The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Factory Pack QuantityFactory Pack Quantity
- Moisture Sensitive
- Mounting Styles
- Number of Gates
- Number of I/Os
- Package / Case
- Packaging
- RoHS
- Series
- Supply Voltage-Max
- Supply Voltage-Min
- Tradename
- Package / Case:
FPBGA-144
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Qualification Status | Operating Supply Voltage | Temperature Grade | Operating Supply Current | RAM Size | Data Rate | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Number of CLBs | Number of Equivalent Gates | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No A3P250-FG144I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-144 | 160 | 231 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 97 I/O | 3000 LE | N | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | Tray | A3P250 | 1.5 V | - | 250000 | - | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P250-1FG144I | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-1FG144I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||
![]() | Mfr Part No A3P250-1FG144 | Microchip Technology | Datasheet | 31 |
| Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-1FG144 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||
![]() | Mfr Part No A3P250-2FG144 | Microchip Technology | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-2FG144 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||
![]() | Mfr Part No M1AGL1000V5-FG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-144 | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | 160 | MICROSEMI CORP | M1AGL1000V5-FG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||
![]() | Mfr Part No M1A3P400-FG144 | Microchip Technology | Datasheet | 23 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 350 MHz | 160 | MICROSEMI CORP | M1A3P400-FG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P400-1FGG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 350 MHz | 160 | MICROSEMI CORP | M1A3P400-1FGG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P400-1FG144 | Microchip Technology | Datasheet | 31 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 350 MHz | 160 | MICROSEMI CORP | M1A3P400-1FG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P400-2FGG144 | Microchip Technology | Datasheet | 24 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 350 MHz | 160 | MICROSEMI CORP | M1A3P400-2FGG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No A3P250-1FG144M | Microchip Technology | Datasheet | 107 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | 144-FPBGA (13x13) | A3P250 | 160 | 272 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 97 I/O | Tray | Discontinued at Digi-Key | N | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P250 | 1.425V ~ 1.575V | 1.5 V | 36864 | 250000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P250-FG144 | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P250 | 350 MHz | 160 | MICROSEMI CORP | A3P250-FG144 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.22 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | STD | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||
![]() | Mfr Part No M1A3P600-2FGG144I | Microchip Technology | Datasheet | 39 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P600 | 600000 | 600000 | 160 | MICROSEMI CORP | M1A3P600-2FGG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | 600000 | 13 mm | 13 mm | ||||||||||||||||||||||||
![]() | Mfr Part No M1AGL1000V2-FG144 | Microchip Technology | Datasheet | 2096 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-144 | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | 160 | MICROSEMI CORP | M1AGL1000V2-FG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||
![]() | Mfr Part No M1AGL1000V5-FG144 | Microchip Technology | Datasheet | 2232 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-144 | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | 160 | MICROSEMI CORP | M1AGL1000V5-FG144 | 250 MHz | 1.575 V | + 70 C | Microchip Technology | 1.475 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0 to 70 °C | Tray | M1AGL1000V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | OTHER | 127 uA | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 250 MHz | STD | 24576 | 1000000 | 13 mm | 13 mm | |||||||||
![]() | Mfr Part No M1AGL1000V5-FGG144I | Microchip Technology | Datasheet | 1850 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-144 | YES | 144 | 144-FPBGA (13x13) | 144 | M1AGL1000 | 108 MHz | 160 | MICROSEMI CORP | M1AGL1000V5-FGG144I | 250 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | -40°C ~ 85°C (TA) | Tray | M1AGL1000V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 127 uA | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | 250 MHz | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||
![]() | Mfr Part No M1A3P400-FGG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 160 | MICROSEMI CORP | M1A3P400-FGG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P400-1FGG144I | Microchip Technology | Datasheet | 15 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 160 | MICROSEMI CORP | M1A3P400-1FGG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P400-2FGG144I | Microchip Technology | Datasheet | 15 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 160 | MICROSEMI CORP | M1A3P400-2FGG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P400-2FG144I | Microchip Technology | Datasheet | 15 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 160 | MICROSEMI CORP | M1A3P400-2FG144I | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P400-2FG144 | Microchip Technology | Datasheet | 28 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 350 MHz | 400000 | 400000 | 160 | MICROSEMI CORP | M1A3P400-2FG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm |
A3P250-FG144I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P250-1FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P250-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
35.162038
A3P250-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1AGL1000V5-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-1FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-2FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P250-1FG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P250-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P600-2FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1AGL1000V2-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1AGL1000V5-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1AGL1000V5-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-1FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-2FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-2FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
M1A3P400-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
