The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Resistive Material | # I/Os (Max) | # Registers | Base Product Number | Brand | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Power (Watts) | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Adjustment Type | Number of Logic Elements/Cells | Product Type | Number of Turns | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No A3PE3000L-1FG484M | Microchip Technology | Datasheet | 550 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | A3PE3000L-1FG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 35000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | FPGA - Field Programmable Gate Array ProASIC3 Military ProASIC3/EL Low Power Flash FPGAs with Flash*Freeze Technology | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | - | 75264 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | No | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX2000-FG896I | Microchip Technology | Datasheet | 423 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | AX2000 | 649 MHz | 27 | MICROSEMI CORP | AX2000-FG896I | 649 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 586 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | AX2000 | e0 | Tin/Lead (Sn/Pb) | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 896 | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 294912 | 2000000 | 32256 | STD | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FG484I | Microchip | Datasheet | 1849 | - | Min: 1 Mult: 1 | Through Hole | FBGA | YES | 484-FPBGA (23x23) | 484 | Cermet | A3P1000 | Microchip Technology / Atmel | 350 MHz | 60 | MICROSEMI CORP | -- | Microchip | A3P1000-1FG484I | 272 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 300 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 1.48 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Bulk | RJ-6 | Square - 0.276 L x 0.260 W x 0.343 H (7.00mm x 6.60mm x 8.70mm) | ±10% | e0 | Active | -- | 3A001.A.7.A | ±100ppm/°C | 50 Ohms | Tin/Lead (Sn/Pb) | 0.5W, 1/2W | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | PC Pins | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | - | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | Side Adjustment | FPGA - Field Programmable Gate Array | 1 | 147456 | 1000000 | 1 | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-2FG256 | Microchip Technology | Datasheet | 1753 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AFS1500 | 90 | MICROSEMI CORP | AFS1500-2FG256 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 38400 CLBS, 1500000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 1500000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-1FGG676 | Microchip Technology | Datasheet | 618 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 676-FBGA (27x27) | 676 | AX1000 | 763 MHz | 40 | MICROSEMI CORP | AX1000-1FGG676 | 763 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 418 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 165888 | 1000000 | 18144 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS600-2FGG484 | Microchip Technology | Datasheet | 2248 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AFS600 | 60 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 172 I/O | 7000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 2 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL1000V5-FGG256I | Microchip Technology | Datasheet | 2128 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AGL1000 | 108 MHz | 90 | MICROSEMI CORP | AGL1000V5-FGG256I | 892.86 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | AGL1000V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-2FGG256 | Microchip Technology | Datasheet | 2302 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS1500 | 90 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.47059 GHz | 2 | 38400 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FGG256I | Microchip Technology | Datasheet | 1951 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA300 | 180 MHz | 90 | MICROSEMI CORP | APA300-FGG256I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 186 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 186 | 300000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-FGG896I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | APA1000 | 180 MHz | 27 | MICROSEMI CORP | APA1000-FGG896I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 642 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1 mm | compliant | 180 MHz | S-PBGA-B896 | 642 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 24.8 kB | 642 | 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | 180 MHz | STD | 56320 | 56320 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FGG256 | Microchip Technology | Datasheet | 2291 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-1FGG256 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX72A-FFGG484 | Microchip Technology | Datasheet | 722 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (27X27) | 484 | A54SX72 | 156 MHz | 40 | MICROSEMI CORP | A54SX72A-FFGG484 | 156 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 360 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | A54SX72A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 360 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 360 | 6036 CLBS, 108000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 2 ns | 6036 | 6036 | 108000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-2FG484 | Microchip Technology | Datasheet | 1635 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AFS1500 | 60 | MICROSEMI CORP | AFS1500-2FG484 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 223 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.47059 GHz | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FGG144I | Microchip Technology | Datasheet | 2197 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | 100 | 8192 | APA300 | 180 MHz | 300000 | 160 | PROASICPLUS | MICROSEMI CORP | APA300-FGG144I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 100 I/O | 300000 | 2.7(V) | 2.3(V) | 2.5(V) | -40C to 85C | 85C | -40C | Industrial | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | FBGA | Active | 0.22UM | Active | Yes | No | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | 180(MHz) | 144 | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 100 | 300000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FGG256I | Microchip Technology | Datasheet | 1916 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA150 | 180 MHz | 90 | MICROSEMI CORP | APA150-FGG256I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 186 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA150 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 186 | 150000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 150000 | STD | 6144 | 150000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FGG256I | Microchip Technology | Datasheet | 8000 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-1FGG256I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | AX1000 | 649 MHz | 60 | MICROSEMI CORP | AX1000-FGG484I | 649 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 317 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX1000 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B484 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-FG484 | Microchip Technology | Datasheet | 2139 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | AFS1500 | 60 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 223 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.0989 GHz | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.0989 GHz | STD | 38400 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-FG256 | Microchip Technology | Datasheet | 1748 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS1500 | 90 | MICROSEMI CORP | AFS1500-FG256 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 1.0989 GHz | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.0989 GHz | STD | 38400 | 38400 | 1500000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-2FG256I | Microchip Technology | Datasheet | 2218 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS1500 | 90 | MICROSEMI CORP | AFS1500-2FG256I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.74 | N | No | 8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS1500 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 1500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.47059 GHz | 2 | 38400 | 1500000 | 1.2 mm | 17 mm | 17 mm | No |
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Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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