The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Power Supplies:
2.5,2.5/3.3 V
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Max Frequency | Screening Level | Speed Grade | Number of Transceivers | Number of Registers | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | Lead Free |
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![]() | Mfr Part No APA450-FG144 | Microchip Technology | Datasheet | 1848 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA450 | 180 MHz | 160 | MICROSEMI CORP | APA450-FG144 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 100 I/O | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 100 | 450000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 450000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-CQ208B | Microchip Technology | Datasheet | 718 |
| Min: 1 Mult: 1 | Surface Mount | CQFP-208 | YES | 208-CQFP (75x75) | 208 | APA300 | 180 MHz | 1 | MICROSEMI CORP | APA300-CQ208B | 5 MHz | + 125 C | Microchip Technology | - 55 C | Yes | SMD/SMT | 158 I/O | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.29 | N | No | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | 2.5 V | Actel | Military grade | -55°C ~ 125°C (TJ) | Bulk | APA300 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | FLAT | 225 | 0.5 mm | unknown | S-CQFP-F208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 158 | 300000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | MIL-STD-883 Class B | 8192 | 300000 | 29.21 mm | 29.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FG144I | Microchip Technology | Datasheet | 1906 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | APA150 | 180 MHz | 160 | MICROSEMI CORP | APA150-FG144I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 100 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | APA150 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | not_compliant | 180 MHz | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 4.5 kB | 100 | 150000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 150000 | 180 MHz | 6144 | 6144 | 150000 | 1.05 mm | 13 mm | 13 mm | No | Contains Lead | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-BG456I | Microchip Technology | Datasheet | 548 |
| Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | 290 | 8192 | APA300 | 180 MHz | 300000 | 24 | PROASICPLUS | MICROSEMI CORP | APA300-BG456I | 180 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 290 I/O | 300000 | 2.7(V) | 2.3(V) | 2.5(V) | -40C to 85C | 85C | -40C | INDUSTRIALC | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | BGA | Active | 0.22UM | Active | Yes | No | 30 | 5.24 | N | No | FPGA ProASICPLUS Family 300K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA Tray | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -40°C ~ 85°C (TA) | Tray | APA300 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 180(MHz) | 456 | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FG144A | Microchip Technology | Datasheet | 1882 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | APA150 | 160 | MICROSEMI CORP | APA150-FG144A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 100 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA150 | 125 °C | -40 °C | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 2.625 V | 2.375 V | 4.5 kB | 100 | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 150000 | 180 MHz | STD | 6144 | 6144 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-BG456I | Microchip Technology | Datasheet | 402 |
| Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA1000 | 180 MHz | 24 | MICROSEMI CORP | APA1000-BG456I | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 356 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | -40 to 85 °C | Tray | APA1000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | 456 | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 356 | 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | STD | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-BG456M | Microchip Technology | Datasheet | 627 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA300 | 180 MHz | 24 | MICROSEMI CORP | APA300-BG456M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 290 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -55°C ~ 125°C (TC) | Tray | APA300 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1.27 mm | unknown | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FGG256M | Microchip Technology | Datasheet | 612 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA300 | 180 MHz | 90 | MICROSEMI CORP | APA300-FGG256M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 186 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -55°C ~ 125°C (TC) | Tray | APA300 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 186 | 300000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-FG256 | Microchip Technology | Datasheet | 1982 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA150 | 180 MHz | 90 | MICROSEMI CORP | APA150-FG256 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 186 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA150 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 150000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 150000 | STD | 6144 | 150000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA1000-BG456M | Microchip Technology | Datasheet | 633 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA1000 | 180 MHz | 24 | MICROSEMI CORP | APA1000-BG456M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 356 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 1.54 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | -55°C ~ 125°C (TC) | Tray | APA1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | NOT SPECIFIED | 1.27 mm | unknown | S-PBGA-B456 | 356 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 356 | 1000000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 202752 | 1000000 | 56320 | 1000000 | 1.73 mm | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-PQG208I | Microchip Technology | Datasheet | 2035 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | APA450 | 180 MHz | 108 kbit | 108 kbit | 24 | MICROSEMI CORP | APA450-PQG208I | 180 MHz | 2.7 V | + 85 C | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 158 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | 110592 bit | ProASICPLUS | 2.5000 V | -40 to 85 °C | Tray | APA450 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 245 | 0.5 mm | compliant | 180 MHz | S-PQFP-G208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | 13.5 kB | 5 mA | 13.5 kB | 158 | 450000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | 180 MHz | STD | 12288 | 12288 | 450000 | 3.4 mm | 28 mm | 28 mm | No | Lead Free | |||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FGG144M | Microchip Technology | Datasheet | 639 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA300 | 180 MHz | 160 | MICROSEMI CORP | APA300-FGG144M | 180 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 100 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | -55°C ~ 125°C (TC) | Tray | APA300 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 100 | 300000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | 8192 | 300000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA075-FG144A | Microchip Technology | Datasheet | 2247 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA075 | 160 | MICROSEMI CORP | APA075-FG144A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 100 I/O | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA075 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 100 | FIELD PROGRAMMABLE GATE ARRAY | 27648 | 75000 | STD | 3072 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FG256 | Microchip Technology | Datasheet | 2229 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA450 | 180 MHz | 90 | MICROSEMI CORP | APA450-FG256 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 186 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA450 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 450000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 450000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-FGG256 | Microchip Technology | Datasheet | 2099 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | APA300 | 180 MHz | 90 | MICROSEMI CORP | APA300-FGG256 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 186 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 300000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA075-PQG208 | Microchip Technology | Datasheet | 61 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | APA075 | 180 MHz | 24 | MICROSEMI CORP | APA075-PQG208 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 158 I/O | 1000 LE | 70 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.29 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | 27648 bit | ProASICPLUS | 2.5000 V | 0 to 70 °C | Tray | APA075 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 158 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 5 mA | - | 158 | 75000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 27648 | 75000 | STD | - | 3072 | 75000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-FG144A | Microchip Technology | Datasheet | 685 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | APA450 | 160 | MICROSEMI CORP | APA450-FG144A | 180 MHz | + 125 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 100 I/O | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | 5.61 | N | No | This product may require additional documentation to export from the United States. | 2.625 V | 2.375 V | Actel | 0.014110 oz | -40°C ~ 125°C (TJ) | Tray | APA450 | 8542.39.00.01 | CMOS | 2.375V ~ 2.625V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B144 | 100 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | 100 | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA450-BGG456 | Microchip Technology | Datasheet | 1996 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA450 | 180 MHz | 24 | MICROSEMI CORP | APA450-BGG456 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 344 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | 0 to 70 °C | Tray | APA450 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1.27 mm | compliant | 456 | S-PBGA-B456 | 344 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 344 | 450000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 450000 | STD | 12288 | 450000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA300-BGG456 | Microchip Technology | Datasheet | 1656 | - | Min: 1 Mult: 1 | Surface Mount | BGA-456 | YES | 456-PBGA (35x35) | 456 | APA300 | 180 MHz | 24 | MICROSEMI CORP | APA300-BGG456 | 180 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 290 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA456,26X26,50 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 0°C ~ 70°C (TA) | Tray | APA300 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 245 | 1.27 mm | compliant | S-PBGA-B456 | 290 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 290 | 300000 GATES | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 73728 | 300000 | STD | 8192 | 300000 | 1.73 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA150-TQG100 | Microchip Technology | Datasheet | 49 | - | Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | APA150 | 180 MHz | 90 | MICROSEMI CORP | APA150-TQG100 | 180 MHz | 2.7 V | + 70 C | Microchip Technology | 2.3 V | 0 C | Yes | 3 | SMD/SMT | 66 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 1.58 | Details | Yes | 2.7 V | 2.3 V | 2.5 V | 36864 bit | ProASICPLUS | 2.5000 V | 0.023175 oz | 0 to 70 °C | Tray | APA150 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 66 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | COMMERCIAL | 5 mA | 66 | 150000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 150000 | STD | 6144 | 150000 | 1.4 mm | 14 mm | 14 mm |
APA450-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
229.291639
APA300-CQ208B
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
5,611.557691
APA150-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
298.918704
APA300-BG456I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
558.927672
APA150-FG144A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
231.796432
APA1000-BG456I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
3,536.283456
APA300-BG456M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA300-FGG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
634.538380
APA150-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
188.542629
APA1000-BG456M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA450-PQG208I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA300-FGG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
649.597023
APA075-FG144A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
200.302237
APA450-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
250.365896
APA300-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
385.824392
APA075-PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA450-FG144A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
793.244399
APA450-BGG456
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA300-BGG456
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
APA150-TQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
