The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Series:
A3PE1500
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Number of Registers | Number of CLBs | Max Junction Temperature (Tj) | Number of Logic Cells | Ambient Temperature Range High | Number of Equivalent Gates | Product Category | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No A3PE1500-1FGG484I | Microchip Technology | Datasheet | 2192 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | 60 | MICROSEMI CORP | A3PE1500-1FGG484I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 280 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 272 MHz | 1 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||
| Mfr Part No A3PE1500-1PQG208I | Microchip Technology | Datasheet | 1940 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | A3PE1500 | 350 MHz | 24 | MICROSEMI CORP | A3PE1500-1PQG208I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 147 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.6 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | A3PE1500 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 147 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 272 MHz | 1 | 38400 | 38400 | 38400 | 1500000 | 3.4 mm | 28 mm | 28 mm | No | ||||||||||||||||||||||
| Mfr Part No A3PE1500-2PQG208I | Microchip Technology | Datasheet | 1835 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | A3PE1500 | 350 MHz | 24 | MICROSEMI CORP | A3PE1500-2PQG208I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 147 I/O | 16000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.6 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 1.508632 oz | -40 to 85 °C | Tray | A3PE1500 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | 310 MHz | S-PQFP-G208 | 147 | Not Qualified | 1.425 V to 1.575 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | - | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 310 MHz | 2 | - | 38400 | 38400 | 38400 | 1500000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||
| Mfr Part No A3PE1500-FG484 | Microchip Technology | Datasheet | 1652 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | 60 | MICROSEMI CORP | A3PE1500-FG484 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 280 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE1500 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||
| Mfr Part No A3PE1500-FG676I | Microchip Technology | Datasheet | 1787 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Tin | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | A3PE1500-FG676I | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 444 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | 8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/8542310000/85 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||
| Mfr Part No A3PE1500-FGG484 | Microchip Technology | Datasheet | 2309 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 484 | A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | A3PE1500-FGG484 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 280 I/O | - | 16500 LE | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | 276480 bit | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 12 mA | 33.8 kB | 700 Mb/s | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 16500 | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | Lead Free | |||||||||||||
| Mfr Part No A3PE1500-2FGG484 | Microchip Technology | Datasheet | 1604 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | 60 | MICROSEMI CORP | A3PE1500-2FGG484 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 280 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 310 MHz | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||
| Mfr Part No A3PE1500-2FG676 | Microchip Technology | Datasheet | 1756 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | A3PE1500 | 40 | MICROSEMI CORP | A3PE1500-2FG676 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 444 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-676 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE1500 | e0 | TIN LEAD | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B676 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 310 MHz | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | No | ||||||||||||||||||||||||||||
| Mfr Part No A3PE1500-FGG676 | Microchip Technology | Datasheet | 1632 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | A3PE1500-FGG676 | 231 MHz | 1.575 V | + 70 C | FLASH | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 444 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 350 MHz | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 128 B | 33.8 kB | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 85 °C | 38400 | 70 °C | 1500000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||
| Mfr Part No A3PE1500-FGG676I | Microchip Technology | Datasheet | 1639 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | A3PE1500 | 350 MHz | 40 | MICROSEMI CORP | A3PE1500-FGG676I | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 444 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 444 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 444 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 231 MHz | STD | 38400 | 38400 | 38400 | 1500000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||
| Mfr Part No A3PE1500-PQG208 | Microchip | Datasheet | 2042 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | A3PE1500 | Microchip Technology / Atmel | 350 MHz | 24 | MICROSEMI CORP | A3PE1500-PQG208 | 350 MHz | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 147 I/O | 16000 LE | 70 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 2.05 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 276480 bit | ProASIC3 | 0.225753 oz | 0°C ~ 85°C (TJ) | Tray | A3PE1500 | e3 | Matte Tin (Sn) | 70 °C | 0 °C | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | 231 MHz | S-PQFP-G208 | 147 | Not Qualified | 1.425 V to 1.575 V | 1.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 33.8 kB | 12 mA | 33.8 kB | - | 147 | 38400 CLBS, 1500000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 16500 | FPGA - Field Programmable Gate Array | 276480 | 1500000 | 231 MHz | STD | - | 38400 | 38400 | 38400 | 1500000 | FPGA - Field Programmable Gate Array | 3.4 mm | 28 mm | 28 mm | No | Lead Free |
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A3PE1500-1FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
371.379883
-
A3PE1500-1PQG208I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE1500-2PQG208I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE1500-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE1500-FG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
243.221191
-
A3PE1500-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE1500-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE1500-2FG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3PE1500-FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
A3PE1500-FGG676I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
364.324671
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A3PE1500-PQG208
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire