The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No M1A3P1000L-FGG256I | Microchip Technology | Datasheet | 1848 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M1A3P1000L-FGG256I | 781.25 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P1000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No M1AFS1500-FGG484 | Microchip Technology | Datasheet | 2319 | - | Min: 1 Mult: 1 | FBGA | YES | 484 | 60 | MICROSEMI CORP | M1AFS1500-FGG484 | 1098.9 MHz | + 70 C | 0 C | Yes | 3 | SMD/SMT | 223 I/O | 85 °C | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | 40 | 5.3 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | Tray | M1AFS1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | OTHER | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1500000 | STD | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE3000-1FGG896I | Microchip Technology | Datasheet | 589 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000-1FGG896I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE3000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No M1AFS1500-2FG484I | Microchip Technology | Datasheet | 1735 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | M1AFS1500 | 60 | MICROSEMI CORP | M1AFS1500-2FG484I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 223 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS1500 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.47059 GHz | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||
![]() | Mfr Part No M1AFS1500-FG484 | Microchip Technology | Datasheet | 1924 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1AFS1500 | 60 | MICROSEMI CORP | M1AFS1500-FG484 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 223 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1AFS1500 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | OTHER | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | STD | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000L-1FGG144 | Microchip Technology | Datasheet | 2228 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000L-1FGG144 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P1000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE3000L-1FG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 250 MHz | 27 | MICROSEMI CORP | M1A3PE3000L-1FG896M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 620 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000-1FGG144M | Microchip Technology | Datasheet | 2356 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | M1A3P1000 | 160 | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 97 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3P1000 | 1.425V ~ 1.575V | 1.5 V | 8 mA | 147456 | 1000000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE3000L-1FGG484M | Microchip Technology | Datasheet | 692 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | A3PE3000L-1FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | No | |||||||||||||||||||||
![]() | Mfr Part No AX1000-1FG676I | Microchip Technology | Datasheet | 711 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 763 MHz | 40 | MICROSEMI CORP | AX1000-1FG676I | 763 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 418 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX1000 | e0 | TIN LEAD | 85 °C | -40 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 763 MHz | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | 12096 | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||
![]() | Mfr Part No AX500-2FG484 | Microchip Technology | Datasheet | 2356 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX500 | 60 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 317 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX250-2FG256 | Microchip Technology | Datasheet | 2133 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AX250 | 870 MHz | 90 | MICROSEMI CORP | AX250-2FG256 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 138 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | e0 | TIN LEAD/TIN LEAD SILVER | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 248 | 2816 CLBS, 250000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | 0.74 ns | 2816 | 4224 | 250000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-FG484I | Microchip Technology | Datasheet | 709 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | APA600 | 60 | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 370 I/O | Tray | Active | N | 8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85 | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA600 | 85 °C | -40 °C | 2.3V ~ 2.7V | 180 MHz | 2.5 V | 2.7 V | 2.3 V | 15.8 kB | 129024 | 600000 | 180 MHz | STD | 21504 | 1.73 mm | 23 mm | 23 mm | No | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FG484A | Microchip Technology | Datasheet | 1925 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | APA450 | 60 | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 344 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 2.375V ~ 2.625V | 2.5 V | 110592 | 450000 | STD | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX250-FG484M | Microchip Technology | Datasheet | 694 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX250 | 60 | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 248 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -55°C ~ 125°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-2FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 870 MHz | 40 | MICROSEMI CORP | AX1000-2FG676 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 418 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e0 | TIN LEAD | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 870 MHz | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 740 ps | 740 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 870 MHz | 18144 | 12096 | 2 | 12096 | 0.74 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||
![]() | Mfr Part No AX1000-1FG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX1000 | 763 MHz | 27 | MICROSEMI CORP | AX1000-1FG896M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 516 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 850 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 763 MHz | 18144 | MIL-STD-883 Class B | 1 | 12096 | 0.84 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | |||||||||||
![]() | Mfr Part No AX250-1FG484M | Microchip Technology | Datasheet | 732 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AX250 | 763 MHz | 60 | MICROSEMI CORP | AX250-1FG484M | 763 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 248 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX250 | e0 | 3A001.A.2.C | TIN LEAD | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.84 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FG256I | Microchip Technology | Datasheet | 1928 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | APA150 | 90 | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 186 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA150 | 2.3V ~ 2.7V | 2.5 V | 36864 | 150000 | STD | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX500-FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX500 | 60 | 649 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 317 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AX500 | 1.425V ~ 1.575V | 1.5 V | 73728 | 500000 | 8064 | 1.73 mm | 23 mm | 23 mm |
M1A3P1000L-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1AFS1500-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3PE3000-1FGG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1AFS1500-2FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
546.998243
M1AFS1500-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
273.361984
M1A3P1000L-1FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3PE3000L-1FG896M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P1000-1FGG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
329.604989
A3PE3000L-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX1000-1FG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,006.529476
AX500-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
315.276184
AX250-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
498.183405
APA600-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
562.212878
APA450-FG484A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
383.131658
AX250-FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,516.140893
AX1000-2FG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX1000-1FG896M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX250-1FG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,932.431311
APA150-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
348.853051
AX500-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
