The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No AFS1500-FGG256 | Microchip Technology | Datasheet | 2089 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS1500 | 90 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.0989 GHz | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.0989 GHz | STD | 38400 | 1.2 mm | 17 mm | 17 mm | No | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M7A3P1000-2FGG484 | Microchip Technology | Datasheet | 2060 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | M7A3P1000 | 60 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 300 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 310 MHz | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 310 MHz | 2 | 24576 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FG256I | Microchip Technology | Datasheet | 2285 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA300 | 180 MHz | 90 | MICROSEMI CORP | APA300-FG256I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 186 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 1.62 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA300 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 186 | 300000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX2000-FGG896 | Microchip Technology | Datasheet | 556 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 649 MHz | 27 | MICROSEMI CORP | AX2000-FGG896 | 649 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 586 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX2000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | 21504 | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||
![]() | Mfr Part No A3P600-2FGG256I | Microchip Technology | Datasheet | 61 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-2FGG256I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX2000-1FGG896M | Microchip Technology | Datasheet | 505 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 763 MHz | 27 | MICROSEMI CORP | AX2000-1FGG896M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 586 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX2000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 850 ps | 850 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 763 MHz | 32256 | MIL-STD-883 Class B | 21504 | 1 | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||
![]() | Mfr Part No A3PE3000-FGG324 | Microchip Technology | Datasheet | 1936 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | 350 MHz | 84 | MICROSEMI CORP | A3PE3000-FGG324 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 221 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B324 | 221 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 25 mA | 63 kB | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 231 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | Lead Free | ||||||||||||||||
![]() | Mfr Part No AGLE3000V5-FGG484I | Microchip Technology | Datasheet | 631 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AGLE3000 | 250 MHz | 60 | MICROSEMI CORP | AGLE3000V5-FGG484I | 892.86 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 341 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AGLE3000V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5 V | INDUSTRIAL | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No AX2000-1FGG896I | Microchip Technology | Datasheet | 708 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 763 MHz | 27 | MICROSEMI CORP | AX2000-1FGG896I | 763 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 586 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX2000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 36 kB | 850 ps | 850 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 763 MHz | 32256 | 21504 | 1 | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||
![]() | Mfr Part No APA150-FGG144 | Microchip Technology | Datasheet | 2164 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | APA150 | 160 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 100 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA150 | 2.3V ~ 2.7V | 2.5 V | 36864 | 150000 | STD | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL1000V5-FG256I | Microchip Technology | Datasheet | 1981 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AGL1000 | 108 MHz | 90 | MICROSEMI CORP | AGL1000V5-FG256I | 892.86 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 2.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AGL1000V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-2FGG484 | Microchip Technology | Datasheet | 2275 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3P1000 | 350 MHz | 60 | MICROSEMI CORP | A3P1000-2FGG484 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P400-2FGG256I | Microchip Technology | Datasheet | 3040 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | A3P400 | 90 | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | SMD/SMT | 178 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P400 | 1.425V ~ 1.575V | 1.5 V | 55296 | 400000 | 2 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FG144I | Microchip Technology | Datasheet | 2136 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA300 | 180 MHz | 160 | MICROSEMI CORP | APA300-FG144I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 100 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.62 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA300 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 100 | 300000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P600-1FGG256 | Microchip Technology | Datasheet | 29 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-1FGG256 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-FG484I | Microchip Technology | Datasheet | 441 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AFS1500 | 60 | MICROSEMI CORP | AFS1500-FG484I | 1098.9 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 223 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS1500 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 1.0989 GHz | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.0989 GHz | STD | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | Contains Lead | ||||||||||||||||||||||||
![]() | Mfr Part No AX2000-1FG896 | Microchip Technology | Datasheet | 410 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 763 MHz | 27 | MICROSEMI CORP | AX2000-1FG896 | 763 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 586 I/O | 21504 LE | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX2000 | e0 | TIN LEAD | 70 °C | 0 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 36 kB | 850 ps | 850 ps | - | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 763 MHz | 32256 | 21504 | 1 | - | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | Contains Lead | |||||||
![]() | Mfr Part No A3PE3000-2FGG324I | Microchip Technology | Datasheet | 641 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 324 | 324-FBGA (19x19) | 400.011771 mg | 324 | A3PE3000 | 84 | MICROSEMI CORP | A3PE3000-2FGG324I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 221 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B324 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 25 mA | 63 kB | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 310 MHz | 2 | 75264 | 75264 | 3000000 | 1.25 mm | 19 mm | 19 mm | No | |||||||||||||||||||||||||
![]() | Mfr Part No M1AGL600V2-FGG256I | Microchip Technology | Datasheet | 1963 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AGL600 | 108 MHz | 90 | MICROSEMI CORP | M1AGL600V2-FGG256I | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | M1AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||
![]() | Mfr Part No APA450-FG484 | Microchip Technology | Datasheet | 2120 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | APA450 | 60 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 344 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | 70 °C | 0 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 13.5 kB | 110592 | 450000 | 180 MHz | STD | 12288 | 1.73 mm | 23 mm | 23 mm | No |
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Price: please inquire
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Price: please inquire
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Price: please inquire
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Price: please inquire
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Price: please inquire
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Price: please inquire
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Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE3000-2FGG324I
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Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
296.765614
