The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Backset Spacing
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AMPLIMITE HD-20
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | Shell Material, Finish | Contact Materials | Ihs Manufacturer | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Number of Positions | Terminal Finish | Color | Number of Rows | HTS Code | Subcategory | Contact Type | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Contact Finish | JESD-30 Code | Number of Outputs | Qualification Status | Power Supplies | Wire Gauge | Temperature Grade | Flange Feature | Connector Style | Contact Form | Shell Size, Connector Layout | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Backset Spacing | Output Function | Number of Logic Cells | Number of Dedicated Inputs | Features | Length | Width | Contact Finish Thickness | Material Flammability Rating |
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![]() | Mfr Part No EPF10K250EGC599-3 | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole, Right Angle | 599-BPGA | NO | 599-PGA (62.5x62.5) | -- | 599 | Steel, Tin Plated | Brass | INTEL CORP | -- | Intel Corporation | EPF10K250EGC599-3 | 1 | 470 | 70 °C | CERAMIC, METAL-SEALED COFIRED | HIPGA | HIPGA, SPGA599,47X47 | SPGA599,47X47 | SQUARE | GRID ARRAY, HEAT SINK/SLUG, INTERSTITIAL PITCH | Obsolete | NOT SPECIFIED | 5.77 | Non-Compliant | No | 2.7 V | 2.3 V | 2.5 V | 125V | -55°C ~ 105°C | Tray | AMPLIMITE HD-20 | e0 | Obsolete | -- | Solder | Plug, Male Pins | 15 | TIN LEAD | Black | 2 | 8542.39.00.01 | Field Programmable Gate Arrays | Signal | CMOS | PERPENDICULAR | PIN/PEG | 220 | -- | 2.54 mm | compliant | 6A | Gold | S-CPGA-P599 | 470 | Not Qualified | 2.5,2.5/3.3 V | -- | COMMERCIAL | Housing/Shell (Unthreaded) | D-Sub | -- | 2 (DA, A) | 470 | 4 DEDICATED INPUTS, 470 I/O | 5.08 mm | LOADABLE PLD | 0.318 (8.08mm) | MIXED | 12160 | 4 | Board Lock, Ground Strap, Grounding Indents | 62.484 mm | 62.484 mm | -- | UL94 V-0 |

