The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No M7AFS600-FGG484 | Microchip Technology | Datasheet | 1610 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | M7AFS600 | 60 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 172 I/O | Tray | Active | Details | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | M7AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | STD | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-FG896I | Microchip Technology | Datasheet | 1626 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000-FG896I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE3000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-1FG256I | Microchip Technology | Datasheet | 2208 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M7A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M7A3P1000-1FG256I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Not Recommended | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M7A3P1000 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 272 MHz | 1 | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||
| Mfr Part No M1AGL600V5-FGG144I | Microchip Technology | Datasheet | 24 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M1AGL600 | 108 MHz | 160 | MICROSEMI CORP | M1AGL600V5-FGG144I | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | M1AGL600V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-2FGG676 | Microchip Technology | Datasheet | 740 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 870 MHz | 40 | MICROSEMI CORP | AX1000-2FGG676 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 418 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 870 MHz | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 740 ps | 740 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 870 MHz | 18144 | 12096 | 2 | 12096 | 0.74 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||
| Mfr Part No AX1000-FGG676 | Microchip Technology | Datasheet | 628 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 649 MHz | 40 | MICROSEMI CORP | AX1000-FGG676 | 649 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 418 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||
| Mfr Part No A54SX72A-1FGG484 | Microchip Technology | Datasheet | 1706 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (27X27) | 484 | A54SX72 | 250 MHz | 40 | MICROSEMI CORP | A54SX72A-1FGG484 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 360 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | A54SX72A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 360 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 360 | 6036 CLBS, 108000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M7AFS600-1FGG484I | Microchip Technology | Datasheet | 1724 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | M7AFS600 | 60 | 1282.05 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 172 I/O | Tray | Active | Details | 1.575 V | 1.425 V | Fusion | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | M7AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 1 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7AFS600-1FGG256I | Microchip Technology | Datasheet | 1651 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M7AFS600 | 90 | MICROSEMI CORP | M7AFS600-1FGG256I | 1282.05 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | M7AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-FG256I | Microchip Technology | Datasheet | 1885 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | M1AFS600 | 90 | 1098.9 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 119 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.0989 GHz | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-FGG256M | Microchip Technology | Datasheet | 547 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | AX250 | 90 | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 138 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2V250-4FG456C | Xilinx | Datasheet | 16 | - | Min: 1 Mult: 1 | FBGA | YES | e0 | no | 3 (168 Hours) | 456 | 3A991.D | Tin/Lead (Sn63Pb37) | 85°C | 0°C | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | 456 | 200 | 1.5V | 1.575V | 1.51.5/3.33.3V | OTHER | 54kB | 650MHz | 200 | FIELD PROGRAMMABLE GATE ARRAY | 4 | 3072 | 384 | 250000 | 2.6mm | 23mm | 23mm | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-1FG896I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000-1FG896I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3PE3000 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX72A-1FGG256 | Microchip Technology | Datasheet | 1635 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX72 | 250 MHz | 90 | MICROSEMI CORP | A54SX72A-1FGG256 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 203 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | A54SX72A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 203 | 6036 CLBS, 108000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2V500-4FG456C | Xilinx | Datasheet | 413 | - | Min: 1 Mult: 1 | FBGA | YES | e0 | no | 3 (168 Hours) | 456 | 3A991.D | Tin/Lead (Sn63Pb37) | 85°C | 0°C | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | 456 | 264 | 1.5V | 1.575V | 1.51.5/3.33.3V | OTHER | 72kB | 650MHz | 264 | 768 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | 4 | 6144 | 768 | 6912 | 500000 | 2.6mm | 23mm | 23mm | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-2FG896I | Microchip Technology | Datasheet | 726 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000-2FG896I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE3000 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 2 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1FGG484I | Microchip Technology | Datasheet | 2310 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX250 | 60 | 763 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 248 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX500-1FG484 | Microchip Technology | Datasheet | 1896 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX500 | 60 | 763 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 317 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-2FGG484I | Microchip Technology | Datasheet | 1734 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AFS600 | 60 | MICROSEMI CORP | AFS600-2FGG484I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 172 I/O | 7000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.47059 GHz | 2 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-2FG256 | Microchip Technology | Datasheet | 2148 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | M7A3P1000 | 90 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 177 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 310 MHz | 2 | 24576 | 1.2 mm | 17 mm | 17 mm | No |
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M7AFS600-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000-FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
579.517429
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M7A3P1000-1FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V5-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX1000-2FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,091.229140
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AX1000-FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
605.497932
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A54SX72A-1FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
348.805262
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M7AFS600-1FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M7AFS600-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AFS600-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
319.963049
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AX250-FGG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,362.483462
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XC2V250-4FG456C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000-1FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A54SX72A-1FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
302.623630
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XC2V500-4FG456C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000-2FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AX250-1FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
234.697979
-
AX500-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
263.953087
-
AFS600-2FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
236.825566
-
M7A3P1000-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
165.465906