The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Clock Frequency-Max
- HTS Code
- Ihs Manufacturer
- JESD-30 Code
- JESD-609 Code
- Length
- Manufacturer Part Number
- Moisture Sensitivity Levels
- Number of CLBs
- Number of Equivalent Gates
- Number of Logic Cells
- Power Supplies
- Power Supplies:
1.5,1.8,2.5,3.3 V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Ihs Manufacturer | Lead Free Status / RoHS Status | Lifetime @ Temp. | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage Rated | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Type | Terminal Finish | HTS Code | Capacitance | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | ESR (Equivalent Series Resistance) | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Manufacturer Size Code | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Speed Grade | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Features | Height Seated (Max) | Length | Width |
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 | Mfr Part No A2F200M3F-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Axial | YES | 256-FPBGA (17x17) | 256 | A2F200 | 80 MHz | MICROSEMI CORP | -- | -- | Microsemi Corporation | A2F200M3F-FG256I | Microchip Technology | 3 | MCU - 25, FPGA - 66 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.24 | No | 1.575 V | 1.425 V | 1.5 V | 35V | -55°C ~ 125°C | Bulk | Military, MIL-PRF-39003/3, CSR23 | 0.185 Dia x 0.474 L (4.70mm x 12.04mm) | ±20% | e0 | Active | -- | Hermetically Sealed | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 10µF | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | -- | P (0.1%) | -- | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | B | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | Military | -- | 17 mm | 17 mm | |
| Mfr Part No A2F500M3G-PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | A2F500M3G | 80 MHz | MICROSEMI CORP | A2F500M3G-PQ208I | Microchip Technology | 3 | MCU - 22, FPGA - 66 | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Obsolete | 20 | 5.56 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | SmartFusion® | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 500000 | 512KB | 28 mm | 28 mm | |||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A2F500M3G | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-1FG256I | Glenair | 3 | MCU - 25, FPGA - 66 | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.22 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | * | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 500000 | 512KB | 17 mm | 17 mm | ||||||||||||||||||
| Mfr Part No A2F060M3E-TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-TQ144I | 3 | PLASTIC/EPOXY | LFQFP | 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 20 | 5.88 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G144 | 33 | Not Qualified | 1.5,1.8,2.5,3.3 V | 33 | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 100 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1FGG256I | 3 | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 30 | 5.82 | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-TQ144 | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 20 | 5.86 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G144 | 33 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 33 | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 20 mm | 20 mm |
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A2F200M3F-FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A2F500M3G-PQ208I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A2F500M3G-1FG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A2F060M3E-TQ144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A2F060M3E-1FGG256I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A2F060M3E-TQ144
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire