The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- HTS Code
- Ihs Manufacturer
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- Power Supplies
- Power Supplies:
1.5/3.3,1.8 V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Number of Pins | Contact Shape | Supplier Device Package | Number of Terminals | 1st Connector Mounting Type | 2nd Connector Mounting Type | 1st Connector Mounting Feature | 1st Contact Gender | 2nd Connector Mounting Feature | 2nd Contact Gender | Base Product Number | Brand | Cable Types | Case Code - in | Case Code - mm | Contact Finish Mating | Contact Length-Mating | Contact Materials | Factory Pack QuantityFactory Pack Quantity | Frequency-Max | Ihs Manufacturer | Insulation Materials | Manufacturer | Manufacturer Part Number | Mated Stacking Heights | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/O Lines | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Overall Impedance | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Temperature Coefficient / Code | Tradename | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Number of Positions | Terminal Finish | Color | Applications | Number of Rows | Additional Feature | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Insulation Height | Style | Number of Positions Loaded | Reach Compliance Code | Pitch - Mating | Base Part Number | Insulation Color | Pin Count | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Row Spacing - Mating | Contact Length - Post | Shrouding | Contact Finish - Post | Operating Supply Voltage | Overall Contact Length | Power Supplies | Temperature Grade | Propagation Delay | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Number of Positions/Contacts | 1st Connector | 2nd Connector | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Output Function | Number of Macro Cells | JTAG BST | Number of Logic Cells | Number of Dedicated Inputs | In-System Programmable | Product | Features | Product Category | Height | Length | Width | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating |
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 | Mfr Part No XC2C512-6FTG256C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | XILINX INC | Xilinx | XC2C512-6FTG256C | Glenair | 3 | 212 | 70 °C | Retail Package | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | Active | 40 | 5.67 | Yes | 1.9 V | 1.7 V | 1.8 V | * | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | Programmable Logic Devices | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 6 ns | 0 DEDICATED INPUTS, 212 I/O | 1.55 mm | FLASH PLD | MACROCELL | 512 | YES | YES | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C32-6VQG44C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1111 (2828 metric) | YES | 44 | ATC / KYOCERA AVX | 1111 | 2828 | 100 | XILINX INC | KYOCERA AVX | XC2C32-6VQG44C | + 125 C | - 55 C | 3 | 33 | 70 °C | PLASTIC/EPOXY | TQFP | 10 X 10 MM, 0.80 MM PITCH, VQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | 30 | 5.67 | Details | Yes | 1.9 V | 1.7 V | 1.8 V | P90 | 500 V | Waffle | 100B | 2 % | e3 | 3A991 | 90 PPM / C | High Q, Low ESR/ESL Porcelain Superchip Capacitor | Matte Tin (Sn) | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | 30 pF | Capacitors | CMOS | QUAD | GULL WING | 260 | 0.8 mm | unknown | 44 | SMD/SMT | S-PQFP-G44 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 6 ns | 1 DEDICATED INPUTS, 33 I/O | 1.2 mm | FLASH PLD | Silicon RF Capacitors / Thin Film | MACROCELL | 32 | YES | 1 | YES | RF/Microwave Multilayer Capacitors (MLC) | Silicon RF Capacitors / Thin Film | 2.59 mm | 2.79 mm | 2.79 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C32-3VQ44C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | Royalohm | 5000 | XILINX INC | Royalohm | XC2C32-3VQ44C | 3 | PCB Mount | 33 | 70 °C | PLASTIC/EPOXY | TQFP | 10 X 10 MM, 0.80 MM PITCH, VQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | 30 | 8.63 | No | 1.9 V | 1.7 V | 1.8 V | Reel | General Purpose Thick Film | e0 | Tin/Lead (Sn/Pb) | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | Resistors | Thick Film | QUAD | GULL WING | 225 | 0.8 mm | unknown | 44 | S-PQFP-G44 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 3 ns | 1 DEDICATED INPUTS, 33 I/O | 1.2 mm | FLASH PLD | Thick Film Resistors | MACROCELL | 32 | YES | 1 | YES | Thick Film Resistors - SMD | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C64-5VQG100C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | Amphenol