The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Contact Finish - Post
- Contact Finish Mating
- Contact Finish Thickness - Mating
- Contact Finish Thickness - Post
- Contact Material - Mating
- Contact Material - Post
- Contact Resistance
- Current Rating
- Features
- Housing Material
- Mfr
- Series
- Series:
511
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Supplier Device Package | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Material - Post | Contact Finish Mating | Mfr | Number of I/Os | Package | Product Status | Operating Temperature | Packaging | Series | Part Status | Termination | Type | Voltage - Supply | Current Rating | Pitch - Mating | Contact Finish - Post | Contact Resistance | Number of Logic Elements/Cells | Total RAM Bits | Number of LABs/CLBs | Termination Post Length | Pitch - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCVU23P-1VSVA1365I | AMD | Datasheet | 504 | - | Min: 1 Mult: 1 | Through Hole | 1365-BFBGA, FCBGA | 1365-FCBGA (35x35) | Polyamide (PA46), Nylon 4/6, Glass Filled | 36 (1 x 36) | Phosphor Bronze | Phosphor Bronze | Tin | AMD | 364 | Tray | Active | -55°C ~ 105°C | Bulk | 511 | Active | Solder | SIP | 0.825V ~ 0.876V | 1A | 0.100 (2.54mm) | Tin | -- | 2252250 | 77909197 | 128700 | 0.150 (3.81mm) | 0.100 (2.54mm) | -- | 50.0µin (1.27µm) | 50.0µin (1.27µm) | UL94 V-0 |