The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- JESD-609 Code
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- Voltage - Supply
- Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No A42MX09-1PLG84 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | A42MX09 | 135 MHz | 16 | MICROSEMI CORP | A42MX09-1PLG84 | 247 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 72 I/O | 70 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.29 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.239083 oz | 0°C ~ 70°C (TA) | Tube | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 684 CLBS, 14000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 2.1 ns | 684 | 14000 | 3.68 mm | 29.31 mm | 29.31 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE1500-1FGG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 676-FBGA (27x27) | 676 | M1A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | M1A3PE1500-1FGG676 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 444 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600L-1FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 350 MHz | 60 | MICROSEMI CORP | M1A3P600L-1FG484 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 235 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | M1A3P600L | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AX250 | 763 MHz | 60 | MICROSEMI CORP | AX250-1FGG484 | 763 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 248 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | 0.84 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX09-2TQG176 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TQFP-176 | YES | 176-TQFP (24x24) | 176 | A42MX09 | 146 MHz | 40 | MICROSEMI CORP | A42MX09-2TQG176 | 269 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 104 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.3 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0°C ~ 70°C (TA) | Tray | A42MX09 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G176 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 684 CLBS, 14000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 1.8 ns | 684 | 14000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A54SX32 | 278 MHz | 90 | MICROSEMI CORP | A54SX32A-1FG256 | 278 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 203 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | 2.75 V | 2.25 V | 2.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | A54SX32A | e0 | TIN LEAD/TIN LEAD SILVER | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,2.5/5 V | COMMERCIAL | 203 | 2880 CLBS, 48000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No LFE3-70EA-6FN1156C | Lattice Semiconductor Corporation | Datasheet | 2106 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 1156-BBGA | 1156 | 490 | 0°C~85°C TJ | Tray | 2013 | ECP3 | e1 | Active | 3 (168 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | 30 | LFE3-70 | 490 | 1.2V | 570.6kB | 18mA | 552.5kB | FIELD PROGRAMMABLE GATE ARRAY | 67000 | 4526080 | 375MHz | 8375 | 0.379 ns | 1.75mm | 35mm | 35mm | No | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | A3PE600 | 90 | MICROSEMI CORP | A3PE600-1FG256 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 165 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE600 | e0 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 272 MHz | 1 | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||
| Mfr Part No A42MX24-FPQG160 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-160 | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | A42MX24 | 50.4 MHz | 24 | MICROSEMI CORP | A42MX24-FPQG160 | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 125 I/O | 70 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | SQUARE | FLATPACK | Active | Active | 40 | 5.26 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.196363 oz | 0°C ~ 70°C (TA) | Tray | A42MX24 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 5.25 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | 36000 | 912 | 1410 | 3.4 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-3PLG68I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | A40MX04 | 109 MHz | 19 | MICROSEMI CORP | A40MX04-3PLG68I | 188 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 57 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.29 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | 0.171777 oz | -40°C ~ 85°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 1.7 ns | 547 | 6000 | 3.68 mm | 24.23 mm | 24.23 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL600V5-FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V5-FG256 | 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | AGL600V5 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX02-1PLG68 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | A40MX02 | 92 MHz | 19 | MICROSEMI CORP | A40MX02-1PLG68 | 160 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 57 I/O | 295 LAB | 70 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.29 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.171777 oz | 0°C ~ 70°C (TA) | Tube | A40MX02 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2.3 ns | 295 | 3000 | 3.68 mm | 24.23 mm | 24.23 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX08A-1TQG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TQFP-144 | YES | 144-TQFP (20x20) | 144 | A54SX08 | 278 MHz | 60 | MICROSEMI CORP | A54SX08A-1TQG144 | 278 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 113 I/O | 70 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.25 | Details | Yes | 2.75 V | 2.25 V | 2.5 V | Actel | 0.046530 oz | 0°C ~ 70°C (TA) | Tray | A54SX08A | e3 | Matte Tin (Sn) | 8000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G144 | 113 | Not Qualified | 2.5 V | 2.5,3.3/5 V | COMMERCIAL | 113 | 768 CLBS, 12000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 12000 | 768 | 1.1 ns | 768 | 768 | 12000 | 1.4 mm | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS250-2FGG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS250 | 90 | MICROSEMI CORP | M1AFS250-2FGG256I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 114 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL250V5-CS196 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | CSP-196 | YES | 196-CSP (8x8) | 196 | AGL250 | 108 MHz | 348 | MICROSEMI CORP | AGL250V5-CS196 | 250 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 143 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0 to 70 °C | Tray | AGL250V5 | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | S-PBGA-B196 | Not Qualified | 1.5 V | OTHER | 20 uA | 6144 CLBS, 250000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6144 | 36864 | 250000 | STD | 6144 | 250000 | 0.7 mm | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AX250 | 763 MHz | 60 | MICROSEMI CORP | AX250-1FG484 | 763 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 248 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX250 | e0 | TIN LEAD | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 248 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | 0.84 ns | 2816 | 4224 | 250000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||
| Mfr Part No AFS250-2FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS250 | 90 | MICROSEMI CORP | AFS250-2FG256 | 1470.59 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 114 I/O | 3000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | AFS250 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1.47059 GHz | 2 | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||
| Mfr Part No A3P1000L-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000L-1FG256 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 70 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000L | e0 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-3PQG100 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-100 | YES | 100-PQFP (20x14) | 100 | A40MX04 | 109 MHz | 66 | MICROSEMI CORP | A40MX04-3PQG100 | 188 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 69 I/O | 70 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Active | Active | 40 | 5.3 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.062040 oz | 0°C ~ 70°C (TA) | Tray | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 245 | 0.65 mm | compliant | R-PQFP-G100 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 547 CLBS, 6000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 1.7 ns | 547 | 6000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060T-1FCSG325I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL060 | 176 | MICROSEMI CORP | M2GL060T-1FCSG325I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 200 I/O | 56520 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL060T | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 1.2 V | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 2 Transceiver |
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