Air LB Germany | 1 | XILINX INC | Amphenol | XC2C64-5VQG100C | 3 | 64 | 70 °C | PLASTIC/EPOXY | TFQFP | TFQFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | 40 | 5.21 | Details | Yes | 1.9 V | 1.7 V | 1.8 V | e3 | Matte Tin (Sn) | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | Circular Connectors | CMOS | QUAD | GULL WING | 260 | 0.5 mm | not_compliant | 100 | S-PQFP-G100 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 5 ns | 0 DEDICATED INPUTS, 64 I/O | 1.2 mm | FLASH PLD | Circular MIL Spec Connector | MACROCELL | 64 | YES | YES | Circular MIL Spec Connector | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C64-7CPG56I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | YES | 56 | Round Cable | XILINX INC | Xilinx | XC2C64-7CPG56I | HARTING | 3 | 45 | 85 °C | -40 °C | Bulk | PLASTIC/EPOXY | LFBGA | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | Active | 30 | 5.2 | Yes | 1.9 V | 1.7 V | 1.8 V | - | e1 | EAR99 | Plug to Plug | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | Yellow | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | Programmable Logic Devices | CMOS | BOTTOM | BALL | Shielded | 260 | 0.5 mm | Cat6a, Industrial Environments - IP20 | unknown | 56 | S-PBGA-B56 | Not Qualified | 1.5/3.3,1.8 V | INDUSTRIAL | 7.5 ns | 0 DEDICATED INPUTS, 45 I/O | 1.35 mm | FLASH PLD | 10p8c, 8p8c (RJ45, Ethernet) | MACROCELL | 64 | YES | YES | Molded Plugs | 1.97 (600.0mm) | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C32-4CP56C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole, Right Angle | YES | Square | 56 | 043650 | Tin | - | Brass Alloy | XILINX INC | Liquid Crystal Polymer (LCP), Glass Filled | Xilinx | XC2C32-4CP56C | - | Molex | 3 | 33 | 70 °C | Bulk | PLASTIC/EPOXY | LFBGA | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | Active | 30 | 5.22 | No | 1.9 V | 1.7 V | 1.8 V | 600VAC/DC | -40°C ~ 105°C | Micro-Fit 3.0 43650 | e0 | Solder | Header | 3 | Tin/Lead (Sn63Pb37) | General Purpose, Medical, Military, Telecommunications | 1 | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | Locking Ramp | Programmable Logic Devices | Male Pin | Varies by Wire Gauge | CMOS | BOTTOM | BALL | 240 | - | 0.5 mm | 0.172 (4.37mm) | Board to Cable/Wire | 1 | not_compliant | 0.118 (3.00mm) | Black | 56 | S-PBGA-B56 | Not Qualified | - | 0.125 (3.18mm) | Shrouded - 4 Wall | Tin | - | 1.5/3.3,1.8 V | COMMERCIAL | 4 ns | 1 DEDICATED INPUTS, 33 I/O | 1.35 mm | FLASH PLD | MACROCELL | 32 | YES | 1 | YES | Board Lock | 6 mm | 6 mm | 60.0µin (1.52µm) | 60.0µin (1.52µm) | UL94 V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C32-6PC44C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | Panel Mount | Free Hanging (In-Line) | Bulkhead - Front Side Nut | Female | - | Male | Q-2M0120 | RG-316 DB | 6 GHz | XILINX INC | Xilinx | XC2C32-6PC44C | Amphenol Custom Cable | 3 | 33 | 70 °C | 50 Ohms | Bag | PLASTIC/EPOXY | QCCJ | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | Active | 30 | 5.67 | No | 1.9 V | 1.7 V | 1.8 V | - | - | e0 | Tin/Lead (Sn85Pb15) | Copper | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | Programmable Logic Devices | CMOS | QUAD | J BEND | 225 | - | 1.27 mm | MCX to N-Type | not_compliant | 44 | S-PQCC-J44 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 6 ns | 1 DEDICATED INPUTS, 33 I/O | 4.572 mm | FLASH PLD | MCX Jack | N-Type Plug | MACROCELL | 32 | YES | 1 | YES | Shielded | 118.1 (3.0m) 9.8 | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP1M120F484C6 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BBGA, FCBGA | YES | 484-FBGA (23x23) | 484 | INTEL CORP | Intel Corporation | EP1M120F484C6 | 3 | 303 | 303 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.25 | No | 1.89 V | 1.71 V | 1.8 V | 0°C ~ 85°C (TJ) | Mercury | e0 | Obsolete | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.71 V ~ 1.89 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP1M120 | S-PBGA-B484 | 303 | Not Qualified | 1.5/3.3,1.8 V | OTHER | 303 | 0 DEDICATED INPUTS, 303 I/O | 2.1 mm | LOADABLE PLD | 4800 | 49152 | 120000 | 480 | MIXED | 4800 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C384-6FTG256C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | XILINX INC | Xilinx | XC2C384-6FTG256C | 3 | 212 | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 40 | 5.68 | Yes | 1.9 V | 1.7 V | 1.8 V | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | Programmable Logic Devices | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | 256 | S-PBGA-B256 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 6 ns | 0 DEDICATED INPUTS, 212 I/O | 1.55 mm | FLASH PLD | MACROCELL | 384 | YES | YES | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C64-7PC44I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | XILINX INC | Xilinx | XC2C64-7PC44I | 3 | 33 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 30 | 5.69 | No | 1.9 V | 1.7 V | 1.8 V | e0 | EAR99 | Tin/Lead (Sn85Pb15) | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | Programmable Logic Devices | CMOS | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 44 | S-PQCC-J44 | Not Qualified | 1.5/3.3,1.8 V | INDUSTRIAL | 7.5 ns | 0 DEDICATED INPUTS, 33 I/O | 4.572 mm | FLASH PLD | MACROCELL | 64 | YES | YES | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C32-4CP56I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | XILINX INC | Xilinx | XC2C32-4CP56I | 3 | 33 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.76 | No | 1.9 V | 1.7 V | 1.8 V | e0 | Tin/Lead (Sn63Pb37) | FAST ZERO POWER DESIGN TECHNOLOGY | 8542.39.00.01 | Programmable Logic Devices | CMOS | BOTTOM | BALL | 225 | 0.5 mm | not_compliant | 56 | S-PBGA-B56 | Not Qualified | 1.5/3.3,1.8 V | INDUSTRIAL | 4.5 ns | 1 DEDICATED INPUTS, 33 I/O | 1.35 mm | FLASH PLD | MACROCELL | 32 | YES | 1 | YES | 6 mm | 6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C128-4VQG100C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | Loctite | 6 | XILINX INC | Loctite | XC2C128-4VQG100C | 3 | 80 | 70 °C | PLASTIC/EPOXY | TFQFP | TFQFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | 40 | 5.69 | Yes | 1.9 V | 1.7 V | 1.8 V | Ablestik | 4.656163 oz | ABP 8064T | e3 | Matte Tin (Sn) | YES | 8542.39.00.01 | Supplies | CMOS | QUAD | GULL WING | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 4.5 ns | 0 DEDICATED INPUTS, 80 I/O | 1.2 mm | FLASH PLD | Chemicals | MACROCELL | 128 | YES | YES | Chemicals | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C64-7VQG44C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | Amphenol Positronic | 5 | XILINX INC | Positronic | XC2C64-7VQG44C | 3 | 33 | 70 °C | PLASTIC/EPOXY | TQFP | 10 X 10 MM, 0.80 MM PITCH, VQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | 30 | 5.19 | Yes | 1.9 V | 1.7 V | 1.8 V | e3 | EAR99 | Matte Tin (Sn) | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | D-Sub Connectors | CMOS | QUAD | GULL WING | 260 | 0.8 mm | unknown | 44 | S-PQFP-G44 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 7.5 ns | 0 DEDICATED INPUTS, 33 I/O | 1.2 mm | FLASH PLD | Mixed Contact D-Sub Connectors | MACROCELL | 64 | YES | YES | D-Sub Mixed Contact Connectors | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C32-6CPG56C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | Amphenol Positronic | 5 | XILINX INC | Positronic | XC2C32-6CPG56C | 3 | 33 | 70 °C | PLASTIC/EPOXY | LFBGA | 6 X 6 MM, 0.50 MM PITCH, CSP-56 | BGA56,10X10,20 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | 30 | 5.23 | Yes | 1.9 V | 1.7 V | 1.8 V | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | D-Sub Connectors | CMOS | BOTTOM | BALL | 260 | 0.5 mm | unknown | 56 | S-PBGA-B56 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 6 ns | 1 DEDICATED INPUTS, 33 I/O | 1.35 mm | FLASH PLD | Mixed Contact D-Sub Connectors | MACROCELL | 32 | YES | 1 | YES | D-Sub Mixed Contact Connectors | 6 mm | 6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C64-4VQ44C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | HARTING | 25 | XILINX INC | HARTING | XC2C64-4VQ44C | 3 | 33 | 70 °C | PLASTIC/EPOXY | TQFP | 10 X 10 MM, 0.80 MM PITCH, VQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | 30 | 5.44 | No | 1.9 V | 1.7 V | 1.8 V | e0 | Tin/Lead (Sn85Pb15) | FAST ZERO POWER DESIGN TECHNOLOGY | 8542.39.00.01 | Programmable Logic Devices | CMOS | QUAD | GULL WING | 225 | 0.8 mm | not_compliant | 44 | S-PQFP-G44 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 4 ns | 0 DEDICATED INPUTS, 33 I/O | 1.2 mm | FLASH PLD | MACROCELL | 64 | YES | YES | Harting | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP1M120F484C5 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BBGA, FCBGA | YES | 484-FBGA (23x23) | 484 | INTEL CORP | Intel Corporation | EP1M120F484C5 | 3 | 303 | 303 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.25 | No | 1.89 V | 1.71 V | 1.8 V | 0°C ~ 85°C (TJ) | Mercury | e0 | Obsolete | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.71 V ~ 1.89 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP1M120 | S-PBGA-B484 | 303 | Not Qualified | 1.5/3.3,1.8 V | OTHER | 303 | 0 DEDICATED INPUTS, 303 I/O | 2.1 mm | LOADABLE PLD | 4800 | 49152 | 120000 | 480 | MIXED | 4800 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP1M350F780I6 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | INTEL CORP | Intel Corporation | EP1M350F780I6 | 3 | 486 | 486 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.28 | No | 1.89 V | 1.71 V | 1.8 V | -40°C ~ 100°C (TJ) | Mercury | e0 | Obsolete | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.71 V ~ 1.89 V | BOTTOM | BALL | 220 | 1 mm | compliant | EP1M350 | S-PBGA-B780 | 486 | Not Qualified | 1.5/3.3,1.8 V | INDUSTRIAL | 486 | 0 DEDICATED INPUTS, 486 I/O | 3.5 mm | LOADABLE PLD | 14400 | 114688 | 350000 | 1440 | MIXED | 14400 | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EP1M120F484C7A | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BBGA, FCBGA | YES | 484-FBGA (23x23) | 484 | INTEL CORP | Intel Corporation | EP1M120F484C7A | 303 | 303 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.25 | No | 1.89 V | 1.71 V | 1.8 V | 0°C ~ 85°C (TJ) | Mercury | e0 | Obsolete | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.71 V ~ 1.89 V | BOTTOM | BALL | 220 | 1 mm | compliant | S-PBGA-B484 | 303 | Not Qualified | 1.5/3.3,1.8 V | OTHER | 303 | 0 DEDICATED INPUTS, 303 I/O | 2.1 mm | LOADABLE PLD | 4800 | 49152 | 120000 | 480 | MIXED | 4800 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C64-5PC44C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 44 | XILINX INC | Xilinx | XC2C64-5PC44C | Knowles Syfer | 3 | 33 | 70 °C | Tape & Reel (TR) | PLASTIC/EPOXY | QCCJ | 16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44 | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | Active | 30 | 5.69 | Non-Compliant | No | 1.9 V | 1.7 V | 1.8 V | * | e0 | Tin/Lead (Sn85Pb15) | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | Programmable Logic Devices | CMOS | QUAD | J BEND | 225 | 1.27 mm | not_compliant | 44 | S-PQCC-J44 | Not Qualified | 1.8 V | 1.5/3.3,1.8 V | COMMERCIAL | 5 ns | 0 DEDICATED INPUTS, 33 I/O | 4.572 mm | FLASH PLD | 4 | MACROCELL | 64 | YES | YES | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2C64-5VQ44I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | XILINX INC | Xilinx | XC2C64-5VQ44I | 3 | 33 | 85 °C | -40 °C | PLASTIC/EPOXY | TQFP | 12 X 12 MM, 0.80 MM PITCH, VQFP-44 | TQFP44,.47SQ,32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | 30 | 5.69 | No | 1.9 V | 1.7 V | 1.8 V | e0 | Tin/Lead (Sn85Pb15) | YES | 8542.39.00.01 | Programmable Logic Devices | CMOS | QUAD | GULL WING | 245 | 0.8 mm | not_compliant | 44 | S-PQFP-G44 | Not Qualified | 1.5/3.3,1.8 V | INDUSTRIAL | 5 ns | 0 DEDICATED INPUTS, 33 I/O | 1.2 mm | FLASH PLD | MACROCELL | 64 | YES | YES | 10 mm | 10 mm |
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XC2C512-6FTG256C
Xilinx
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XC2C32-6VQG44C
Xilinx
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XC2C32-3VQ44C
Xilinx
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XC2C64-5VQG100C
Xilinx
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XC2C64-7CPG56I
Xilinx
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XC2C32-4CP56C
Xilinx
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XC2C32-6PC44C
Xilinx
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EP1M120F484C6
ALTERA
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XC2C384-6FTG256C
Xilinx
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XC2C64-7PC44I
Xilinx
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XC2C32-4CP56I
Xilinx
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XC2C128-4VQG100C
Xilinx
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XC2C64-7VQG44C
Xilinx
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XC2C32-6CPG56C
Xilinx
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XC2C64-4VQ44C
Xilinx
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EP1M120F484C5
ALTERA
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EP1M350F780I6
ALTERA
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EP1M120F484C7A
ALTERA
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XC2C64-5PC44C
Xilinx
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XC2C64-5VQ44I
Xilinx
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