The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | RAM Size | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Max Junction Temperature (Tj) | Number of Logic Cells | Ambient Temperature Range High | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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![]() | Mfr Part No A3P600-1FGG144 | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | 160 | MICROSEMI CORP | A3P600-1FGG144 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P125-1FG144 | Microchip Technology | Datasheet | 21 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P125 | 350 MHz | 160 | MICROSEMI CORP | A3P125-1FG144 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P125 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 1 | 3072 | 125000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000-1FGG256I | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | M1A3P1000 | 90 | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 177 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3P1000 | 1.425V ~ 1.575V | 1.5 V | 147456 | 1000000 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M7A3P1000-1FG144 | Microchip Technology | Datasheet | 2001 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 144 | 144-FPBGA (13x13) | 400.011771 mg | M7A3P1000 | 160 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 97 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 272 MHz | 1 | 24576 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-FGG896 | Microchip Technology | Datasheet | 1767 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Copper, Silver, Tin | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | A3PE3000-FGG896 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 620 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 231 MHz | STD | 75264 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||
![]() | Mfr Part No M7A3P1000-FG256I | Microchip Technology | Datasheet | 2130 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | M7A3P1000 | 90 | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | SMD/SMT | 177 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M7A3P1000 | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 231 MHz | STD | 24576 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE600-1FGG256I | Microchip Technology | Datasheet | 1694 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | A3PE600 | 90 | MICROSEMI CORP | A3PE600-1FGG256I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 165 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 272 MHz | 1 | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||
![]() | Mfr Part No M7A3P1000-1FG484 | Microchip Technology | Datasheet | 1931 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | M7A3P1000 | 60 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 300 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 272 MHz | 1 | 24576 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-1FG896I | Microchip Technology | Datasheet | 559 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 27 | MICROSEMI CORP | A3PE3000-1FG896I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE3000 | e0 | TIN LEAD | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 272 MHz | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||
![]() | Mfr Part No APA450-FGG256A | Microchip Technology | Datasheet | 2088 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | APA450 | 90 | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 186 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 125 °C | -40 °C | 2.375V ~ 2.625V | 2.5 V | 2.625 V | 2.375 V | 13.5 kB | 110592 | 450000 | 180 MHz | STD | 12288 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M7AFS600-FGG256 | Microchip Technology | Datasheet | 1776 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | M7AFS600 | 90 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | Tray | Active | Details | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | M7AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | STD | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-FGG256A | Microchip Technology | Datasheet | 564 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA600 | 90 | MICROSEMI CORP | APA600-FGG256A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 186 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | Details | Yes | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA600 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 186 | FIELD PROGRAMMABLE GATE ARRAY | 129024 | 600000 | STD | 21504 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000-FGG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-FGG144I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-FGG484M | Microchip Technology | Datasheet | 592 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 649 MHz | 60 | MICROSEMI CORP | AX1000-FGG484M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 317 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||
![]() | Mfr Part No A3PE600-1FGG484I | Microchip Technology | Datasheet | 2285 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE600 | 60 | MICROSEMI CORP | A3PE600-1FGG484I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 270 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 272 MHz | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||
![]() | Mfr Part No M7A3P1000-1FG256 | Microchip Technology | Datasheet | 1665 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | M7A3P1000 | 90 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 177 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 272 MHz | 1 | 24576 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-1FGG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX1000 | 763 MHz | 27 | MICROSEMI CORP | AX1000-1FGG896M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 516 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 763 MHz | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||
![]() | Mfr Part No A3PE1500-1FGG484 | Microchip Technology | Datasheet | 2077 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | 60 | MICROSEMI CORP | A3PE1500-1FGG484 | 272 MHz | + 70 C | FLASH | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 280 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 272 MHz | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 128 B | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 272 MHz | 60 | 1 | 38400 | 38400 | 85 °C | 70 °C | 1500000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||
![]() | Mfr Part No A3P400-2FGG256 | Microchip Technology | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P400 | 350 MHz | 90 | MICROSEMI CORP | A3P400-2FGG256 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 178 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 2 | 9216 | 400000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M7AFS600-2FG256I | Microchip Technology | Datasheet | 2076 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | M7AFS600 | 90 | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 119 I/O | Tray | Active | N | 1.575 V | 1.425 V | Fusion | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | M7AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 2 | 1.2 mm | 17 mm | 17 mm |
A3P600-1FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P125-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P1000-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M7A3P1000-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE3000-FGG896
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M7A3P1000-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
190.065016
A3PE600-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M7A3P1000-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE3000-1FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
795.283435
APA450-FGG256A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
330.357585
M7AFS600-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA600-FGG256A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
557.523713
M1A3P1000-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX1000-FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE600-1FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M7A3P1000-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX1000-1FGG896M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE1500-1FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P400-2FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M7AFS600-2FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
467.430890
