The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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A3P060
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Temperature Grade | Operating Supply Current | Data Rate | Organization | Seated Height-Max | Programmable Logic Type | Total RAM Bits | Number of Gates | Speed Grade | Number of Transceivers | Number of CLBs | Number of Equivalent Gates | Height | Length | Width |
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 | Mfr Part No A3P060-VQG100I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VQFP-100 | 90 | 350 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 71 I/O | 700 LE | Details | 1.575 V | 1.425 V | 18432 bit | ProASIC3 | 0.017813 oz | Tray | A3P060 | 1.5 V | 15 mA | - | 60000 | - | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-VQG100 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VQFP-100 | 90 | 350 MHz | + 85 C | 0 C | Yes | SMD/SMT | 71 I/O | 700 LE | Details | 1.575 V | 1.425 V | 18432 bit | ProASIC3 | 0.017637 oz | Tray | A3P060 | 1.5 V | 2 mA | - | 60000 | - | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-FGG144I | Microchip Technology | Datasheet | 96 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | 1 | MICROSEMI CORP | A3P060-FGG144I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 96 I/O | - | 660 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.22 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 18432 bit | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | A3P060 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 15 mA | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | STD | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||
| Mfr Part No A3P060-FG144 | Microchip Technology | Datasheet | 146 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | 160 | MICROSEMI CORP | A3P060-FG144 | 350 MHz | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 96 I/O | - | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.52 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P060 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | STD | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||
| Mfr Part No A3P060-VQ100 | Microchip Technology | Datasheet | 285 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | 71 | 1536 | A3P060 | 350 MHz | 60000 | 90 | ProASIC®3 | MICROSEMI CORP | A3P060-VQ100 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 71 I/O | 60000 | 1.575(V) | 1.425(V) | 1.5(V) | 0C to 85C | 85C | 0C | Commercial | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | VQFP | Active | 130NM | Active | Yes | No | 30 | 1.49 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P060 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 231(MHz) | 100 | S-PQFP-G100 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | STD | 1536 | 60000 | 1 mm | 14 mm | 14 mm | ||||||||||||
| Mfr Part No A3P060-FG144I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-144 | 160 | 350 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 96 I/O | 700 LE | N | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | Tray | A3P060 | 1.5 V | - | 60000 | - | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-2FGG144I | Microchip Technology | Datasheet | 24 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | 160 | MICROSEMI CORP | A3P060-2FGG144I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 96 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P060 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 2 | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||
| Mfr Part No A3P060-2TQG144I | Microchip Technology | Datasheet | 23 | - | Min: 1 Mult: 1 | Surface Mount | TQFP-144 | YES | 144-TQFP (20x20) | 144 | A3P060 | 350 MHz | 60 | MICROSEMI CORP | A3P060-2TQG144I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 91 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, GREEN, TQFP-144 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.046530 oz | -40°C ~ 100°C (TJ) | Tray | A3P060 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G144 | Not Qualified | 1.5 V | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 2 | 1536 | 60000 | 1.4 mm | 20 mm | 20 mm | |||||||||||||||||||||||||||||
| Mfr Part No A3P060-1FG144 | Microchip Technology | Datasheet | 12 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | 160 | MICROSEMI CORP | A3P060-1FG144 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 96 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P060 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 1 | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||
| Mfr Part No A3P060-1VQ100 | Microchip Technology | Datasheet | 799 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | 71 | 1536 | A3P060 | 350 MHz | 60000 | 90 | ProASIC®3 | MICROSEMI CORP | A3P060-1VQ100 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 71 I/O | 60000 | 1.575(V) | 1.425(V) | 1.5(V) | 0C to 85C | 85C | 0C | Commercial | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | VQFP | Active | 130NM | Active | Yes | No | 30 | 5.22 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | A3P060 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | 272(MHz) | 100 | S-PQFP-G100 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 1 | 1536 | 60000 | 1 mm | 14 mm | 14 mm | ||||||||||||
