasheet | 2107 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-FGG256I | 1098.9 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-FG896I | Microchip Technology | Datasheet | 448 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | 27 | MICROSEMI CORP | A3PE3000L-FG896I | 781.25 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE3000L | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 781.25 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||
![]() | Mfr Part No A3PE3000-2FGG484 | Microchip Technology | Datasheet | 2343 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 60 | MICROSEMI CORP | A3PE3000-2FGG484 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 341 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 310 MHz | 2 | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-FG896A | Microchip Technology | Datasheet | 476 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | APA1000 | 27 | MICROSEMI CORP | APA1000-FG896A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 642 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA1000 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B896 | 642 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 642 | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | 56320 | 1.73 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P600L-FGG484I | Microchip Technology | Datasheet | 1925 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 350 MHz | 60 | MICROSEMI CORP | M1A3P600L-FGG484I | 781.25 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 235 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P600L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX250-1FG256M | Microchip Technology | Datasheet | 463 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | AX250 | 90 | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 138 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P600-2FGG484I | Microchip Technology | Datasheet | 2245 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | 60 | MICROSEMI CORP | A3P600-2FGG484I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 235 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 310 MHz | 2 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||
![]() | Mfr Part No XC3S700A-5FG484C | Xilinx | Datasheet | 260 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 484 | 372 | e0 | no | 3 (168 Hours) | 484 | 3A991.D | Tin/Lead (Sn63Pb37) | 85°C | 0°C | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | 484 | 288 | Not Qualified | 1.2V | 1.26V | OTHER | 45kB | 770MHz | FIELD PROGRAMMABLE GATE ARRAY | 13248 | 700000 | 1472 | 5 | 0.62 ns | 2.6mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2V80-4FG256C | Xilinx | Datasheet | 870 | - | Min: 1 Mult: 1 | FBGA | YES | e0 | no | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 85°C | 0°C | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | 256 | S-PBGA-B256 | 120 | 1.5V | 1.575V | 1.51.5/3.33.3V | OTHER | 18kB | 650MHz | 120 | 128 CLBS, 80000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 4 | 1024 | 128 | 1152 | 80000 | 2mm | 17mm | 17mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-FG256A | Microchip Technology | Datasheet | 560 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | APA600 | 90 | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 186 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA600 | 125 °C | -40 °C | 2.375V ~ 2.625V | 2.5 V | 2.625 V | 2.375 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2V2000-5FG676C | Xilinx | Datasheet | 166 | - | Min: 1 Mult: 1 | FBGA | YES | e0 | no | 3 (168 Hours) | 676 | 3A991.D | Tin/Lead (Sn63Pb37) | 85°C | 0°C | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | 676 | S-PBGA-B676 | 456 | 1.5V | OTHER | 126kB | 456 | 2688 CLBS, 2000000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 5 | 21504 | 0.39 ns | 2688 | 24192 | 2000000 | 2.6mm | 27mm | 27mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FGG144 | Microchip Technology | Datasheet | 1912 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | APA450 | 180 MHz | 160 | MICROSEMI CORP | APA450-FGG144 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 100 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | 180 MHz | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 2.7 V | 2.3 V | 13.5 kB | 100 | 450000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 450000 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||
![]() | Mfr Part No AX1000-FG676I | Microchip Technology | Datasheet | 448 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 649 MHz | 40 | MICROSEMI CORP | AX1000-FG676I | 649 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 418 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX1000 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 649 MHz | S-PBGA-B676 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | 12096 | 0.99 ns | 12096 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-1FGG324 | Microchip Technology | Datasheet | 452 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | 250 MHz | 84 | MICROSEMI CORP | A3PE3000L-1FGG324 | 892.86 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 221 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 19 X 19 MM, 1.63 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-324 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE3000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 892.86 MHz | 1 | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | Lead Free |
A3PE3000-1FGG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA450-FGG144A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
308.217243
APA1000-FGG896
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
3,095.515766
AX2000-FGG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,661.813853
A54SX72A-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
348.805262
A3PE3000-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1AFS600-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE3000L-FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,339.250450
A3PE3000-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA1000-FG896A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
4,898.692479
M1A3P600L-FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX250-1FG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,957.968343
A3P600-2FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
140.069199
XC3S700A-5FG484C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC2V80-4FG256C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA600-FG256A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
559.293291
XC2V2000-5FG676C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA450-FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
229.318261
AX1000-FG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
784.436474
A3PE3000L-1FGG324
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
