The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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A3P1000
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Total RAM Bits | Number of Gates | Speed Grade | Number of Transceivers | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Height | Length | Width |
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![]() | Mfr Part No A3P1000-FG144M | Microchip Technology | Datasheet | 2169 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-FG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 1.48 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | unknown | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | - | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | - | 24576 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||
![]() | Mfr Part No A3P1000-FGG484M | Microchip Technology | Datasheet | 2011 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | 484-FPBGA (23x23) | A3P1000 | 60 | Microchip Technology | Yes | 300 | 11000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 18 kB | 147456 | 1e+06 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-FG256M | Microchip Technology | Datasheet | 1696 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FPBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-2FGG484M | Microchip Technology | Datasheet | 1952 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-484 | 484-FPBGA (23x23) | A3P1000 | 144 kbit | 144 kbit | 60 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 300 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FGG256M | Microchip Technology | Datasheet | 2191 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | 256-FBGA (17x17) | A3P1000 | 144 kbit | 144 kbit | 90 | 350 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 177 I/O | - | 11000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 1.5 V | 1.5 V | 1 kbit | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 1.14V ~ 1.575V | 1.5 V | 8 mA | 700 Mb/s | 147456 | 1000000 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1PQG208I | Microchip | Datasheet | 1711 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A3P1000 | Microchip Technology / Atmel | 350 MHz | 24 | MICROSEMI CORP | Microchip | A3P1000-1PQG208I | 272 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 154 I/O | - | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 147456 bit | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | A3P1000 | e3 | Matte Tin (Sn) | 8542.39.00.01 | Programmable Logic ICs | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | INDUSTRIAL | 75 mA | - | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 147456 | 1000000 | 1 | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||
![]() | Mfr Part No A3P1000-PQG208 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | PQFP-208 | 24 | 350 MHz | + 85 C | 0 C | Yes | SMD/SMT | 154 I/O | 11000 LE | Details | 1.575 V | 1.425 V | 147456 bit | ProASIC3 | 2 oz | Tray | A3P1000 | 1.5 V | 8 mA | - | 1000000 | - | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FGG484M | Microchip Technology | Datasheet | 2345 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | 484-FPBGA (23x23) | A3P1000 | 60 | Microchip Technology | Yes | 300 | 11000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | 125 °C | -55 °C | 1.425V ~ 1.575V | 18 kB | 147456 | 1e+06 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FGG256 | Microchip Technology | Datasheet | 2155 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-1FGG256 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FGG256I | Microchip Technology | Datasheet | 8000 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-1FGG256I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FGG144I | Microchip Technology | Datasheet | 708 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-1FGG144I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-2FGG144 | Microchip Technology | Datasheet | 2031 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-2FGG144 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-2FGG144I | Microchip Technology | Datasheet | 2048 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-2FGG144I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-FG484 | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3P1000 | 350 MHz | 60 | MICROSEMI CORP | A3P1000-FG484 | 231 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-FG256 | Microchip Technology | Datasheet | 2148 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-FG256 | 350 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | - | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.47 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-2FGG256 | Microchip Technology | Datasheet | 2068 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000-2FGG256 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FG484 | Microchip Technology | Datasheet | 2146 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3P1000 | 350 MHz | 60 | MICROSEMI CORP | A3P1000-1FG484 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1FGG144M | Microchip Technology | Datasheet | 1788 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-1FGG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||
![]() | Mfr Part No A3P1000-1PQG208M | Microchip Technology | Datasheet | 1653 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A3P1000 | 350 MHz | 24 | MICROSEMI CORP | A3P1000-1PQG208M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 154 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 1.36 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | |||||||||||||||||||||||
![]() | Mfr Part No A3P1000-FGG144 | Microchip Technology | Datasheet | 2324 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-FGG144 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 13 mm | 13 mm |
A3P1000-FG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-FG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-2FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
426.825534
A3P1000-1FGG256M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1PQG208I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-PQG208
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1FGG484M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-2FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-2FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
148.018265
A3P1000-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-2FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1FGG144M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-1PQG208M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
A3P1000-FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
