The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA-256
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Qualification | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Power Rating | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Inductance | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Inductance Tolerance | Total RAM Bits | RMS Current (Irms) | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Resistance Tolerance | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Product Length | Product Width | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No A3P1000-2FG256M | Microchip Technology | Datasheet | 1620 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FPBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FGG256 | Microchip Technology | Datasheet | 1896 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FPBGA (17x17) | APA150 | 36 kbit | 36 kbit | 90 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 186 I/O | - | - | Tray | Active | Details | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 36864 bit | ProASICPLUS | 0°C ~ 70°C (TA) | Tray | APA150 | 2.3V ~ 2.7V | 2.5 V | 5 mA | 36864 | 150000 | STD | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-FGG256 | Microchip Technology | Datasheet | 960 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-FGG256 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | - | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.33 | Details | Yes | FPGA ProASICu00ae3 Family 1M Gates 231MHz 130nm Technology 1.5V Automotive 256-Pin FBGA | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | 147456 bit | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 8 mA | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 1.6 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL600V5-FG256I | Microchip Technology | Datasheet | 2381 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V5-FG256I | 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 7000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | AGL600V5 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | - | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-FG256M | Microchip Technology | Datasheet | 2135 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FPBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FGG256M | Microchip Technology | Datasheet | 1862 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P250-FGG256 | Microchip | Datasheet | 2880 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P250 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P250-FGG256 | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 157 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.32 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 36864 bit | ProASIC3 | 1.5000 V | 0.031747 oz | 0 to 70 °C | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 10 uH | 3 mA | - | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 20 | 36864 | 16 A | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 17.15 | 17.15 mm | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP1C12F256C8 | ALTERA | Datasheet | 8 | - | Min: 1 Mult: 1 | FBGA-256 | YES | 256 | Intel / Altera | 275 MHz | 90 | INTEL CORP | Intel | EP1C12F256C8 | 250 MHz | + 85 C | 0 C | Yes | 3 | SMD/SMT | 185 I/O | 1206 LAB | 12060 LE | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | 970850 | Obsolete | 30 | 7.94 | N | No | 1.575 V | 1.425 V | 1.5 V | 239616 bit | Cyclone | Tray | Cyclone EPC12 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | S-PBGA-B256 | 249 | Not Qualified | 1.5 V to 3.3 V | 1.5,1.5/3.3 V | OTHER | - | 249 | 12060 CLBS | 2.2 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | - | 12060 | 12060 | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P250-FGG256 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-256 | 90 | 350 MHz | + 85 C | 0 C | Yes | SMD/SMT | 157 I/O | 3000 LE | Details | 1.575 V | 1.425 V | 36864 bit | ProASIC3 | 0.031747 oz | Tray | A3P250 | 1.5 V | 3 mA | - | 250000 | - | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P250-1FGG256I | Microchip Technology | Datasheet | 28 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-1FGG256I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 157 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-FG256 | Microchip Technology | Datasheet | 2306 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-FG256 | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | - | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.47 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P600-FG256I | Microchip Technology | Datasheet | 154 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Lead, Silver, Tin | Surface Mount | Surface Mount | FBGA-256 | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-FG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 1.48 | N | No | FPGA - Field Programmable Gate Array ProASIC3 | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P600 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 231 MHz | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | Contains Lead | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P250-FG256 | Microchip Technology | Datasheet | 15 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P250 | 350 MHz | 90 | MICROSEMI CORP | A3P250-FG256 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 157 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P250 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | STD | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-2FGG256M | Microchip Technology | Datasheet | 2260 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P400-FGG256 | Microchip | Datasheet | 80 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P400 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | Microchip | A3P400-FGG256 | 231 MHz | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 178 I/O | - | 5000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | AEC-Q200 | 40 | 1.31 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 55296 bit | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P400 | e1 | 25 ppm/°C | 1.62 kOhm | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | 0.15 W | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | Sulfur Resistant, Precision | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 3 mA | - | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 55296 | 400000 | STD | - | 0.1 | 9216 | 400000 | FPGA - Field Programmable Gate Array | 1.62 mm | 0.81 mm | 1.2 mm | 17 mm | 17 mm |
A3P1000-2FG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA150-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
188.987477
A3P1000-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGL600V5-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
164.812634
A3P1000-FG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1FGG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P250-FGG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
EP1C12F256C8
ALTERA
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P250-FGG256
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P250-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P600-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
80.546035
A3P250-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-2FGG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P400-FGG256
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
