The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Factory Pack QuantityFactory Pack Quantity
- Maximum Operating Temperature
- Minimum Operating Temperature
- Moisture Sensitive
- Mounting Styles
- Number of Gates
- Number of I/Os
- Operating Supply Voltage
- Package / Case
- Packaging
- RoHS
- Series
- Package / Case:
FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No AFS1500-1FGG484 | Microchip Technology | Datasheet | 750 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | AFS1500 | 60 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 223 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.28205 GHz | 1 | 38400 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA450-FG256 | Microchip Technology | Datasheet | 2229 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA450 | 180 MHz | 90 | MICROSEMI CORP | APA450-FG256 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 186 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 450000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 450000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||
| Mfr Part No APA300-FGG256 | Microchip Technology | Datasheet | 2099 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA300 | 180 MHz | 90 | MICROSEMI CORP | APA300-FGG256 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 186 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 300000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||
| Mfr Part No APA450-FG144A | Microchip Technology | Datasheet | 685 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA450 | 160 | MICROSEMI CORP | APA450-FG144A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 100 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 100 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-FG256 | Microchip Technology | Datasheet | 1953 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS600 | 90 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | 7000 LE | Tray | Active | N | 8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.0989 GHz | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-FGG484 | Microchip Technology | Datasheet | 559 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 649 MHz | 60 | MICROSEMI CORP | AX1000-FGG484 | 649 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 317 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||
| Mfr Part No A3P060-1FGG144 | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | A3P060 | 160 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 96 I/O | Tray | Active | Details | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P060 | 1.425V ~ 1.575V | 1.5 V | 18432 | 60000 | 1 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-2FG484I | Microchip Technology | Datasheet | 1734 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AFS1500 | 60 | MICROSEMI CORP | AFS1500-2FG484I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 223 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS1500 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.47059 GHz | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||
| Mfr Part No AFS600-1FG484I | Microchip Technology | Datasheet | 756 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AFS600 | 60 | MICROSEMI CORP | AFS600-1FG484I | 1282.05 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 172 I/O | 7000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS600 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.28205 GHz | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||
| Mfr Part No M7A3P1000-FGG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M7A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M7A3P1000-FGG256I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Not Recommended | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M7A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 231 MHz | STD | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||
| Mfr Part No AFS250-1FG256 | Microchip Technology | Datasheet | 1692 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS250 | 90 | MICROSEMI CORP | AFS250-1FG256 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 114 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS250 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1.28205 GHz | 1 | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||
| Mfr Part No AX1000-1FGG484I | Microchip Technology | Datasheet | 572 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 763 MHz | 60 | MICROSEMI CORP | AX1000-1FGG484I | 763 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 317 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||
| Mfr Part No AFS1500-1FG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS1500 | 90 | 1282.05 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 119 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS1500 | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.28205 GHz | 1 | 38400 | 1.2 mm | 17 mm | 17 mm | No | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX72A-2FGG484I | Microchip Technology | Datasheet | 412 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (27X27) | A54SX72 | 40 | 294 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 360 I/O | Tray | Active | Details | 2.75 V | 2.25 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | A54SX72A | 2.25V ~ 5.25V | 2.5 V | 108000 | 6036 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-1FG256I | Microchip Technology | Datasheet | 1631 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX32 | 278 MHz | 90 | MICROSEMI CORP | A54SX32A-1FG256I | 278 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 203 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | A54SX32A | TIN LEAD/TIN LEAD SILVER | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,2.5/5 V | INDUSTRIAL | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-2FG256I | Microchip Technology | Datasheet | 794 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX32 | 313 MHz | 90 | MICROSEMI CORP | A54SX32A-2FG256I | 313 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 203 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | A54SX32A | TIN LEAD/TIN LEAD SILVER | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,2.5/5 V | INDUSTRIAL | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 0.9 ns | 2880 | 2880 | 48000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-FGG144I | Microchip Technology | Datasheet | 1690 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M7A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M7A3P1000-FGG144I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Not Recommended | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M7A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 231 MHz | STD | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||
| Mfr Part No AX250-1FGG256 | Microchip Technology | Datasheet | 2141 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | AX250 | 90 | 763 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 138 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P125-1FGG144I | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P125 | 350 MHz | 160 | MICROSEMI CORP | A3P125-1FGG144I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P125 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 1 | 3072 | 125000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||
| Mfr Part No AFS250-2FGG256I | Microchip Technology | Datasheet | 2343 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS250 | 90 | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 114 I/O | 3000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS250 | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 4.5 kB | 36864 | 250000 | 1.47059 GHz | 2 | 6144 | 1.2 mm | 17 mm | 17 mm | No |
-
AFS1500-1FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
670.331256
-
APA450-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
250.365896
-
APA300-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
385.824392
-
APA450-FG144A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
793.244399
-
AFS600-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
238.731238
-
AX1000-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
612.201534
-
A3P060-1FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AFS1500-2FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
546.998243
-
AFS600-1FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
551.182888
-
M7A3P1000-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AFS250-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
119.647190
-
AX1000-1FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,038.008855
-
AFS1500-1FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A54SX72A-2FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
815.011599
-
A54SX32A-1FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
476.212106
-
A54SX32A-2FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
554.987930
-
M7A3P1000-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AX250-1FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
408.285728
-
A3P125-1FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AFS250-2FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
344.428996