| Mfr Part No A3P060-1FGG144I | Microchip Technology | Datasheet | 36 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | A3P060 | 160 | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | SMD/SMT | 96 I/O | Tray | Active | Details | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P060 | 1.425V ~ 1.575V | 1.5 V | 18432 | 60000 | 1 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-TQ144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | TQFP-144 | YES | 144-TQFP (20x20) | 144 | A3P060 | 350 MHz | 60 | MICROSEMI CORP | A3P060-TQ144I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 91 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.046530 oz | -40°C ~ 100°C (TJ) | Tray | A3P060 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G144 | Not Qualified | 1.5 V | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 1536 | 60000 | 1.4 mm | 20 mm | 20 mm | ||||||||||||||||||||||||||||||
| Mfr Part No A3P060-1VQG100I | Microchip Technology | Datasheet | 2148 | - | Min: 1 Mult: 1 | Surface Mount | VQFP-100 | YES | 100-VQFP (14x14) | 100 | A3P060 | 350 MHz | 90 | MICROSEMI CORP | A3P060-1VQG100I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 71 I/O | - | 660 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | 14 X 14 MM, 1 MM HEIGHT, 0.50 MM PITCH, GREEN, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.23 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 18432 bit | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | A3P060 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 15 mA | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 1 | 1536 | 60000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||
| Mfr Part No A3P060-1VQG100 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VQFP-100 | 90 | 350 MHz | + 85 C | 0 C | Yes | SMD/SMT | 71 I/O | 700 LE | Details | 1.575 V | 1.425 V | 18432 bit | ProASIC3 | 0.289093 oz | Tray | A3P060 | 1.5 V | 2 mA | - | 60000 | - | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-FGG144 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-144 | 160 | 350 MHz | + 85 C | 0 C | Yes | SMD/SMT | 96 I/O | 700 LE | Details | 1.575 V | 1.425 V | 18432 bit | ProASIC3 | Tray | A3P060 | 1.5 V | 2 mA | - | 60000 | - | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-1FGG144 | Microchip Technology | Datasheet | 28 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 144-FPBGA (13x13) | A3P060 | 160 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 96 I/O | Tray | Active | Details | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P060 | 1.425V ~ 1.575V | 1.5 V | 18432 | 60000 | 1 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-2VQ100 | Microchip Technology | Datasheet | 39 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3P060 | 350 MHz | 90 | MICROSEMI CORP | A3P060-2VQ100 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 71 I/O | 85 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | A3P060 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | COMMERCIAL | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 2 | 1536 | 60000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||
| Mfr Part No A3P060-2TQG144 | Microchip Technology | Datasheet | 15 | - | Min: 1 Mult: 1 | Surface Mount | TQFP-144 | 144-TQFP (20x20) | A3P060 | 60 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 91 I/O | Tray | Active | Details | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.046530 oz | 0 to 70 °C | Tray | A3P060 | 1.425V ~ 1.575V | 1.5 V | 18432 | 60000 | 2 | 1.4 mm | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P060-1FG144I | Microchip Technology | Datasheet | 39 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P060 | 350 MHz | 160 | MICROSEMI CORP | A3P060-1FG144I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 96 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P060 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 1 | 1536 | 60000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||
| Mfr Part No A3P060-1VQ100I | Microchip Technology | Datasheet | 28 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A3P060 | 350 MHz | 90 | MICROSEMI CORP | A3P060-1VQ100I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 71 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.23 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | -40 to 85 °C | Tray | A3P060 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 1.5 V | INDUSTRIAL | 1536 CLBS, 60000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 18432 | 60000 | 1 | 1536 | 60000 | 1 mm | 14 mm | 14 mm |
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A3P060-VQG100I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-VQG100
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-VQ100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-FG144I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-2FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
29.114404
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A3P060-2TQG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1VQ100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-TQ144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1VQG100I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1VQG100
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-FGG144
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-2VQ100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-2TQG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P060-1VQ100I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire