The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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FBGA-484
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Base/Housing Material | Body Orientation | Brand | Clock Frequency-Max | Contact Materials | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Gender | HTS Code | Subcategory | Power Rating | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Resistance Tolerance | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Product Length | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No M2GL090TS-1FG484I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-484 | 60 | + 100 C | - 40 C | Yes | SMD/SMT | 267 I/O | 86316 | N | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | IGLOO2 | 0.627572 oz | Tray | M2GL090TS | 1.2 V | 667 Mb/s | 4 Transceiver | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-2FG484M | Microchip Technology | Datasheet | 1928 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | 484-FPBGA (23x23) | A3P1000 | 144 kbit | 144 kbit | 60 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 300 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE1500-FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Tin | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | A3PE1500-FG484I | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 280 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 280 | Not Qualified | 1.425 V to 1.575 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | Contains Lead | |||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGLE3000V5-FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M1AGLE3000 | 504 kbit | 60 | MICROSEMI CORP | M1AGLE3000V5-FGG484I | 250 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | 3 | SMD/SMT | 341 I/O | 3500 LAB | 35000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1AGLE3000V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | 700 Mb/s | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGLE3000V2-FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M1AGLE3000 | 504 kbit | 60 | MICROSEMI CORP | M1AGLE3000V2-FGG484I | 250 MHz | 1.575 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | 3 | SMD/SMT | 341 I/O | 3500 LAB | 35000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.5 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | M1AGLE3000V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 63 kB | 700 Mb/s | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 75264 | 516096 | 3000000 | STD | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 350 MHz | 504 kbit | 60 | MICROSEMI CORP | M1A3PE3000L-1FGG484I | 350 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | - 40 C | 3 | SMD/SMT | 341 I/O | 3500 LAB | 35000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE3000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 25 mA | 700 Mb/s | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060T-1FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL060 | 60 | MICROSEMI CORP | M2GL060T-1FGG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 56520 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | 667 Mb/s | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 1 | 4 Transceiver | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-2FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | 484-FPBGA (23x23) | A3P1000 | 144 kbit | 144 kbit | 60 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 300 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090-FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | 60 | MICROSEMI CORP | M2GL090-FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86316 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.25 | N | No | FPGA IGLOOu00ae2 Family 86316 Cells 1.2V 484-Pin FBGA Tray | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.415307 oz | -40°C ~ 100°C (TJ) | Tray | M2GL090 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 667 Mb/s | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 4 Transceiver | 86316 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | M2GL010 | 60 | MICROSEMI CORP | M2GL010-FGG484 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 233 I/O | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.61 | Details | Yes | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL010 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | OTHER | 1.26 V | 1.14 V | 256 kB | 114 kB | 667 Mb/s | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 400 MHz | 22 | STD | 4 Transceiver | 12084 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025T-1FG484M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | 484-FPBGA (23x23) | M2GL025 | Microchip Technology / Atmel | 60 | Microchip | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 267 I/O | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | IGLOO2 | 0.396232 oz | -55°C ~ 125°C (TJ) | Tray | M2GL025T | 100 ppm/K | 43.2 kOhm | Programmable Logic ICs | 0.1 W | 1.14V ~ 2.625V | General Purpose | 1.2 V | 667 Mb/s | 27696 | FPGA - Field Programmable Gate Array | 1130496 | 4 Transceiver | 1 | FPGA - Field Programmable Gate Array | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL050 | Microchip Technology / Atmel | 60 | MICROSEMI CORP | Microchip | M2GL050-FGG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 56340 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 1.53 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL050 | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 667 Mb/s | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | FPGA - Field Programmable Gate Array | 1869824 | 4 Transceiver | 56340 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL025 | Microchip Technology / Atmel | 60 | MICROSEMI CORP | Microchip | M2GL025-FGG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 27696 LE | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.54 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL025 | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 667 Mb/s | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | FPGA - Field Programmable Gate Array | 1130496 | STD | 4 Transceiver | 27696 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL060 | Microchip Technology / Atmel | 60 | MICROSEMI CORP | Microchip | M2GL060-FGG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 56520 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 1.304431 oz | -40°C ~ 100°C (TJ) | Tray | M2GL060 | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 1.2 V | 667 Mb/s | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | FPGA - Field Programmable Gate Array | 1869824 | STD | 4 Transceiver | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025T-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | 484-FPBGA (23x23) | M2GL025 | Microchip Technology / Atmel | 60 | Microchip | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 267 I/O | 27696 LE | Tray | Active | Details | 1.26 V | 1.14 V | IGLOO2 | 0.562355 oz | -40°C ~ 100°C (TJ) | Tray | M2GL025T | Process Magenta | Programmable Logic ICs | 1.14V ~ 2.625V | 1.2 V | 667 Mb/s | 27696 | FPGA - Field Programmable Gate Array | 1130496 | 4 Transceiver | FPGA - Field Programmable Gate Array | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Gold | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | Thermoplastic | Straight | Microchip Technology / Atmel | 350 MHz | Phosphor Bronze | 60 | MICROSEMI CORP | Microchip | A3PE3000-FG484I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | Through Hole | SMD/SMT | 341 I/O | 35000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | 1.575 V | 1.425 V | 1.5 V | Solder | ProASIC3 | 1.5000 V | 0.014110 oz | -65 to 105 °C | Tray | A3PE3000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | Header | 8542.39.00.01 | Programmable Logic ICs | 2.5400 mm | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 341 | Not Qualified | Black | 1.425 V to 1.575 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 63 kB | - | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 516096 | 3000000 | 231 MHz | STD | - | 75264 | 75264 | 75264 | 3000000 | FPGA - Field Programmable Gate Array | 9.75 mm | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||
| Mfr Part No A3PE1500-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | A3PE1500-FGG484 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 280 I/O | - | 16500 LE | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | 276480 bit | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 12 mA | 33.8 kB | 700 Mb/s | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 16500 | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | Lead Free | ||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-2FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | A3PE600 | 60 | MICROSEMI CORP | A3PE600-2FGG484I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 270 I/O | 7000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.56 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.425 V to 1.575 V | INDUSTRIAL | - | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | - | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600-FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 350 MHz | 60 | MICROSEMI CORP | M1A3P600-FGG484 | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 235 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FGG484M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 504 kbit | 60 | MICROSEMI CORP | M1A3PE3000L-1FGG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 341 I/O | 3500 LAB | 35000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 700 Mb/s | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm |
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Price: please inquire