The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Number of I/Os
- Package / Case
- Base Product Number
- Factory Pack QuantityFactory Pack Quantity
- HTS Code
- Height
- Ihs Manufacturer
- JESD-30 Code
- Length
- Manufacturer Part Number
- Maximum Operating Frequency
- Maximum Operating Temperature
- Package / Case:
QFN EP
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Operating Supply Current | Data Bus Width | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Core Architecture | Number of Gates | Speed Grade | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No A3P030-2QNG68I | Microchip Technology | Datasheet | 29 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3P030 | 260 | MICROSEMI CORP | A3P030-2QNG68I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 49 I/O | 100 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | -40 to 85 °C | Tray | A3P030 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | INDUSTRIAL | 2 mA | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 2 | 768 | 30000 | 0.88 mm | 8 mm | 8 mm | |||||||||||||||||
| Mfr Part No A3PN020-2QNG68I | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN020 | 260 | MICROSEMI CORP | A3PN020-2QNG68I | 350 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -40°C ~ 100°C (TJ) | Tray | A3PN020 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | INDUSTRIAL | 1 mA | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 20000 | 2 | 520 | 20000 | 0.88 mm | 8 mm | 8 mm | ||||||||||||||||||||
| Mfr Part No A3PN015-2QNG68I | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN015 | 260 | MICROSEMI CORP | A3PN015-2QNG68I | 350 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -40°C ~ 100°C (TJ) | Tray | A3PN015 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | 49 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | INDUSTRIAL | 1 mA | 49 | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 15000 | 2 | 384 | 384 | 15000 | 0.88 mm | 8 mm | 8 mm | |||||||||||||||
| Mfr Part No A3PN015-1QNG68I | Microchip Technology | Datasheet | 13 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN015 | 260 | MICROSEMI CORP | A3PN015-1QNG68I | 350 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -40°C ~ 100°C (TJ) | Tray | A3PN015 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | 49 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | INDUSTRIAL | 1 mA | 49 | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 15000 | 1 | 384 | 384 | 15000 | 0.88 mm | 8 mm | 8 mm | |||||||||||||||
| Mfr Part No A3PN020-1QNG68I | Microchip Technology | Datasheet | 13 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN020 | 260 | MICROSEMI CORP | A3PN020-1QNG68I | 350 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | -40 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -40°C ~ 100°C (TJ) | Tray | A3PN020 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | INDUSTRIAL | 1 mA | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 20000 | 1 | 520 | 20000 | 0.88 mm | 8 mm | 8 mm | ||||||||||||||||||||
| Mfr Part No A3PN020-1QNG68 | Microchip Technology | Datasheet | 13 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN020 | 260 | MICROSEMI CORP | A3PN020-1QNG68 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 49 I/O | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN020 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | OTHER | 1 mA | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 20000 | 1 | 520 | 20000 | 0.88 mm | 8 mm | 8 mm | ||||||||||||||||||||
| Mfr Part No A3PN015-1QNG68 | Microchip Technology | Datasheet | 8000 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN015 | 260 | MICROSEMI CORP | A3PN015-1QNG68 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 49 I/O | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | 8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68 | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN015 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | 49 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | OTHER | 1 mA | 49 | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 15000 | 1 | 384 | 384 | 15000 | 0.88 mm | 8 mm | 8 mm | |||||||||||||||
| Mfr Part No A3P030-2QNG68 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3P030 | 350 MHz | 260 | MICROSEMI CORP | A3P030-2QNG68 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P030 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | COMMERCIAL | 2 mA | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 2 | 768 | 30000 | 0.88 mm | 8 mm | 8 mm | ||||||||||||||||||||
| Mfr Part No A3PN020-2QNG68 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN020 | 260 | MICROSEMI CORP | A3PN020-2QNG68 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 49 I/O | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN020 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | OTHER | 1 mA | 520 CLBS, 20000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 20000 | 2 | 520 | 20000 | 0.88 mm | 8 mm | 8 mm | ||||||||||||||||||||
| Mfr Part No A3P030-1QNG68 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3P030 | 350 MHz | 260 | MICROSEMI CORP | A3P030-1QNG68 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 49 I/O | 85 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P030 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | Not Qualified | 1.5 V | COMMERCIAL | 2 mA | 768 CLBS, 30000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 30000 | 1 | 768 | 30000 | 0.88 mm | 8 mm | 8 mm | ||||||||||||||||||||
| Mfr Part No A3PN015-2QNG68 | Microchip Technology | Datasheet | 8000 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | YES | 68-QFN (8x8) | 68 | A3PN015 | 260 | MICROSEMI CORP | A3PN015-2QNG68 | 350 MHz | + 70 C | Microchip Technology | - 20 C | Yes | 3 | SMD/SMT | 49 I/O | 70 °C | -20 °C | Tray | UNSPECIFIED | HVQCCN | HVQCCN, LCC68,.32SQ,16 | LCC68,.32SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 30 | 5.26 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 nano | -20°C ~ 85°C (TJ) | Tray | A3PN015 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | NO LEAD | 260 | 0.4 mm | compliant | S-XQCC-N68 | 49 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | OTHER | 1 mA | 49 | 384 CLBS, 15000 GATES | 1 mm | FIELD PROGRAMMABLE GATE ARRAY | 15000 | 2 | 384 | 384 | 15000 | 0.88 mm | 8 mm | 8 mm | |||||||||||||||
 | Mfr Part No CY8CTMG200A-24LQXI | Cypress Semiconductor | Datasheet | 20 |
| Min: 1 Mult: 1 | Surface Mount | QFN EP | 24 | FLASH | 20 | 85°C | -40°C | I2C, SPI, UART, USART, USB | 8b | M8C | No | RoHS Compliant |
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A3P030-2QNG68I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
13.879089
-
A3PN020-2QNG68I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
9.674203
-
A3PN015-2QNG68I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.930760
-
A3PN015-1QNG68I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.630215
-
A3PN020-1QNG68I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.987422
-
A3PN020-1QNG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
7.289853
-
A3PN015-1QNG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.010878
-
A3P030-2QNG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
11.015961
-
A3PN020-2QNG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.423728
-
A3P030-1QNG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
9.355214
-
A3PN015-2QNG68
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
8.341802
-
CY8CTMG200A-24LQXI
Cypress Semiconductor
Package:Embedded - FPGAs (Field Programmable Gate Array)
0.571118