The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA-256
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Data Rate | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Number of Registers | Number of CLBs | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No A3P250-FGG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-256 | 90 | 350 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 157 I/O | 3000 LE | Details | 1.575 V | 1.425 V | 36864 bit | ProASIC3 | 0.032170 oz | Tray | A3P250 | 1.5 V | 30 mA | - | 250000 | - | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FGG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-256 | 90 | 350 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 177 I/O | 11000 LE | Details | 1.575 V | 1.425 V | 147456 bit | ProASIC3 | 0.210427 oz | Tray | A3P1000 | 1.5 V | 75 mA | - | 1000000 | - | 1.6 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FGG256M | Microchip Technology | Datasheet | 1832 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-FGG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-256 | 90 | 350 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 178 I/O | 5000 LE | Details | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | Tray | A3P400 | 1.5 V | - | 400000 | - | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-FGG256 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-256 | 90 | 231 MHz | + 85 C | 0 C | Yes | SMD/SMT | 178 I/O | - | 5000 LE | Details | 1.575 V | 1.425 V | 55296 bit | ProASIC3 | Tray | A3P400 | 1.5 V | 3 mA | - | 400000 | - | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL600V5-FGG256I | Microchip Technology | Datasheet | 71 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | 177 | 13824 | AGL600 | 108 MHz | 600000 | 90 | IGLOO | MICROSEMI CORP | AGL600V5-FGG256I | 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 177 I/O | 7000 LE | 600000 | 1.575(V) | 1.425(V) | 1.5(V) | -40C to 85C | 85C | -40C | Industrial | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | FBGA | Active | 130NM | Active | Yes | No | 40 | 5.25 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AGL600V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | - | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||
| Mfr Part No A3P1000-FG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-256 | 90 | 350 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 177 I/O | 11000 LE | N | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | Tray | A3P1000 | 1.5 V | - | 1000000 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-FGG256I | Microchip Technology | Datasheet | 54 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-FGG256I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | - | 6500 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.31 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | 110592 bit | ProASIC3 | 1.5000 V | -40 to 85 °C | Tray | A3P600 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 45 mA | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 6500 | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | Lead Free | ||||||||||||||||||||||||||
| Mfr Part No A3P250-FG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-256 | 90 | 350 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 157 I/O | 3000 LE | N | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | Tray | A3P250 | 1.5 V | - | 250000 | - | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL600V2-FGG256 | Microchip Technology | Datasheet | 2015 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V2-FGG256 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | - | 6500 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.46 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | 110592 bit | IGLOOe | 1.2, 1.5 V | 0 to 70 °C | Tray | AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL600V2-FGG256I | Microchip Technology | Datasheet | 2070 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V2-FGG256I | 526.32 MHz, 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 7000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.42 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | - | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-1FG256I | Microchip Technology | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-1FG256I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 157 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P250 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-2FG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-256 | 90 | 350 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 177 I/O | 11000 LE | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | Tray | A3P1000 | 1.5 V | - | 1000000 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-2FGG256 | Microchip Technology | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-2FGG256 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 157 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-1FGG256 | Microchip Technology | Datasheet | 31 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-1FGG256 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 157 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-1FG256 | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FPBGA (17x17) | A3P250 | 90 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 157 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P250 | 1.425V ~ 1.575V | 1.5 V | 36864 | 250000 | 1 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-2FG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-256 | 90 | 310 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 157 I/O | 3000 LE | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | Tray | A3P250 | 1.5 V | - | 250000 | - | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-2FG256 | Microchip Technology | Datasheet | 5 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FPBGA (17x17) | A3P250 | 90 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 157 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P250 | 1.425V ~ 1.575V | 1.5 V | 36864 | 250000 | 2 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-FG256I | Microchip Technology | Datasheet | 9 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P400 | 350 MHz | 90 | MICROSEMI CORP | A3P400-FG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 178 I/O | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.22 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3P400 | e0 | 3A001.A.7.B | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | STD | 9216 | 400000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1FG256M | Microchip Technology | Datasheet | 2065 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FPBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55 to 125 °C | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | 1 |
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A3P250-FGG256I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P1000-FGG256I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P1000-FGG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P400-FGG256I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P400-FGG256
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AGL600V5-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
106.253413
-
A3P1000-FG256I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P600-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3P250-FG256I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
AGL600V2-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
156.444808
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AGL600V2-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
126.625048
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A3P250-1FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000-2FG256I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-2FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-1FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-2FG256I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P250-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P400-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
46.992295
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A3P1000-1FG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire