The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No AX2000-1FG896I | Microchip Technology | Datasheet | 778 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Tin | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX2000 | 763 MHz | 27 | MICROSEMI CORP | AX2000-1FG896I | 763 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 586 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | AX2000 | e0 | TIN LEAD | 85 °C | -40 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | 896 | S-PBGA-B896 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 36 kB | 850 ps | 850 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 763 MHz | 32256 | 21504 | 1 | 21504 | 0.84 ns | 21504 | 32256 | 2000000 | 1.73 mm | 31 mm | 31 mm | No | ||||||
![]() | Mfr Part No A3P400-2FGG144I | Microchip Technology | Datasheet | 6 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P400 | 350 MHz | 160 | MICROSEMI CORP | A3P400-2FGG144I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 2 | 9216 | 400000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE1500-FGG676I | Microchip Technology | Datasheet | 1815 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 676-FBGA (27x27) | 676 | M1A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | M1A3PE1500-FGG676I | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 444 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | STD | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE1500-2FGG676I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA | 40 | 310 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 444 I/O | 16000 LE | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | Tray | A3PE1500 | 1.5 V | - | 1500000 | - | 1.73 mm | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FGG144A | Microchip Technology | Datasheet | 1636 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | APA150 | 160 | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 100 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA150 | 2.375V ~ 2.625V | 2.5 V | 36864 | 150000 | STD | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P600-1FGG256I | Microchip Technology | Datasheet | 22 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-1FGG256I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS1500-FGG484 | Microchip Technology | Datasheet | 2144 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | AFS1500 | 60 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 223 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.0989 GHz | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 1.0989 GHz | 38400 | 1.73 mm | 23 mm | 23 mm | No | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE1500-2FG676I | Microchip Technology | Datasheet | 2071 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 676 | 676-FBGA (27x27) | 400.011771 mg | A3PE1500 | 40 | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | SMD/SMT | 444 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 310 MHz | 2 | 38400 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000-2FGG896I | Microchip Technology | Datasheet | 548 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Copper, Silver, Tin | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 27 | MICROSEMI CORP | A3PE3000-2FGG896I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.58 | Details | Yes | 8542390000 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 310 MHz | 2 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||||||||||||||
![]() | Mfr Part No M1A3P600-1FG256 | Microchip Technology | Datasheet | 35 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P600 | 350 MHz | 90 | MICROSEMI CORP | M1A3P600-1FG256 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-2FG484I | Microchip Technology | Datasheet | 1870 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3P1000 | 350 MHz | 60 | MICROSEMI CORP | A3P1000-2FG484I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3P1000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P600-2FG256 | Microchip Technology | Datasheet | 22 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-2FG256 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FG144A | Microchip Technology | Datasheet | 2285 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | APA300 | 160 | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 100 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA300 | 2.375V ~ 2.625V | 2.5 V | 73728 | 300000 | STD | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P060-2FGG144I | Microchip Technology | Datasheet | 6 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | 160 | MICROSEMI CORP | A3P060-2FGG144I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 96 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P060 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 2 | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX72A-FFG256 | Microchip Technology | Datasheet | 2335 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX72 | 156 MHz | 90 | MICROSEMI CORP | A54SX72A-FFG256 | 156 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 203 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | A54SX72A | e0 | TIN LEAD/TIN LEAD SILVER | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 203 | 6036 CLBS, 108000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 2 ns | 6036 | 6036 | 108000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1AFS600-1FG256 | Microchip Technology | Datasheet | 1839 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | M1AFS600 | 90 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 1 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P125-2FG144 | Microchip Technology | Datasheet | 29 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P125 | 350 MHz | 160 | MICROSEMI CORP | A3P125-2FG144 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P125 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 2 | 3072 | 125000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE1500-1FG676I | Microchip Technology | Datasheet | 1984 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | A3PE1500 | 40 | MICROSEMI CORP | A3PE1500-1FG676I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 444 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 1.77 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3PE1500 | e0 | TIN LEAD | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B676 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 272 MHz | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||||
![]() | Mfr Part No A3PE1500-1FGG676 | Microchip Technology | Datasheet | 2180 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | A3PE1500 | 40 | MICROSEMI CORP | A3PE1500-1FGG676 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 444 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 272 MHz | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FG144 | Microchip Technology | Datasheet | 57 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-1FG144 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 13 mm | 13 mm |
AX2000-1FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
2,440.782404
A3P400-2FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3PE1500-FGG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE1500-2FGG676I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA150-FGG144A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
229.921540
A3P600-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AFS1500-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
273.499662
A3PE1500-2FG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
429.067415
A3PE3000-2FGG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P600-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-2FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P600-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA300-FG144A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
492.175770
A3P060-2FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
28.973948
A54SX72A-FFG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
488.444562
M1AFS600-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
287.793825
A3P125-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE1500-1FG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
396.147693
A3PE1500-1FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
