The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- Factory Pack QuantityFactory Pack Quantity
- Height
- Length
- Maximum Operating Frequency
- Maximum Operating Temperature
- Minimum Operating Temperature
- Moisture Sensitive
- Mounting Styles
- Number of Gates
- Number of I/Os
- Package / Case
- Series
- Series:
AGL600V2
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Capacitance Tolerance | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | HTS Code | Capacitance | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Qualification Status | Operating Supply Voltage | Temperature Grade | Operating Supply Current | Data Rate | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Speed Grade | Number of Transceivers | Number of CLBs | Number of Equivalent Gates | Product Category | Product Length | Product Width | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No AGL600V2-FGG256 | Microchip Technology | Datasheet | 2015 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V2-FGG256 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | - | 6500 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.46 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | 110592 bit | IGLOOe | 1.2, 1.5 V | 0 to 70 °C | Tray | AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||
![]() | Mfr Part No AGL600V2-FGG144I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-144 | 160 | 526.32 MHz, 892.86 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 97 I/O | 7000 LE | Details | 1.575 V | 1.14 V | IGLOOe | 0.014110 oz | Tray | AGL600V2 | 1.2 V to 1.5 V | - | 600000 | - | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGL600V2-FGG256I | Microchip Technology | Datasheet | 2070 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V2-FGG256I | 526.32 MHz, 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 7000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 1.42 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | - | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | - | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||
![]() | Mfr Part No AGL600V2-FGG144 | Microchip Technology | Datasheet | 219 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | AGL600 | 108 MHz | 160 | MICROSEMI CORP | AGL600V2-FGG144 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.42 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | 0 to 70 °C | Tray | AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.2 V to 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||
![]() | Mfr Part No AGL600V2-CS281 | Microchip Technology | Datasheet | 2110 | - | Min: 1 Mult: 1 | Surface Mount | CSP | YES | 281-CSP (10x10) | 281 | AGL600 | 108 MHz | 184 | MICROSEMI CORP | AGL600V2-CS281 | 250 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 215 I/O | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | AGL600V2 | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | S-PBGA-B281 | Not Qualified | 1.2 V to 1.5 V | OTHER | 30 uA | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 0.71 mm | 10 mm | 10 mm | |||||||||||||||||||||||
![]() | Mfr Part No AGL600V2-FG256 | Microchip Technology | Datasheet | 1846 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V2-FG256 | 526.32 MHz, 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AGL600V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||
![]() | Mfr Part No AGL600V2-FG256I | Microchip Technology | Datasheet | 2315 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | AGL600 | 108 MHz | 90 | MICROSEMI CORP | AGL600V2-FG256I | 526.32 MHz, 892.86 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AGL600V2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||
![]() | Mfr Part No AGL600V2-FG144 | Microchip Technology | Datasheet | 2277 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | AGL600 | 108 MHz | 160 | MICROSEMI CORP | AGL600V2-FG144 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | 0 to 70 °C | Tray | AGL600V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | 1.2 V to 1.5 V | OTHER | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||
![]() | Mfr Part No AGL600V2-FG144I | Microchip Technology | Datasheet | 1832 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | AGL600 | 108 MHz | 160 | MICROSEMI CORP | AGL600V2-FG144I | 526.32 MHz, 892.86 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 13824 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | AGL600V2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||
![]() | Mfr Part No AGL600V2-FGG144I | Microchip | Datasheet | 18 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | AGL600 | Microchip Technology / Atmel | 0.1pF | 108 MHz | 160 | MICROSEMI CORP | Microchip | AGL600V2-FGG144I | 526.32 MHz, 892.86 MHz | 1.575 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 7000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.25 | Details | Yes | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | -40 to 85 °C | Tray | AGL600V2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.5 pF | Programmable Logic ICs | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.2 V to 1.5 V | INDUSTRIAL | - | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | FPGA - Field Programmable Gate Array | 110592 | 600000 | STD | - | 13824 | 600000 | FPGA - Field Programmable Gate Array | 1.6 mm | 1.52 x 0.76 x 0.91 mm | 1.05 mm | 13 mm | 13 mm |
AGL600V2-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
156.444808
AGL600V2-FGG144I
Atmel (Microchip Technology)
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGL600V2-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
126.625048
AGL600V2-FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
101.280105
AGL600V2-CS281
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
AGL600V2-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
123.908722
AGL600V2-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
140.392499
AGL600V2-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
137.972179
AGL600V2-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
154.035183
AGL600V2-FGG144I
Microchip
Package:Embedded - FPGAs (Field Programmable Gate Array)
103.481513
