The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Clock Frequency | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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![]() | Mfr Part No A3P060-1FG144 | Microchip Technology | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | 160 | MICROSEMI CORP | A3P060-1FG144 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 96 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P060 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 1 | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P600-FG256 | Microchip Technology | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P600 | 350 MHz | 90 | MICROSEMI CORP | M1A3P600-FG256 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2V250-4FG256C | Xilinx | Datasheet | 52 | - | Min: 1 Mult: 1 | FBGA | YES | e0 | no | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 85°C | 0°C | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | 256 | S-PBGA-B256 | 172 | 1.5V | 1.575V | 1.51.5/3.33.3V | OTHER | 54kB | 650MHz | 172 | FIELD PROGRAMMABLE GATE ARRAY | 4 | 3072 | 384 | 250000 | 2mm | 17mm | 17mm | No | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1AGL600V2-FG256I | Microchip Technology | Datasheet | 1904 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AGL600 | 108 MHz | 90 | MICROSEMI CORP | M1AGL600V2-FG256I | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | M1AGL600V2 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No A3P400-1FG144 | Microchip Technology | Datasheet | 16 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A3P400 | 350 MHz | 160 | MICROSEMI CORP | A3P400-1FG144 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 272 MHz | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 6.8 kB | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 272 MHz | 1 | 9216 | 9216 | 400000 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000L-FGG256 | Microchip Technology | Datasheet | 1690 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M1A3P1000L-FGG256 | 781.25 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P1000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000L-FG256 | Microchip Technology | Datasheet | 2202 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M1A3P1000L-FG256 | 781.25 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P1000L | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000L-FGG144I | Microchip Technology | Datasheet | 2048 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000L-FGG144I | 781.25 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P1000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32A-FG256 | Microchip Technology | Datasheet | 2130 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | A54SX32 | 90 | 238 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 203 I/O | Tray | Active | N | 2.75 V | 2.25 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | A54SX32A | 2.25V ~ 5.25V | 2.5 V | 48000 | 2880 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P125-2FG144I | Microchip Technology | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P125 | 350 MHz | 160 | MICROSEMI CORP | A3P125-2FG144I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P125 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 3072 CLBS, 125000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 2 | 3072 | 125000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX250-1FG256 | Microchip Technology | Datasheet | 2232 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | AX250 | 90 | 763 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 138 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AFS600-1FG256 | Microchip Technology | Datasheet | 1958 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 256 | 256-FPBGA (17x17) | 400.011771 mg | AFS600 | 90 | 1282.05 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 119 I/O | 7000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS600 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 13.5 kB | 110592 | 600000 | 1.28205 GHz | 1 | 13824 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P600-FG484 | Microchip Technology | Datasheet | 22 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 350 MHz | 60 | MICROSEMI CORP | M1A3P600-FG484 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 235 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P600 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE1500-2FGG676 | Microchip Technology | Datasheet | 1940 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | 676 | 676-FBGA (27x27) | 400.011771 mg | A3PE1500 | 40 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 444 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE1500 | 70 °C | 0 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 33.8 kB | 276480 | 1500000 | 310 MHz | 2 | 38400 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL600V2-FG256 | Microchip Technology | Datasheet | 9 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V2-FG256 | 526.32 MHz, 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AGL600V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE1500-1FGG676 | Microchip Technology | Datasheet | 1780 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 676-FBGA (27x27) | 676 | M1A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | M1A3PE1500-1FGG676 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 444 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P600L-1FG484 | Microchip Technology | Datasheet | 1931 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 350 MHz | 60 | MICROSEMI CORP | M1A3P600L-1FG484 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 235 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3P600L | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX250-1FGG484 | Microchip Technology | Datasheet | 1715 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AX250 | 763 MHz | 60 | MICROSEMI CORP | AX250-1FGG484 | 763 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 248 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | 0.84 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX250-2FGG484 | Microchip Technology | Datasheet | 661 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | AX250 | 60 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 248 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | 1.425V ~ 1.575V | 1.5 V | 55296 | 250000 | 4224 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32A-1FG256 | Microchip Technology | Datasheet | 1958 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX32 | 278 MHz | 90 | MICROSEMI CORP | A54SX32A-1FG256 | 278 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 203 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | A54SX32A | e0 | TIN LEAD/TIN LEAD SILVER | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,2.5/5 V | COMMERCIAL | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.2 mm | 17 mm | 17 mm |
A3P060-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P600-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
XC2V250-4FG256C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1AGL600V2-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P400-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P1000L-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P1000L-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P1000L-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A54SX32A-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
316.863603
A3P125-2FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX250-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
269.969345
AFS600-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
285.566434
M1A3P600-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3PE1500-2FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGL600V2-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
110.061222
M1A3PE1500-1FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P600L-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AX250-1FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
454.434516
AX250-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
560.340758
A54SX32A-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
414.135423
